MPX2100DP vs MPX2010DP Comparaison
Comparaison détaillée côte à côte de MPX2100DP par NXP Semiconductors et MPX2010DP par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | MPX2100DP | MPX2010DP |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Pressure Sensors | Pressure Sensors |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $5,95 | $8,50 |
| Pressure Type | Differential | — |
| Operating Pressure Range | 0 kPa to 100 kPa (0 to 14.5 psi) | — |
| Maximum Overload Pressure | [DATA_NEEDED: maximum overload pressure] | — |
| Full-Scale Span (Typical) | 40 mV (at 10 V excitation) | — |
| Zero Pressure Offset | [DATA_NEEDED: zero pressure offset] | 0 mV nominally (±1.0 mV max) |
| Linearity | 1% typical | ±0.05% (typ) |
| Tension d'alimentation | 10 V DC typical | 10 V DC typical (max 16 V) |
| Courant d'alimentation | [DATA_NEEDED: supply current] | — |
| Type de sortie | Analog mV (Wheatstone Bridge) | Analog voltage, Wheatstone bridge (mV level) |
| Température de fonctionnement | 0C to +85C (compensated) | -40 °C to +125 °C |
| Storage Temperature | [DATA_NEEDED: storage temperature] | — |
| Port Configuration | Dual port, axial tube, 4.93 mm (0.19 in) | Dual ports (differential), 0.19 inch / 4.93 mm tubes |
| Boîtier / Format | 4-SIP Module (Case 344C-01) | — |
| Type de montage | Through-Hole | — |
| Technology | Silicon piezoresistive, on-chip temperature compensation | Piezoresistive (silicon strain gauge bridge) |
| Statut RoHS | Compliant | Compliant |
| Niveau MSL | [DATA_NEEDED: MSL rating] | — |
| Type de capteur | — | Differential Pressure Sensor |
| Pressure Range | — | 0 to 10 kPa (0 to 1.45 PSI) |
| Typical Full-Scale Span | — | 25 mV at 10 V excitation |
| Temperature Compensation | — | 0 °C to +85 °C (on-chip) |
| Response Time | — | 1.0 ms (typical) |
| Maximum Overpressure | — | 75 kPa |
| Burst Pressure | — | 200 kPa |
| Package / Mounting | — | 4-SIP Module (through-hole with axial tubes) |
| Media Compatibility | — | Dry air or non-corrosive gas |