MSC8156ESAG1000B vs MSC8144ETVT800A Comparación
Comparación detallada lado a lado de MSC8156ESAG1000B por NXP Semiconductors y MSC8144ETVT800A por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MSC8156ESAG1000B - 6x SC3850 1GHz DSP SoC | NXP Semiconductors
MSC8156ESAG1000B ✗ Fin de vidaNXP Semiconductors
MSC8144ETVT800A - SC3400 Core DSP, 800MHz, 783-FCBGA | NXP
MSC8144ETVT800A ObsoleteComparación de especificaciones
| Parámetro | MSC8156ESAG1000B | MSC8144ETVT800A |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | DSP | DSP |
| Estado del ciclo de vida | Fin de vida | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $112,00 | $195,50 |
| DSP Cores | 6x SC3850 StarCore cores | — |
| Core Clock Frequency | 1 GHz per core | — |
| Aggregate Performance | [DATA_NEEDED: aggregate MMACS rating] | — |
| Process Technology | 45 nm CMOS | — |
| Hardware Accelerator | MAPLE-B baseband accelerator (turbo decode) | — |
| Memory Controller | 64-bit DDR2/DDR3, up to 800 MT/s | — |
| SerDes Lanes | 2 lanes, SRIO or PCIe (selectable) | — |
| Ethernet | 1x Gigabit Ethernet MAC | — |
| Packet Engine | QUICC Engine subsystem | — |
| Security Engine | SEC 4.0 (Cryptographic accelerator) | — |
| Encapsulado | 783-ball FCBGA (29x29 mm) | 783-FCBGA (29x29 mm) |
| Temperatura de funcionamiento | 0C to +105C | -40C to +105C |
| Tensión de alimentación | [DATA_NEEDED: core and I/O rail voltages] | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Estado RoHS | [DATA_NEEDED: RoHS compliance] | [DATA_NEEDED: RoHS status not in web data] |
| Estado del ciclo de vida | End of Life (per NXP PCN) | — |
| Core Architecture | — | SC3400 StarCore (4-core) |
| Number of Cores | — | 4 |
| Core Clock Rate | — | 800 MHz |
| On-Chip RAM | — | 10.5 MB |
| Non-Volatile Memory | — | External (NOR/NAND boot ROM) |
| Core Voltage | — | 1.00 V |
| I/O Voltage | — | 3.30 V |
| Operating Temperature Grade | — | Extended Industrial |
| Terminal Form | — | Ball |
| Number of Terminals | — | 783 |
| Package Code | — | BGA / FCBGA |
| Package Shape | — | Square |
| Interfaces | — | Ethernet (UTOPIA), I2C, SPI, TDM, UART |
| Technology | — | High-performance multi-core DSP, SIMD |