MSC8156ESAG1000B vs MSC8144ETVT800A Vergleich
Detaillierter Direktvergleich von MSC8156ESAG1000B von NXP Semiconductors und MSC8144ETVT800A von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MSC8156ESAG1000B - 6x SC3850 1GHz DSP SoC | NXP Semiconductors
MSC8156ESAG1000B ✗ AbgekündigtNXP Semiconductors
MSC8144ETVT800A - SC3400 Core DSP, 800MHz, 783-FCBGA | NXP
MSC8144ETVT800A ObsoleteSpezifikationsvergleich
| Parameter | MSC8156ESAG1000B | MSC8144ETVT800A |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | DSP | DSP |
| Lebenszyklusstatus | Ende des Lebenszyklus | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $112,00 | $195,50 |
| DSP Cores | 6x SC3850 StarCore cores | — |
| Core Clock Frequency | 1 GHz per core | — |
| Aggregate Performance | [DATA_NEEDED: aggregate MMACS rating] | — |
| Process Technology | 45 nm CMOS | — |
| Hardware Accelerator | MAPLE-B baseband accelerator (turbo decode) | — |
| Memory Controller | 64-bit DDR2/DDR3, up to 800 MT/s | — |
| SerDes Lanes | 2 lanes, SRIO or PCIe (selectable) | — |
| Ethernet | 1x Gigabit Ethernet MAC | — |
| Packet Engine | QUICC Engine subsystem | — |
| Security Engine | SEC 4.0 (Cryptographic accelerator) | — |
| Gehäuse | 783-ball FCBGA (29x29 mm) | 783-FCBGA (29x29 mm) |
| Betriebstemperatur | 0C to +105C | -40C to +105C |
| Versorgungsspannung | [DATA_NEEDED: core and I/O rail voltages] | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| RoHS-Status | [DATA_NEEDED: RoHS compliance] | [DATA_NEEDED: RoHS status not in web data] |
| Lebenszyklusstatus | End of Life (per NXP PCN) | — |
| Core Architecture | — | SC3400 StarCore (4-core) |
| Number of Cores | — | 4 |
| Core Clock Rate | — | 800 MHz |
| On-Chip RAM | — | 10.5 MB |
| Non-Volatile Memory | — | External (NOR/NAND boot ROM) |
| Core Voltage | — | 1.00 V |
| I/O Voltage | — | 3.30 V |
| Operating Temperature Grade | — | Extended Industrial |
| Terminal Form | — | Ball |
| Number of Terminals | — | 783 |
| Package Code | — | BGA / FCBGA |
| Package Shape | — | Square |
| Interfaces | — | Ethernet (UTOPIA), I2C, SPI, TDM, UART |
| Technology | — | High-performance multi-core DSP, SIMD |