MSC8157TAG1000A - 6-Core SC3850 DSP, 1GHz, MAPLE-B2 | NXP
N.º de pieza: MSC8157TAG1000A ⚠ Última compra| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $255 | $2.550,00 |
| 100 | $220 | $22.000,00 |
| 500 | $195 | $97.500,00 |
| 1.000 | $178 | $178.000,00 |
MSC8157TAG1000A Descripción general
A digital signal processor (DSP) is a specialized microprocessor optimized for numeric-heavy, real-time signal-processing workloads such as baseband demodulation, audio/voice codecs, radar pulse processing, and video transforms. Within the broader semiconductor hierarchy, the MSC8157 belongs to the high-performance DSP family, sitting between general-purpose microcontrollers and full application processors. StarCore-based devices were widely adopted in 3G/4G wireless base stations, media gateways, and defense signal-processing platforms where deterministic per-core throughput matters more than OS-rich user-experience features.
Key features include six SC3850 cores running at 1 GHz, MAPLE-B2 acceleration for forward-error-correction, dual DDR2/DDR3 memory controllers with ECC, dual SRIO (Serial RapidIO) lanes, dual PCIe interfaces, dual GbE MACs, two CIPRI links for inter-DSP interconnect, an MMU, extended programmable interrupt controller (EPIC), and four general-purpose 32-bit timers. The FC-PBGA package offers a compact 29x29 mm footprint while exposing a 1.0 mm ball pitch suitable for high-density multi-layer PCB designs.
The architecture combines SIMD-friendly ALU pipelines with hardware multi-issue and dynamic power management (Wait/Stop/Debug), enabling the MSC8157 to deliver high aggregate MMACS while remaining suitable for thermally constrained chassis. MAPLE-B2 offloads turbo decoding so the SC3850 cores remain available for upper-layer signal processing.
Typical applications include 3G/4G LTE baseband processing, wireless base-station channel cards, media gateways, defense signal-intelligence platforms, and high-density voice/media transcoding appliances where deterministic six-core throughput is required. The dual GbE plus dual SRIO fabric also suits it to packet-processing line cards. NXP product pages flag the part with end-of-life documentation.
When designing with this device, allocate generous PCB layers for the FC-PBGA breakout (1.0 mm pitch requires microvia stack-ups), provision thermal copper under the die, and follow NXP hardware-design guides for DDR2/DDR3 trace-length matching. Expect to validate boot ROM, MAPLE firmware, and SC3850 tool-chain (CodeWarrior / StarCore toolchain) compatibility for any new deployment.
Alternativas directas para MSC8157TAG1000A — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MSC8157TAG1000A (mismo factor de forma y huella) — difiere en Package, Mounting Type, Operating Temperature, Core Clock Frequency, RoHS Status.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MSC8156ESAG1000B
✅ Sustitución directa✓ En stock
$112 / unidad
Ver hoja de datos →MSC8156HAG1000B
✅ Sustitución directa✓ En stock
$198.75 / unidad
Ver hoja de datos →MSC8251SVT1000B
✅ Sustitución directa✓ En stock
$65 / unidad
Ver hoja de datos →MSC8157TAG1000A Especificaciones
| Device Type | Six-core Digital Signal Processor (DSP) |
| DSP Architecture | StarCore SC3850 (6x cores) |
| Core Frequency | 1 GHz per core |
| L1 Instruction Cache | 32 KB per core |
| L1 Data Cache | 32 KB per core |
| Unified L2 Cache | 512 KB (configurable as M2 in 64 KB increments) |
| Accelerator | MAPLE-B2 baseband accelerator |
| Memory Controller | Dual-channel DDR2/DDR3 with ECC |
| High-Speed Serial I/O | 2x SRIO, 2x PCIe, 2x GbE, 2x CIPRI |
| Encapsulado | 783-FCPBGA (29x29 mm) |
| Ball Pitch | 1.0 mm |
| Temperatura de funcionamiento | -40C to +105C |
| MMU | Yes |
| Interrupt Controller | EPIC (Extended Programmable Interrupt Controller) |
| Timers | 2x 32-bit general-purpose per core |
Guía de configuración de pines de MSC8157TAG1000A 783-fcpbga (29x29 mm)
Configuración de pines para MSC8157TAG1000A (encapsulado 783-fcpbga (29x29 mm)). La numeración de pines, las funciones y los diagramas de conexión se definen en la hoja de datos del fabricante. Consúltela para conocer el footprint exacto y las directrices de soldadura.
No hay datos detallados de patillaje disponibles para MSC8157TAG1000A.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MSC8157TAG1000A es adecuado para 6 aplicacións: 3G/4G LTE Baseband Channel Card, Wireless Base Station Line Card, Media Gateway / Transcoding Appliance, Defense Signal-Intelligence Platform, Industrial Multi-Channel DSP Aggregator, Packet-Processing Line Card.
3G/4G LTE Baseband Channel Card
The MSC8157TAG1000A's six SC3850 cores at 1 GHz plus the MAPLE-B2 turbo/Viterbi accelerator make it a strong fit for LTE physical-layer channel cards where per-subframe FEC timing budgets demand hardware offload. Dual DDR2/DDR3 controllers with ECC keep large soft-bit buffers resident without saturating the bus, while the dual SRIO/CIPRI links allow multi-DSP scaling across the baseband card. The 783-ball FC-PBGA package breaks out the full peripheral set without internal muxing, simplifying PCB layout under heavy signal-integrity constraints. Estimated: aggregate throughput of ~24 GMACS at 1 GHz across six cores plus MAPLE-B2 FEC offload typically handles a 20 MHz LTE sector with margin.
Recomendado
Wireless Base Station Line Card
Base-station line cards combine multiple MSC8157DSPs with a host CPU and fronthaul/backhaul fabrics, and the MSC8157TAG1000A integrates 2x SRIO, 2x PCIe, and 2x GbE so it can serve as both compute element and packet engine on the same board. Operating from -40C to +105C, the device tolerates outdoor cabinet thermal swings, while the 1.0 mm FC-PBGA supports high-density stack-up designs that share antenna data with co-located radios. The dual CIPRI links enable direct DSP-to-DSP messaging without consuming host CPU cycles, critical for tight scheduling loops. Estimated: at typical 5-8 W per device the FC-PBGA thermal envelope is comfortable in a fan-cooled chassis.
Recomendado
Media Gateway / Transcoding Appliance
Media gateways performing high-density voice (VoIP) and video transcoding benefit from the MSC8157TAG1000A's six SC3850 cores, each capable of independent real-time DSP pipelines. The MAPLE-B2 baseband accelerator is repurposed for FEC-protected media transport in some designs, and the dual GbE MACs allow direct connection to packet fabric without an external switch. DDR2/DDR3 with ECC keeps transcoded frame buffers consistent across long sessions. The 783-ball FC-PBGA footprint is reusable across product variants, simplifying platform engineering. Estimated: six SC3850 cores at 1 GHz handle ~600-1000 simultaneous VoIP transcodes with margin depending on codec complexity.
Recomendado
Defense Signal-Intelligence Platform
Defense SIGINT and ELINT systems demand deterministic DSP throughput for wideband captures, and the MSC8157TAG1000A's six SC3850 cores deliver the predictable per-core performance needed for bulk demodulation, decryption front-ends, and pattern-matching pipelines. The -40C to +105C qualification supports field-deployed chassis, while the FC-PBGA package's high pin count exposes SRIO for chaining multiple MSC8157 cards into a single SIGINT rack. MAPLE-B2 acceleration reduces CPU burden for convolutional-code workflows common in SIGINT. The part's EOL status means defense programs typically establish long-term Rochester Electronics supply agreements to guarantee multi-year field life.
Recomendado
Industrial Multi-Channel DSP Aggregator
Industrial monitoring, vibration analysis, and machine-learning front-ends use the MSC8157TAG1000A to aggregate many analog channels into one DSP farm, exploiting the six cores to run parallel FFT, filter, and feature-extraction pipelines. The wide operating-temperature range tolerates factory-floor enclosures, and the dual GbE ports carry aggregated results upstream to a host controller. MAPLE-B2 provides additional FEC for noisy industrial links. The 783-ball FC-PBGA at 1.0 mm pitch requires microvia PCB stack-up but is well within standard high-density industrial designs.
Recomendado
Packet-Processing Line Card
Although primarily a DSP, the MSC8157TAG1000A's 2x SRIO, 2x PCIe, and 2x GbE plus six SC3850 cores make it useful in custom packet-processing line cards where programmable per-packet logic is required. SC3850 cores run microcode for header parsing, classification, and policy enforcement, while the FC-PBGA's high pin count exposes a clean multi-fabric interface. ECC-protected DDR2/DDR3 maintains table consistency under heavy update churn. Estimated: 1 GHz per core supports line-rate processing for ~1-2 Gbps aggregate traffic per device, scaling linearly across multiple MSC8157s on the card.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MSC8157TAG1000A — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MSC8156ESAG1000B | MSC8156HAG1000B | MSC8251SVT1000B |
|---|---|---|---|---|
| Package | 783-FCPBGA (29x29 mm) | 783-FCPBGA (29x29 mm) | 783-FCPBGA (29x29 mm) | 783-FCBGA |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP USA Inc. |
| Core Count | 6x SC3850 | 4x SC3850 | 4x SC3850 | 1x SC3850 |
| Core Frequency | 1 GHz | 1 GHz | 1 GHz | 1 GHz |
| Accelerator | MAPLE-B2 (turbo/Viterbi) | MAPLE-B2 | MAPLE-B2 | MAPLE (no -B2) |
| Memory Interface | Dual DDR2/DDR3 w/ ECC | Dual DDR2/DDR3 w/ ECC | Dual DDR2/DDR3 w/ ECC | DDR3 |
| Lifecycle Status | Last-time-buy (EOL announced) | Last-time-buy (per NXP EOL) | Active (per Xecor) | Last-time-buy (last buy 2017) |
Diferenciadores clave
- Highest core count in MSC815x family (frente a MSC8156ESAG1000B)
- MAPLE-B2 with dual SRIO/CIPRI for multi-DSP scaling (frente a MSC8251SVT1000B)
- Industrial-grade thermal envelope (frente a Typical commercial DSP competitors)
Notas de diseño
The 783-ball FC-PBGA at 1.0 mm pitch requires a high-density PCB stack-up with microvias (laser-drilled 1:1 stack-ups preferred). Plan at least 8-10 PCB layers to break out the dual DDR2/DDR3 buses, dual SRIO, dual PCIe, dual GbE, and dual CIPRI without exceeding 2 signal layers per ball row. Follow NXP's hardware-design guide for via-in-pad and pad diameter recommendations; the FC-PBGA is flip-chip, so direct attach to PCB balls mandates precise paste-mask and reflow profiles.
Estimated: at full load with six SC3850 cores at 1 GHz and MAPLE-B2 active, the MSC8157TAG1000A dissipates roughly 5-8 W depending on workload and voltage. The 29x29 mm FC-PBGA spreads heat adequately for fan-cooled enclosures, but the PCB thermal via array under the die must be sized for ~0.5-1.0 W/cm^2 continuous dissipation. Use NXP's thermal model to compute junction-to-ambient theta_JA for your specific stack-up; derate for -40C to +105C industrial operation.
DDR2/DDR3 memory interfaces require strict trace-length matching per byte lane plus matched impedance to 50 ohm single-ended / 100 ohm differential. SRIO and PCIe links need AC-coupling capacitors and reference-clock routing with skew under 50 ps; SerDes layout should follow NXP's reference designators with ground shielding on both sides of the differential pairs. Estimated: at 1.0 mm ball pitch the breakout escape is feasible with 0.1 mm trace-and-space on outer layers.
Boot ROM configuration must match the actual boot interface (SRIO, PCIe, or serial flash) - misconfiguring boot mode bricks the device until JTAG recovery. MAPLE-B2 firmware version must match the SC3850 core revision; mixing firmware loads from older MSC8156 builds can cause MAPLE fault states. Ensure SC3850 toolchain (CodeWarrior / StarCore) matches the silicon revision; consult NXP errata documents before sign-off.
Información de cumplimiento
Compliance flags were not present in the verified web data; consult NXP product page environmental documentation for definitive RoHS/REACH status.
