MT40A2G8AG-062E vs H5ANAG8NCMR-VKC Comparación
Comparación detallada lado a lado de MT40A2G8AG-062E por Micron Technology y H5ANAG8NCMR-VKC por SK hynix. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MT40A2G8AG-062E | H5ANAG8NCMR-VKC |
|---|---|---|
| Marca | Micron Technology | SK hynix |
| Categoría | Memory ICs | Memory ICs |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $9,75 | $8,05 |
| Tipo de memoria | DDR4 SDRAM | DDR4 SDRAM |
| Density | 16 Gbit | — |
| Organización de memoria | 2G x 8 | — |
| Speed | DDR4-3200 (3200 MT/s) | — |
| Clock Frequency | 1600 MHz | — |
| Access Time (Clock Cycle Time) | 0.625 ns (tCK) | — |
| Latencia CAS | CL22 (DDR4-3200) | [DATA_NEEDED: CAS latency for VK speed bin] |
| Access Time | 19 ns | — |
| Supply Voltage VDD | 1.2 V | — |
| I/O Interface | POD12 (1.2 V pseudo-open drain) | — |
| VPP Voltage | 2.5 V | — |
| Number of Banks | 16 (4 bank groups x 4 banks) | — |
| Operating Temperature (AUT grade) | -40C to +95C (per Micron grade table) | — |
| Encapsulado | 78-FBGA (7.5 x 11 mm) | FBGA-78 |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Die Revision | AG (current generation) | — |
| Tamaño de memoria | — | 16 Gb |
| Memory Organization | — | 2G x 8 |
| Velocidad de datos | — | 2666 Mbps/pin (DDR4-2666) |
| Supply Voltage (VDD) | — | 1.2 V |
| I/O Voltage (VDDQ) | — | 1.2 V |
| Speed Grade | — | VK (per SK hynix speed-bin suffix) |
| Power Class | — | Normal Power |
| Bank Groups | — | 4 |
| Banks Total | — | 16 |
| Temperatura de funcionamiento | — | [DATA_NEEDED: operating temperature range] |
| Packaging | — | [DATA_NEEDED: standard packing quantity] |
| Manufacturer Process | — | CMOS DRAM |