MT53E2G64D8TN-046 vs H58G66CK8BX147N Comparación
Comparación detallada lado a lado de MT53E2G64D8TN-046 por Micron Technology y H58G66CK8BX147N por SK hynix. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Micron Technology
MT53E2G64D8TN-046 - 128Gbit LPDDR4X SDRAM 556-Ball | Micron
MT53E2G64D8TN-046 ✓ Activo
Comparación de especificaciones
| Parámetro | MT53E2G64D8TN-046 | H58G66CK8BX147N |
|---|---|---|
| Marca | Micron Technology | SK hynix |
| Categoría | Memory ICs | Memory ICs |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $34,60 |
| Tipo de memoria | Mobile LPDDR4X SDRAM | LPDDR5X SDRAM |
| Tamaño de memoria | 128 Gbit (16 GB) | — |
| Organización de memoria | 2G x 64 | x8 (single channel) |
| Interfaz | Parallel | LPDDR5/LPDDR5X protocol |
| Clock Frequency | 2.133 GHz | — |
| Access Time | 3.5 ns | — |
| Speed Grade | -046 (4266 Mbps/pin) | — |
| Supply Voltage (VDD) | 1.1 V / 1.8 V (per variant) | — |
| Encapsulado | 556-ball LFBGA (12.4 mm x 12.4 mm) | 315-ball FBGA |
| Ball Pitch | [DATA_NEEDED: ball pitch] | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Operating Temperature (AAT:C) | 0C to +95C | — |
| Operating Temperature (AIT:C) | -40C to +95C | — |
| Operating Temperature (AUT:C) | -40C to +105C | — |
| Automotive Qualification (AUT variant) | AEC-Q100 qualified | — |
| Ancho del bus de datos | 64 bit | — |
| Write Cycle Time | 18 ns | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS Status] |
| Density | — | 64 Gbit (8 GB) |
| Maximum Data Rate | — | 8533 Mbps |
| Supply Voltage Domain | — | 0.5 V to 1.8 V |
| Core Voltage Class | — | 1.05 V (LPDDR5/LPDDR5X class) |
| Standard Compliance | — | JEDEC-compliant single-channel SDRAM (per SK hynix 315-ball FBGA specification) |
| Channel Configuration | — | Single channel (x8 or x16 capable family) |
| Power Management | — | Dynamic voltage and frequency scaling (DVFSC/DVFSQ) |
| Application Domain | — | Smartphone, AI edge, server-class mobile computing |
| Temperatura de funcionamiento | — | [DATA_NEEDED: Operating Temperature Range] |
| Refresh Scheme | — | LPDDR5 per-bank / all-bank refresh |