OSD3358-512M-ISM vs OSD3358-512M-BSM Comparación
Comparación detallada lado a lado de OSD3358-512M-ISM por Octavo Systems y OSD3358-512M-BSM por Octavo Systems. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Octavo Systems
OSD3358-512M-ISM - 1GHz Cortex-A8 SiP SOM, 512MB DDR3 | Octavo Systems
OSD3358-512M-ISM ✓ ActivoOctavo Systems
OSD3358-512M-BSM - ARM Cortex-A8 SiP, 1GHz, 512MB DDR3 | Octavo
OSD3358-512M-BSM ✓ ActivoComparación de especificaciones
| Parámetro | OSD3358-512M-ISM | OSD3358-512M-BSM |
|---|---|---|
| Marca | Octavo Systems | Octavo Systems |
| Categoría | Wireless Modules | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $46,80 | $30,95 |
| Product Type | System-in-Package (SiP) / System-on-Module (SOM) | — |
| Series | OSD3358 | — |
| Core Processor | Texas Instruments AM3358 ARM Cortex-A8 NEON SIMD | — |
| CPU Speed | 1 GHz | — |
| RAM Size | 512 MB DDR3 | — |
| PMIC | TPS65217C | — |
| Auxiliary LDO | TL5209 | — |
| EEPROM | 4 KB | — |
| Encapsulado | 256-ball BGA, 21 mm x 21 mm | 256-ball BGA 21x21 mm, 1.27 mm pitch |
| Form Factor | SiP (System-in-Package) | — |
| Ball Pitch | [DATA_NEEDED: ball pitch] | — |
| Temperatura de funcionamiento | -40C to +85C (industrial) | 0 C to +70 C (commercial, BSM grade) |
| Tensión de alimentación | [DATA_NEEDED: main rail voltage] | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA reflow) |
| Nivel MSL | [DATA_NEEDED: MSL rating] | — |
| Estado RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Tray Quantity | [DATA_NEEDED: tray qty] | — |
| Module Type | — | System-in-Package (SiP) with AM3358 + DDR3 + PMIC |
| Processor Core | — | Texas Instruments Sitara AM3358 ARM Cortex-A8 32-bit |
| Maximum CPU Clock | — | 1 GHz (with NEON SIMD and FPU) |
| Graphics Accelerator | — | PowerVR SGX530 3D GPU |
| System Memory | — | 512 MB 32-bit DDR3 (on-package) |
| Memory Bus Width | — | 32-bit + ECC option |
| Peripheral Co-Processors | — | 2x PRU-ICSS (Programmable Real-time Unit) |
| Ethernet | — | 2x 10/100/1000 industrial Ethernet MAC (MII/RGMii) |
| USB | — | 1x USB 2.0 HS Host + 1x USB 2.0 HS Dual-Role |
| Other Interfaces | — | 4x UART, 2x I2C, 2x SPI, 2x McASP, McSPI, CAN, ADC |
| Operating Voltage | — | 5 V single rail via on-board PMIC |