OSD3358-512M-ISM vs OSD3358-512M-BSM Comparaison
Comparaison détaillée côte à côte de OSD3358-512M-ISM par Octavo Systems et OSD3358-512M-BSM par Octavo Systems. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Octavo Systems
OSD3358-512M-ISM - 1GHz Cortex-A8 SiP SOM, 512MB DDR3 | Octavo Systems
OSD3358-512M-ISM ✓ ActifOctavo Systems
OSD3358-512M-BSM - ARM Cortex-A8 SiP, 1GHz, 512MB DDR3 | Octavo
OSD3358-512M-BSM ✓ ActifComparaison des spécifications
| Paramètre | OSD3358-512M-ISM | OSD3358-512M-BSM |
|---|---|---|
| Marque | Octavo Systems | Octavo Systems |
| Catégorie | Wireless Modules | Microcontrollers |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $46,80 | $30,95 |
| Product Type | System-in-Package (SiP) / System-on-Module (SOM) | — |
| Series | OSD3358 | — |
| Core Processor | Texas Instruments AM3358 ARM Cortex-A8 NEON SIMD | — |
| CPU Speed | 1 GHz | — |
| RAM Size | 512 MB DDR3 | — |
| PMIC | TPS65217C | — |
| Auxiliary LDO | TL5209 | — |
| EEPROM | 4 KB | — |
| Boîtier | 256-ball BGA, 21 mm x 21 mm | 256-ball BGA 21x21 mm, 1.27 mm pitch |
| Form Factor | SiP (System-in-Package) | — |
| Ball Pitch | [DATA_NEEDED: ball pitch] | — |
| Température de fonctionnement | -40C to +85C (industrial) | 0 C to +70 C (commercial, BSM grade) |
| Tension d'alimentation | [DATA_NEEDED: main rail voltage] | — |
| Type de montage | Surface Mount (BGA) | Surface Mount (BGA reflow) |
| Niveau MSL | [DATA_NEEDED: MSL rating] | — |
| Statut RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Tray Quantity | [DATA_NEEDED: tray qty] | — |
| Module Type | — | System-in-Package (SiP) with AM3358 + DDR3 + PMIC |
| Processor Core | — | Texas Instruments Sitara AM3358 ARM Cortex-A8 32-bit |
| Maximum CPU Clock | — | 1 GHz (with NEON SIMD and FPU) |
| Graphics Accelerator | — | PowerVR SGX530 3D GPU |
| System Memory | — | 512 MB 32-bit DDR3 (on-package) |
| Memory Bus Width | — | 32-bit + ECC option |
| Peripheral Co-Processors | — | 2x PRU-ICSS (Programmable Real-time Unit) |
| Ethernet | — | 2x 10/100/1000 industrial Ethernet MAC (MII/RGMii) |
| USB | — | 1x USB 2.0 HS Host + 1x USB 2.0 HS Dual-Role |
| Other Interfaces | — | 4x UART, 2x I2C, 2x SPI, 2x McASP, McSPI, CAN, ADC |
| Operating Voltage | — | 5 V single rail via on-board PMIC |