OSD3358-512M-ISM vs OSD3358-512M-BSM 对比

详细并排对比 OSD3358-512M-ISM 出自 Octavo Systems 和 OSD3358-512M-BSM 出自 Octavo Systems。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Octavo Systems
OSD3358-512M-ISM OSD3358-512M-ISM - 1GHz Cortex-A8 SiP SOM, 512MB DDR3 | Octavo Systems

OSD3358-512M-ISM - 1GHz Cortex-A8 SiP SOM, 512MB DDR3 | Octavo Systems

OSD3358-512M-ISM ✓ 量产中
Octavo Systems
OSD3358-512M-BSM OSD3358-512M-BSM - ARM Cortex-A8 SiP, 1GHz, 512MB DDR3 | Octavo

OSD3358-512M-BSM - ARM Cortex-A8 SiP, 1GHz, 512MB DDR3 | Octavo

OSD3358-512M-BSM ✓ 量产中

规格对比

参数 OSD3358-512M-ISM OSD3358-512M-BSM
品牌 Octavo Systems Octavo Systems
分类 Wireless Modules Microcontrollers
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $46.80 $30.95
Product Type System-in-Package (SiP) / System-on-Module (SOM) —
Series OSD3358 —
Core Processor Texas Instruments AM3358 ARM Cortex-A8 NEON SIMD —
CPU Speed 1 GHz —
RAM Size 512 MB DDR3 —
PMIC TPS65217C —
Auxiliary LDO TL5209 —
EEPROM 4 KB —
封装 256-ball BGA, 21 mm x 21 mm 256-ball BGA 21x21 mm, 1.27 mm pitch
Form Factor SiP (System-in-Package) —
Ball Pitch [DATA_NEEDED: ball pitch] —
工作温度 -40C to +85C (industrial) 0 C to +70 C (commercial, BSM grade)
电源电压 [DATA_NEEDED: main rail voltage] —
安装类型 Surface Mount (BGA) Surface Mount (BGA reflow)
MSL 等级 [DATA_NEEDED: MSL rating] —
RoHS 状态 Compliant Compliant
Lead-Free Yes —
Tray Quantity [DATA_NEEDED: tray qty] —
Module Type — System-in-Package (SiP) with AM3358 + DDR3 + PMIC
Processor Core — Texas Instruments Sitara AM3358 ARM Cortex-A8 32-bit
Maximum CPU Clock — 1 GHz (with NEON SIMD and FPU)
Graphics Accelerator — PowerVR SGX530 3D GPU
System Memory — 512 MB 32-bit DDR3 (on-package)
Memory Bus Width — 32-bit + ECC option
Peripheral Co-Processors — 2x PRU-ICSS (Programmable Real-time Unit)
Ethernet — 2x 10/100/1000 industrial Ethernet MAC (MII/RGMii)
USB — 1x USB 2.0 HS Host + 1x USB 2.0 HS Dual-Role
Other Interfaces — 4x UART, 2x I2C, 2x SPI, 2x McASP, McSPI, CAN, ADC
Operating Voltage — 5 V single rail via on-board PMIC

数据手册与资源

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