P1012NSN2DFB vs P1020NSE2FFB Comparación
Comparación detallada lado a lado de P1012NSN2DFB por NXP Semiconductors y P1020NSE2FFB por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
P1012NSN2DFB - QorIQ P1 PowerPC e500v2 MPU 800MHz | NXP
P1012NSN2DFB ✗ Fin de vidaNXP Semiconductors
P1020NSE2FFB - QorIQ P1 Dual-Core 800MHz SoC | NXP Semiconductors
P1020NSE2FFB ⚠ Última compraComparación de especificaciones
| Parámetro | P1012NSN2DFB | P1020NSE2FFB |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Fin de vida | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $38,66 | $39,95 |
| Manufacturer | NXP Semiconductors | — |
| Processor Type | PowerPC e500v2 | QorIQ P1 series, dual-core PowerPC e500v2 |
| Series | QorIQ P1 | — |
| Core Count | 1 | — |
| Ancho del bus de datos | 32-bit | 32-bit |
| Max Clock Frequency | 800 MHz | — |
| Temperatura de funcionamiento | 0C to +125C | 0C to 125C (Tj) |
| Encapsulado / Carcasa | 689-TEPBGA II (31x31 mm), exposed pad | — |
| Process Technology | 45 nm | 45 nm |
| L1 Cache (I/D) | 32 KB / 32 KB | — |
| L2 Cache | 256 KB platform cache | — |
| Memory Controller | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC |
| Ethernet | Dual Gigabit Ethernet (eTSEC) | Integrated GbE (3x MAC) |
| PCI Express | 3 x PCIe Gen 1 controllers | — |
| USB | 2 x USB 2.0 (host + device) | USB 2.0 |
| TDM / Telecom | QUICC Engine (UTOPIA / TDM / HDLC) | — |
| Cryptography | SEC 3.1 | — |
| Packaging | Tray | — |
| Lead Free Status | Lead Free | — |
| Estado RoHS | RoHS Compliant | — |
| Number of Cores | — | 2 |
| Core Frequency | — | 667 MHz (core), 333 MHz (platform), 667 MHz (core2) |
| Marketing / Maximum Frequency | — | 800 MHz |
| PCIe | — | PCIe Gen1 / Gen2 |
| Security Engine | — | SEC (hardware-accelerated crypto) |
| TDM / Serial Interface | — | Yes (TDM) |
| Encapsulado | — | 689-TEPBGA II (31x31 mm) |
| Package Type | — | 689-BBGA Exposed Pad (Tray) |
| Lead Free / RoHS | — | Lead Free, RoHS Compliant |
| Tensión de alimentación | — | [DATA_NEEDED: exact Vcore/Vdd nominal] |
| Junction Temperature Max | — | 125 C |