P1012NSN2DFB vs P1020NSE2FFB Vergleich
Detaillierter Direktvergleich von P1012NSN2DFB von NXP Semiconductors und P1020NSE2FFB von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
P1012NSN2DFB - QorIQ P1 PowerPC e500v2 MPU 800MHz | NXP
P1012NSN2DFB ✗ AbgekündigtNXP Semiconductors
P1020NSE2FFB - QorIQ P1 Dual-Core 800MHz SoC | NXP Semiconductors
P1020NSE2FFB ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | P1012NSN2DFB | P1020NSE2FFB |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Ende des Lebenszyklus | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $38,66 | $39,95 |
| Manufacturer | NXP Semiconductors | — |
| Processor Type | PowerPC e500v2 | QorIQ P1 series, dual-core PowerPC e500v2 |
| Series | QorIQ P1 | — |
| Core Count | 1 | — |
| Datenbusbreite | 32-bit | 32-bit |
| Max Clock Frequency | 800 MHz | — |
| Betriebstemperatur | 0C to +125C | 0C to 125C (Tj) |
| Gehäuse / Bauform | 689-TEPBGA II (31x31 mm), exposed pad | — |
| Process Technology | 45 nm | 45 nm |
| L1 Cache (I/D) | 32 KB / 32 KB | — |
| L2 Cache | 256 KB platform cache | — |
| Memory Controller | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC |
| Ethernet | Dual Gigabit Ethernet (eTSEC) | Integrated GbE (3x MAC) |
| PCI Express | 3 x PCIe Gen 1 controllers | — |
| USB | 2 x USB 2.0 (host + device) | USB 2.0 |
| TDM / Telecom | QUICC Engine (UTOPIA / TDM / HDLC) | — |
| Cryptography | SEC 3.1 | — |
| Packaging | Tray | — |
| Lead Free Status | Lead Free | — |
| RoHS-Status | RoHS Compliant | — |
| Number of Cores | — | 2 |
| Core Frequency | — | 667 MHz (core), 333 MHz (platform), 667 MHz (core2) |
| Marketing / Maximum Frequency | — | 800 MHz |
| PCIe | — | PCIe Gen1 / Gen2 |
| Security Engine | — | SEC (hardware-accelerated crypto) |
| TDM / Serial Interface | — | Yes (TDM) |
| Gehäuse | — | 689-TEPBGA II (31x31 mm) |
| Package Type | — | 689-BBGA Exposed Pad (Tray) |
| Lead Free / RoHS | — | Lead Free, RoHS Compliant |
| Versorgungsspannung | — | [DATA_NEEDED: exact Vcore/Vdd nominal] |
| Junction Temperature Max | — | 125 C |