P5010NSN1QMB vs P5010NSN1MMB Comparación
Comparación detallada lado a lado de P5010NSN1QMB por NXP Semiconductors y P5010NSN1MMB por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
P5010NSN1QMB - QorIQ P5010 SoC, 64-bit Power Arch, 2.0GHz, 1295-FCBGA | NXP
P5010NSN1QMB ✓ ActivoNXP Semiconductors
P5010NSN1MMB - QorIQ P5 e5500 2.0GHz 64-bit MPU | NXP Semiconductors
P5010NSN1MMB ✓ ActivoComparación de especificaciones
| Parámetro | P5010NSN1QMB | P5010NSN1MMB |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $318,25 | $205,00 |
| Architecture | Power Architecture e5500 (64-bit) | — |
| Core Count | 1 core | — |
| Maximum Core Frequency | 2.0 GHz | — |
| Cache (L1 Instruction per core) | 32 KB | — |
| Cache (L1 Data per core) | 32 KB | — |
| Cache (L2 shared frontside) | 1 MB | — |
| Memory Controller | DDR3 with ECC support | — |
| PCIe | PCI Express Gen 2 controllers integrated | — |
| Ethernet | Dual Gigabit Ethernet | — |
| High-Speed Interconnect | Serial RapidIO (SRIO) | — |
| Hardware Acceleration | DPAA (Data Path Acceleration Architecture) engine | — |
| Security Engine | SEC crypto engine integrated | — |
| Encapsulado | 1295-FCBGA (37.5 x 37.5 mm) | — |
| Temperatura de funcionamiento | 0C to +105C | -40 °C to +105 °C (industrial/extended, per datasheet) [DATA_NEEDED: confirmed Tj range] |
| Encryption | Hardware-accelerated | — |
| Manufacturer | — | NXP Semiconductors (Freescale legacy) |
| Series | — | QorIQ P5 |
| Core Architecture | — | PowerPC e5500 |
| Number of Cores | — | 1 |
| Ancho del bus de datos | — | 64 bit |
| Frecuencia de reloj máxima | — | 2.0 GHz |
| Package Type | — | 1295-FCPBGA (Flip-Chip Plastic BGA) |
| Package Size | — | 37.5 mm × 37.5 mm |
| Tipo de montaje | — | Surface Mount |
| Core Voltage Min | — | 0.95 V |
| Process Technology | — | [DATA_NEEDED: process node] |
| L1 Instruction Cache | — | [DATA_NEEDED: per core] |
| L1 Data Cache | — | [DATA_NEEDED: per core] |
| L2 Cache | — | [DATA_NEEDED: per core / shared] |
| Estado RoHS | — | Compliant |
| Part Status | — | Active (per distributor listing, as of 2026-10-17) |