S9S08AW60E5MFGER vs MC9S08AW60CPUE Comparación
Comparación detallada lado a lado de S9S08AW60E5MFGER por NXP Semiconductors y MC9S08AW60CPUE por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | S9S08AW60E5MFGER | MC9S08AW60CPUE |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $6,05 | $0,00 |
| Core Architecture | HCS08 (S08 enhanced), 8-bit CISC | — |
| CPU Clock (Max) | 40 MHz (20 MHz bus) | — |
| Program Flash | 60 KB (60K x 8) | — |
| RAM | [DATA_NEEDED: RAM size] | — |
| EEPROM / Data Flash | [DATA_NEEDED: data EEPROM size] | — |
| Tensión de alimentación | 3 V / 3.3 V / 5 V | — |
| Encapsulado | 44-pin LQFP (10 x 10 mm) | 64-LQFP (10 x 10 mm, 0.5 mm pitch, MO-220VKKD-2, 1 mm height) |
| I/O Pins | [DATA_NEEDED: GPIO count] | — |
| ADC | Multi-channel 10-bit (per family) | 10-bit |
| Communication | SCI (UART), SPI, I2C | — |
| Timers | TPM modules with PWM channels | — |
| Debug Interface | BDM (Background Debug Mode) | Single-wire background debug mode (BDM) |
| Temperatura de funcionamiento | -40C to +125C (automotive range) | [DATA_NEEDED: Operating Temperature Range] |
| Tipo de montaje | Surface Mount | Surface Mount |
| Family | S08 / MC9S08AW60 series | HCS08 (S08AW) |
| Automotive/Industrial | Dual-targeted | — |
| Lead Free / RoHS | Yes (per suffix "E" = Pb-free, "R" = tape & reel) | — |
| Core Processor | — | S08 (HCS08) |
| Core Size | — | 8-Bit |
| Speed (CPU Clock) | — | 40 MHz |
| Internal Bus Frequency | — | 20 MHz |
| Flash Memory | — | 60 KB (60K x 8) |
| RAM Size | — | 4 KB |
| Supply Voltage Range | — | 2.7 V to 5.5 V |
| I/O Count | — | 38 |
| Peripherals | — | 16-bit timer, ADC, SCI, SPI, multiple power-saving modes |
| Instruction Set | — | HC08 (CISC) with added BGND instruction |
| Life Cycle Stage | — | Active |
| Programmable Memory Type | — | Flash |