S9S08AW60E5MFGER vs MC9S08AW60CPUE 比較
詳細な並列比較: S9S08AW60E5MFGER メーカー: NXP Semiconductors および MC9S08AW60CPUE メーカー: NXP Semiconductors。主要仕様、電気的特性、パッケージ、ライフサイクルステータス、価格、在庫状況を比較して、設計要件に最適な部品を判断してください。
仕様比較
| パラメータ | S9S08AW60E5MFGER | MC9S08AW60CPUE |
|---|---|---|
| ブランド | NXP Semiconductors | NXP Semiconductors |
| カテゴリ | Microcontrollers | Microcontrollers |
| ライフサイクル状態 | 有効 | 有効 |
| 在庫状況 | In Stock | In Stock |
| 単価（USD） | $6.05 | $0.00 |
| Core Architecture | HCS08 (S08 enhanced), 8-bit CISC | — |
| CPU Clock (Max) | 40 MHz (20 MHz bus) | — |
| Program Flash | 60 KB (60K x 8) | — |
| RAM | [DATA_NEEDED: RAM size] | — |
| EEPROM / Data Flash | [DATA_NEEDED: data EEPROM size] | — |
| 電源電圧 | 3 V / 3.3 V / 5 V | — |
| パッケージ | 44-pin LQFP (10 x 10 mm) | 64-LQFP (10 x 10 mm, 0.5 mm pitch, MO-220VKKD-2, 1 mm height) |
| I/O Pins | [DATA_NEEDED: GPIO count] | — |
| ADC | Multi-channel 10-bit (per family) | 10-bit |
| Communication | SCI (UART), SPI, I2C | — |
| Timers | TPM modules with PWM channels | — |
| Debug Interface | BDM (Background Debug Mode) | Single-wire background debug mode (BDM) |
| 動作温度 | -40C to +125C (automotive range) | [DATA_NEEDED: Operating Temperature Range] |
| 実装タイプ | Surface Mount | Surface Mount |
| Family | S08 / MC9S08AW60 series | HCS08 (S08AW) |
| Automotive/Industrial | Dual-targeted | — |
| Lead Free / RoHS | Yes (per suffix "E" = Pb-free, "R" = tape & reel) | — |
| Core Processor | — | S08 (HCS08) |
| Core Size | — | 8-Bit |
| Speed (CPU Clock) | — | 40 MHz |
| Internal Bus Frequency | — | 20 MHz |
| Flash Memory | — | 60 KB (60K x 8) |
| RAM Size | — | 4 KB |
| Supply Voltage Range | — | 2.7 V to 5.5 V |
| I/O Count | — | 38 |
| Peripherals | — | 16-bit timer, ADC, SCI, SPI, multiple power-saving modes |
| Instruction Set | — | HC08 (CISC) with added BGND instruction |
| Life Cycle Stage | — | Active |
| Programmable Memory Type | — | Flash |