S9S08AW60E5MFGER vs MC9S08AW60CPUE Comparaison
Comparaison détaillée côte à côte de S9S08AW60E5MFGER par NXP Semiconductors et MC9S08AW60CPUE par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | S9S08AW60E5MFGER | MC9S08AW60CPUE |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $6,05 | $0,00 |
| Core Architecture | HCS08 (S08 enhanced), 8-bit CISC | — |
| CPU Clock (Max) | 40 MHz (20 MHz bus) | — |
| Program Flash | 60 KB (60K x 8) | — |
| RAM | [DATA_NEEDED: RAM size] | — |
| EEPROM / Data Flash | [DATA_NEEDED: data EEPROM size] | — |
| Tension d'alimentation | 3 V / 3.3 V / 5 V | — |
| Boîtier | 44-pin LQFP (10 x 10 mm) | 64-LQFP (10 x 10 mm, 0.5 mm pitch, MO-220VKKD-2, 1 mm height) |
| I/O Pins | [DATA_NEEDED: GPIO count] | — |
| ADC | Multi-channel 10-bit (per family) | 10-bit |
| Communication | SCI (UART), SPI, I2C | — |
| Timers | TPM modules with PWM channels | — |
| Debug Interface | BDM (Background Debug Mode) | Single-wire background debug mode (BDM) |
| Température de fonctionnement | -40C to +125C (automotive range) | [DATA_NEEDED: Operating Temperature Range] |
| Type de montage | Surface Mount | Surface Mount |
| Family | S08 / MC9S08AW60 series | HCS08 (S08AW) |
| Automotive/Industrial | Dual-targeted | — |
| Lead Free / RoHS | Yes (per suffix "E" = Pb-free, "R" = tape & reel) | — |
| Core Processor | — | S08 (HCS08) |
| Core Size | — | 8-Bit |
| Speed (CPU Clock) | — | 40 MHz |
| Internal Bus Frequency | — | 20 MHz |
| Flash Memory | — | 60 KB (60K x 8) |
| RAM Size | — | 4 KB |
| Supply Voltage Range | — | 2.7 V to 5.5 V |
| I/O Count | — | 38 |
| Peripherals | — | 16-bit timer, ADC, SCI, SPI, multiple power-saving modes |
| Instruction Set | — | HC08 (CISC) with added BGND instruction |
| Life Cycle Stage | — | Active |
| Programmable Memory Type | — | Flash |