S9S08QD2J1MSC vs MC9S08QD4CSC Comparación
Comparación detallada lado a lado de S9S08QD2J1MSC por NXP Semiconductors y MC9S08QD4CSC por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | S9S08QD2J1MSC | MC9S08QD4CSC |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Fin de vida |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,89 | $0,00 |
| Core | HCS08 (S08) 8-bit CISC | — |
| Program Memory (Flash) | 2 KB (2K x 8) | — |
| RAM Size | 128 bytes | — |
| Maximum CPU Frequency | 16 MHz | — |
| Supply Voltage (Vcc/Vdd) | 2.7 V to 5.5 V | — |
| Temperatura de funcionamiento | -40C to +125C (Automotive Grade) | [DATA_NEEDED: operating temperature range] |
| Number of I/O Pins | 4 | — |
| Encapsulado | 8-pin SOIC (SOIC-8) | 8-SOIC |
| Tipo de montaje | Surface Mount | Surface Mount |
| Peripherals | LVD, POR, PWM, WDT | — |
| Connectivity | - | — |
| Debug Interface | Single-wire Background Debug Mode (BDM) | Background debugging system (single-wire BDM) |
| EEPROM | None (Flash-based) | — |
| Nivel MSL | [DATA_NEEDED: MSL rating] | — |
| Estado RoHS | Compliant | — |
| AEC-Q100 | Qualified (Automotive) | — |
| Core Processor | — | S08 (HCS08), 8-bit CISC |
| Core Size | — | 8-bit |
| Frecuencia de reloj máxima | — | 16 MHz |
| Flash Memory | — | 4 KB (4K x 8) |
| RAM | — | 256 B |
| Tensión de alimentación | — | 3.3 V / 5 V |
| ADC Resolution | — | 10-bit |
| ADC Channels | — | 4 |
| General-Purpose I/O | — | 6 |
| Instruction Set | — | HC08 with added BGND instruction |
| Packaging | — | Tube |
| Life Cycle Stage | — | End of Life (per NXP product page) |