SAK-TC364DP-64F300F vs SAK-TC387QP-160F300S Comparación
Comparación detallada lado a lado de SAK-TC364DP-64F300F por Infineon y SAK-TC387QP-160F300S por Infineon. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Infineon
SAK-TC364DP-64F300F - AURIX TC36x Dual-Core 300MHz MCU | Infineon
SAK-TC364DP-64F300F ✓ ActivoInfineon
SAK-TC387QP-160F300S - 32-bit AURIX TC3xx Quad-Core MCU | Infineon
SAK-TC387QP-160F300S ✓ ActivoComparación de especificaciones
| Parámetro | SAK-TC364DP-64F300F | SAK-TC387QP-160F300S |
|---|---|---|
| Marca | Infineon | Infineon |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $15,20 | $25,95 |
| Core Architecture | TriCore v1.6.2 (32-bit) | Infineon TriCore TC1.6.2 (32-bit) |
| Number of Cores | 2 (1 main + 1 checker in lockstep) | 4 TriCore (2 lockstep checker cores included) |
| Frecuencia de reloj máxima | 300 MHz | — |
| Program Flash | 4 MB | — |
| SRAM | 672 KB | — |
| Tensión de alimentación | 3.3 V / 5 V (single-voltage operation) | [DATA_NEEDED: supply voltage range] |
| Functional Safety | ISO 26262 ASIL-D capable | ISO 26262 ASIL-D capable |
| Automotive Grade | AEC-Q100 qualified | — |
| Ethernet | 100 Mbit (MII/RMII) | 1 Gbit Ethernet |
| CAN-FD Ports | Multiple (per TC36xDP configuration) | — |
| LIN Channels | Multiple | — |
| Hardware Security Module | Yes (EVITA-Full) | — |
| Hardware ECC | Yes (Flash + RAM) | — |
| Integrated LDO | Yes | — |
| Typical Power Consumption | < 2 W | — |
| Encapsulado | PG-LQFP-144-22 (TQFP-144) | PG-LFBGA-292-11 |
| Temperatura de funcionamiento | -40 C to +125 C (automotive Grade 1) | [DATA_NEEDED: operating temperature range] |
| Estado RoHS | Compliant | Compliant |
| Product Family | — | AURIX TC3xx (second generation) |
| Series | — | TC38xQP |
| CPU Frequency | — | 300 MHz |
| Program Memory (FLASH) | — | 10 MB (10M x 8) |
| Flash Technology | — | Embedded 40 nm |
| HSM | — | Integrated Hardware Security Module |
| Tipo de montaje | — | Surface Mount (BGA) |
| Nivel MSL | — | [DATA_NEEDED: MSL level] |