SAK-TC364DP-64F300F vs SAK-TC387QP-160F300S Comparaison
Comparaison détaillée côte à côte de SAK-TC364DP-64F300F par Infineon et SAK-TC387QP-160F300S par Infineon. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Infineon
SAK-TC364DP-64F300F - AURIX TC36x Dual-Core 300MHz MCU | Infineon
SAK-TC364DP-64F300F ✓ ActifInfineon
SAK-TC387QP-160F300S - 32-bit AURIX TC3xx Quad-Core MCU | Infineon
SAK-TC387QP-160F300S ✓ ActifComparaison des spécifications
| Paramètre | SAK-TC364DP-64F300F | SAK-TC387QP-160F300S |
|---|---|---|
| Marque | Infineon | Infineon |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $15,20 | $25,95 |
| Core Architecture | TriCore v1.6.2 (32-bit) | Infineon TriCore TC1.6.2 (32-bit) |
| Number of Cores | 2 (1 main + 1 checker in lockstep) | 4 TriCore (2 lockstep checker cores included) |
| Fréquence d'horloge maximale | 300 MHz | — |
| Program Flash | 4 MB | — |
| SRAM | 672 KB | — |
| Tension d'alimentation | 3.3 V / 5 V (single-voltage operation) | [DATA_NEEDED: supply voltage range] |
| Functional Safety | ISO 26262 ASIL-D capable | ISO 26262 ASIL-D capable |
| Automotive Grade | AEC-Q100 qualified | — |
| Ethernet | 100 Mbit (MII/RMII) | 1 Gbit Ethernet |
| CAN-FD Ports | Multiple (per TC36xDP configuration) | — |
| LIN Channels | Multiple | — |
| Hardware Security Module | Yes (EVITA-Full) | — |
| Hardware ECC | Yes (Flash + RAM) | — |
| Integrated LDO | Yes | — |
| Typical Power Consumption | < 2 W | — |
| Boîtier | PG-LQFP-144-22 (TQFP-144) | PG-LFBGA-292-11 |
| Température de fonctionnement | -40 C to +125 C (automotive Grade 1) | [DATA_NEEDED: operating temperature range] |
| Statut RoHS | Compliant | Compliant |
| Product Family | — | AURIX TC3xx (second generation) |
| Series | — | TC38xQP |
| CPU Frequency | — | 300 MHz |
| Program Memory (FLASH) | — | 10 MB (10M x 8) |
| Flash Technology | — | Embedded 40 nm |
| HSM | — | Integrated Hardware Security Module |
| Type de montage | — | Surface Mount (BGA) |
| Niveau MSL | — | [DATA_NEEDED: MSL level] |