SPAK56F803BU80 vs DSP56F801FA80E Comparación

Comparación detallada lado a lado de SPAK56F803BU80 por NXP Semiconductors y DSP56F801FA80E por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

NXP Semiconductors
SPAK56F803BU80 SPAK56F803BU80 - DSP56F803 16-bit DSP, 80MHz, 100-LFQFP | NXP

SPAK56F803BU80 - DSP56F803 16-bit DSP, 80MHz, 100-LFQFP | NXP

SPAK56F803BU80 Nrnd
NXP Semiconductors
DSP56F801FA80E DSP56F801FA80E - 16-bit 80MHz DSC 16KB Flash | NXP

DSP56F801FA80E - 16-bit 80MHz DSC 16KB Flash | NXP

DSP56F801FA80E ✗ Fin de vida

Comparación de especificaciones

Parámetro SPAK56F803BU80 DSP56F801FA80E
Marca NXP Semiconductors NXP Semiconductors
Categoría DSP DSP
Estado del ciclo de vida NRND Fin de vida
Estado del stock In Stock In Stock
Precio unitario (USD) $16,25 $6,48
Product Type 16-bit Digital Signal Processor —
Core Architecture DSP56F803 (DSP + MCU unified core) —
Core Frequency 80 MHz 80 MHz
Core Performance 40 MIPS —
Instruction Set MCU-friendly DSP ISA with MAC, bit-manipulation unit, hardware DO/REP loops —
Addressing Modes 14 addressing modes —
Program Memory On-chip Flash (size [DATA_NEEDED: program memory size in KB]) —
Data Memory On-chip RAM (size [DATA_NEEDED: data memory size in KB]) —
Encapsulado LFQFP-100 (Low-profile Fine-pitch QFP, gull-wing) 48-LQFP (7x7 mm)
Package Outline 100 terminals, square, gull-wing lead form —
Operating Temperature Grade Industrial —
Tipo de montaje Surface Mount Surface Mount
Manufacturer NXP Semiconductors (formerly Freescale / Motorola) —
Estado RoHS [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS status]
Typical Applications Motor control, power conversion, DSP signal processing, UPS, audio/sensor conditioning Servo and motor control, power inverters, converters
Core — 56800 (56F8xx)
Core Size — 16-Bit
Performance — Up to 40 MIPS at 80 MHz
Program Flash Memory — 16KB (8K x 16)
Architecture — Harvard-style, unified C-efficient DSP/MCU instruction set
Tensión de alimentación — [DATA_NEEDED: supply voltage]
I/O Tolerance — 5V tolerant TTL-compatible digital inputs (up to 5.5V)
Process Technology — High-density CMOS, 3.3V compatible process
Temperatura de funcionamiento — [DATA_NEEDED: operating temperature range]
Thermal Resistance Theta-JA — Simulated per JEDEC JESD51-2, natural convection horizontal configuration
Estado del ciclo de vida — End of Life (per NXP product page)

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