SPAK56F803BU80 vs DSP56F801FA80E 对比
详细并排对比 SPAK56F803BU80 出自 NXP Semiconductors 和 DSP56F801FA80E 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
NXP Semiconductors
SPAK56F803BU80 - DSP56F803 16-bit DSP, 80MHz, 100-LFQFP | NXP
SPAK56F803BU80 Nrnd
规格对比
| 参数 | SPAK56F803BU80 | DSP56F801FA80E |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | DSP | DSP |
| 生命周期状态 | 不推荐新设计 | 停产 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $16.25 | $6.48 |
| Product Type | 16-bit Digital Signal Processor | — |
| Core Architecture | DSP56F803 (DSP + MCU unified core) | — |
| Core Frequency | 80 MHz | 80 MHz |
| Core Performance | 40 MIPS | — |
| Instruction Set | MCU-friendly DSP ISA with MAC, bit-manipulation unit, hardware DO/REP loops | — |
| Addressing Modes | 14 addressing modes | — |
| Program Memory | On-chip Flash (size [DATA_NEEDED: program memory size in KB]) | — |
| Data Memory | On-chip RAM (size [DATA_NEEDED: data memory size in KB]) | — |
| 封装 | LFQFP-100 (Low-profile Fine-pitch QFP, gull-wing) | 48-LQFP (7x7 mm) |
| Package Outline | 100 terminals, square, gull-wing lead form | — |
| Operating Temperature Grade | Industrial | — |
| 安装类型 | Surface Mount | Surface Mount |
| Manufacturer | NXP Semiconductors (formerly Freescale / Motorola) | — |
| RoHS 状态 | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| Typical Applications | Motor control, power conversion, DSP signal processing, UPS, audio/sensor conditioning | Servo and motor control, power inverters, converters |
| Core | — | 56800 (56F8xx) |
| Core Size | — | 16-Bit |
| Performance | — | Up to 40 MIPS at 80 MHz |
| Program Flash Memory | — | 16KB (8K x 16) |
| Architecture | — | Harvard-style, unified C-efficient DSP/MCU instruction set |
| 电源电压 | — | [DATA_NEEDED: supply voltage] |
| I/O Tolerance | — | 5V tolerant TTL-compatible digital inputs (up to 5.5V) |
| Process Technology | — | High-density CMOS, 3.3V compatible process |
| 工作温度 | — | [DATA_NEEDED: operating temperature range] |
| Thermal Resistance Theta-JA | — | Simulated per JEDEC JESD51-2, natural convection horizontal configuration |
| 生命周期状态 | — | End of Life (per NXP product page) |