SPC5606SF2CLU6 vs SPC5643LFF2MMM1R Comparación
Comparación detallada lado a lado de SPC5606SF2CLU6 por NXP Semiconductors y SPC5643LFF2MMM1R por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
SPC5606SF2CLU6 - 32-bit MCU, 1MB Flash, 64MHz, QFP-176 | NXP
SPC5606SF2CLU6 ✓ ActivoNXP Semiconductors
SPC5643LFF2MMM1R - 120MHz Dual-Core MCU 1MB Flash | NXP
SPC5643LFF2MMM1R ✓ ActivoComparación de especificaciones
| Parámetro | SPC5606SF2CLU6 | SPC5643LFF2MMM1R |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $8,78 | $24,85 |
| Manufacturer | NXP Semiconductors | NXP Semiconductors (formerly Freescale) |
| Series | MPC560xS (Qorivva) | MPC5643L (MPC56xx Qorivva family) |
| Core Architecture | Power Architecture e200z0h | Power Architecture® e200z4 (dual-core with delayed lockstep) |
| Core Count | 1 | 2 (1 main + 1 lockstep checker) |
| Ancho del bus de datos | 32-bit | — |
| Frecuencia de reloj máxima | 64 MHz | — |
| Program Memory Size (Flash) | 1 MB (1024 KB) | — |
| RAM Size | [DATA_NEEDED: SRAM size] | — |
| Tensión de alimentación | 3.3 V / 5 V | — |
| Rango de temperatura de funcionamiento | -40C to +85C | -40 °C to +125 °C (automotive grade) |
| Encapsulado / Carcasa | 176-LQFP (24x24 mm) | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Número de pines | 176 | — |
| Automotive Qualification | AEC-Q100 qualified | — |
| Estado RoHS | Compliant | — |
| Terminal Form | GULL WING | — |
| Temperature Grade | INDUSTRIAL (automotive application) | — |
| Peripheral Highlights | FlexCAN, eMIOS, eQADC, SPI, I2C, SCI, LCDC | — |
| Maximum CPU Clock | — | 120 MHz |
| Program Memory (Flash) | — | 1 MB (1M x 8) |
| Data Memory (SRAM) | — | [DATA_NEEDED: SRAM size] |
| Operating Voltage Range | — | [DATA_NEEDED: VDD range, typ. 3.3 V or 5 V I/O] |
| Encapsulado | — | 257-LFBGA / MAPBGA 14x14 mm |
| AEC-Q100 Qualification | — | Yes (Automotive qualified per NXP product page) |
| Functional Safety Target | — | ISO 26262 ASIL-D capable (via lockstep + ECC + FCU) |
| Communication Interfaces | — | FlexCAN, SPI, I²C, UART (LIN-capable via SCI) |
| Debug Interface | — | Nexus (JTAG, auxiliary) |
| Lead-Free / RoHS | — | Compliant (lead-free BGA) |