SPC5606SF2CLU6 vs SPC5643LFF2MMM1R 比較
詳細並排比較 SPC5606SF2CLU6 由 NXP Semiconductors 與 SPC5643LFF2MMM1R 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
NXP Semiconductors
SPC5606SF2CLU6 - 32-bit MCU, 1MB Flash, 64MHz, QFP-176 | NXP
SPC5606SF2CLU6 ✓ 啟用中
規格比較
| 參數 | SPC5606SF2CLU6 | SPC5643LFF2MMM1R |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Manufacturer | NXP Semiconductors | NXP Semiconductors (formerly Freescale) |
| Series | MPC560xS (Qorivva) | MPC5643L (MPC56xx Qorivva family) |
| Core Architecture | Power Architecture e200z0h | Power Architecture® e200z4 (dual-core with delayed lockstep) |
| Core Count | 1 | 2 (1 main + 1 lockstep checker) |
| 資料匯流排寬度 | 32-bit | — |
| 最大時脈頻率 | 64 MHz | — |
| Program Memory Size (Flash) | 1 MB (1024 KB) | — |
| RAM Size | [DATA_NEEDED: SRAM size] | — |
| 供應電壓 | 3.3 V / 5 V | — |
| 工作溫度範圍 | -40C to +85C | -40 °C to +125 °C (automotive grade) |
| 封裝 / 外殼 | 176-LQFP (24x24 mm) | — |
| 安裝類型 | Surface Mount | Surface Mount (BGA) |
| 腳位數 | 176 | — |
| Automotive Qualification | AEC-Q100 qualified | — |
| RoHS 狀態 | Compliant | — |
| Terminal Form | GULL WING | — |
| Temperature Grade | INDUSTRIAL (automotive application) | — |
| Peripheral Highlights | FlexCAN, eMIOS, eQADC, SPI, I2C, SCI, LCDC | — |
| Maximum CPU Clock | — | 120 MHz |
| Program Memory (Flash) | — | 1 MB (1M x 8) |
| Data Memory (SRAM) | — | [DATA_NEEDED: SRAM size] |
| Operating Voltage Range | — | [DATA_NEEDED: VDD range, typ. 3.3 V or 5 V I/O] |
| 封裝 | — | 257-LFBGA / MAPBGA 14x14 mm |
| AEC-Q100 Qualification | — | Yes (Automotive qualified per NXP product page) |
| Functional Safety Target | — | ISO 26262 ASIL-D capable (via lockstep + ECC + FCU) |
| Communication Interfaces | — | FlexCAN, SPI, I²C, UART (LIN-capable via SCI) |
| Debug Interface | — | Nexus (JTAG, auxiliary) |
| Lead-Free / RoHS | — | Compliant (lead-free BGA) |