XC3S200-4FT256I vs XC3S200-4FTG256I Comparación
Comparación detallada lado a lado de XC3S200-4FT256I por AMD y XC3S200-4FTG256I por Xilinx. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | XC3S200-4FT256I | XC3S200-4FTG256I |
|---|---|---|
| Marca | AMD | Xilinx |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Activo |
| Device Type | Spartan-3 field-programmable gate array (FPGA) | — |
| System Gates | 50,000 gates | 200,000 |
| Nominal System Gates | 200,000 gates | — |
| Logic Cells / Logic Blocks | 4,320 | — |
| Frecuencia de reloj máxima | 630 MHz | — |
| Technology | 90 nm | — |
| Core Supply Voltage | 1.14 V to 1.26 V | — |
| Package Type | FTBGA-256 | — |
| Package Dimensions | 17 mm x 17 mm | — |
| Number of Terminals | 256 | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Temperatura de funcionamiento | 0 C to +85 C | -40C to +100C (Industrial) |
| Device Family | Spartan-3 | — |
| Speed Grade | -4 | -4 |
| Temperature Grade | Industrial | — |
| Estado RoHS | Compliant | Compliant (G suffix = lead-free) |
| User I/O Count | [DATA_NEEDED: user I/O count] | — |
| Block RAM | [DATA_NEEDED: block RAM resources] | 216 Kbit (12 blocks x 18 Kbit) |
| DSP Resources | [DATA_NEEDED: DSP resources] | — |
| Family | — | Spartan-3 |
| Logic Cells | — | 4,320 |
| Slices | — | 2,160 |
| Dedicated Multipliers | — | 4 (18x18) |
| DCM (Digital Clock Manager) | — | 4 |
| Maximum User I/O | — | 173 |
| Core Voltage | — | 1.2 V |
| Process Technology | — | 90 nm |
| Encapsulado | — | 256-ball FTBGA (FTG256), 17 x 17 mm |
| Terminal Form | — | Ball |
| Peak Reflow Time | — | 30 s |