XC56309VF100A vs DSP56311VF150 Comparación
Comparación detallada lado a lado de XC56309VF100A por NXP Semiconductors y DSP56311VF150 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
XC56309VF100A - 24-bit 100MHz DSP 196-MAPBGA | NXP Semiconductors
XC56309VF100A Nrnd
Comparación de especificaciones
| Parámetro | XC56309VF100A | DSP56311VF150 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | DSP | DSP |
| Estado del ciclo de vida | NRND | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $14,25 | $24,90 |
| Part Number | XC56309VF100A | — |
| Manufacturer | NXP Semiconductors (formerly Freescale/Motorola) | NXP Semiconductors (formerly Freescale) |
| Series | DSP563xx | DSP56300 (Symphony) |
| Type | Fixed-Point Digital Signal Processor (DSP) | Fixed-Point Digital Signal Processor |
| Data Word Width | 24-bit | — |
| Clock Rate | 100 MHz | — |
| Throughput | 100 MIPS | — |
| On-Chip RAM | 24 kB | 384 KB |
| Non-Volatile Memory | ROM (576 B) | — |
| Interfaces | Host Interface, SSI, SCI | — |
| Encapsulado / Carcasa | 196-LBGA (MAPBGA 15x15 mm) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | -40C to +105C (TJ) | [DATA_NEEDED: operating temperature range] |
| Packaging | Tray | — |
| Estado RoHS | Compliant (per JLCPCB listing) | [DATA_NEEDED: RoHS status] |
| Core Clock Frequency | — | 150 MHz |
| Instruction Throughput | — | 150 MIPS |
| Multiply-Accumulate Performance | — | 300 MMACS |
| Ancho del bus de datos | — | 24 bit |
| Bootstrap ROM | — | 576 B |
| Enhanced Filter Coprocessor (EFCOP) | — | Yes, parallel execution |
| DMA Channels | — | 6 |
| Serial Interfaces | — | Host Interface (HI), SSI, SCI |
| I/O Voltage | — | 3.30 V |
| Input Logic Compatibility | — | TTL-compatible |
| Encapsulado | — | 196-ball MAP-BGA (15x15 mm) |
| Process Technology | — | High-density CMOS |
| Nivel MSL | — | [DATA_NEEDED: MSL rating] |