XC56309VF100A vs DSP56311VF150 Comparação
Comparação detalhada lado a lado de XC56309VF100A por NXP Semiconductors e DSP56311VF150 por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
NXP Semiconductors
XC56309VF100A - 24-bit 100MHz DSP 196-MAPBGA | NXP Semiconductors
XC56309VF100A Nrnd
Comparação de especificações
| Parâmetro | XC56309VF100A | DSP56311VF150 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | DSP | DSP |
| Status do ciclo de vida | NRND | Obsolete |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $14,25 | $24,90 |
| Part Number | XC56309VF100A | — |
| Manufacturer | NXP Semiconductors (formerly Freescale/Motorola) | NXP Semiconductors (formerly Freescale) |
| Series | DSP563xx | DSP56300 (Symphony) |
| Type | Fixed-Point Digital Signal Processor (DSP) | Fixed-Point Digital Signal Processor |
| Data Word Width | 24-bit | — |
| Clock Rate | 100 MHz | — |
| Throughput | 100 MIPS | — |
| On-Chip RAM | 24 kB | 384 KB |
| Non-Volatile Memory | ROM (576 B) | — |
| Interfaces | Host Interface, SSI, SCI | — |
| Encapsulamento / Caixa | 196-LBGA (MAPBGA 15x15 mm) | — |
| Tipo de montagem | Surface Mount | Surface Mount |
| Temperatura de operação | -40C to +105C (TJ) | [DATA_NEEDED: operating temperature range] |
| Packaging | Tray | — |
| Status RoHS | Compliant (per JLCPCB listing) | [DATA_NEEDED: RoHS status] |
| Core Clock Frequency | — | 150 MHz |
| Instruction Throughput | — | 150 MIPS |
| Multiply-Accumulate Performance | — | 300 MMACS |
| Largura do barramento de dados | — | 24 bit |
| Bootstrap ROM | — | 576 B |
| Enhanced Filter Coprocessor (EFCOP) | — | Yes, parallel execution |
| DMA Channels | — | 6 |
| Serial Interfaces | — | Host Interface (HI), SSI, SCI |
| I/O Voltage | — | 3.30 V |
| Input Logic Compatibility | — | TTL-compatible |
| Encapsulamento | — | 196-ball MAP-BGA (15x15 mm) |
| Process Technology | — | High-density CMOS |
| Nível MSL | — | [DATA_NEEDED: MSL rating] |