XC56309VF100A vs DSP56311VF150 Comparaison
Comparaison détaillée côte à côte de XC56309VF100A par NXP Semiconductors et DSP56311VF150 par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
XC56309VF100A - 24-bit 100MHz DSP 196-MAPBGA | NXP Semiconductors
XC56309VF100A Nrnd
Comparaison des spécifications
| Paramètre | XC56309VF100A | DSP56311VF150 |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | DSP | DSP |
| Statut du cycle de vie | NRND | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $14,25 | $24,90 |
| Part Number | XC56309VF100A | — |
| Manufacturer | NXP Semiconductors (formerly Freescale/Motorola) | NXP Semiconductors (formerly Freescale) |
| Series | DSP563xx | DSP56300 (Symphony) |
| Type | Fixed-Point Digital Signal Processor (DSP) | Fixed-Point Digital Signal Processor |
| Data Word Width | 24-bit | — |
| Clock Rate | 100 MHz | — |
| Throughput | 100 MIPS | — |
| On-Chip RAM | 24 kB | 384 KB |
| Non-Volatile Memory | ROM (576 B) | — |
| Interfaces | Host Interface, SSI, SCI | — |
| Boîtier / Format | 196-LBGA (MAPBGA 15x15 mm) | — |
| Type de montage | Surface Mount | Surface Mount |
| Température de fonctionnement | -40C to +105C (TJ) | [DATA_NEEDED: operating temperature range] |
| Packaging | Tray | — |
| Statut RoHS | Compliant (per JLCPCB listing) | [DATA_NEEDED: RoHS status] |
| Core Clock Frequency | — | 150 MHz |
| Instruction Throughput | — | 150 MIPS |
| Multiply-Accumulate Performance | — | 300 MMACS |
| Largeur du bus de données | — | 24 bit |
| Bootstrap ROM | — | 576 B |
| Enhanced Filter Coprocessor (EFCOP) | — | Yes, parallel execution |
| DMA Channels | — | 6 |
| Serial Interfaces | — | Host Interface (HI), SSI, SCI |
| I/O Voltage | — | 3.30 V |
| Input Logic Compatibility | — | TTL-compatible |
| Boîtier | — | 196-ball MAP-BGA (15x15 mm) |
| Process Technology | — | High-density CMOS |
| Niveau MSL | — | [DATA_NEEDED: MSL rating] |