XC6SLX25-3FG484I vs XC6SLX25-2FG484I Comparación
Comparación detallada lado a lado de XC6SLX25-3FG484I por AMD y XC6SLX25-2FG484I por AMD. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | XC6SLX25-3FG484I | XC6SLX25-2FG484I |
|---|---|---|
| Marca | AMD | AMD |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Unknown |
| Device Type | Field Programmable Gate Array (FPGA) | Spartan-6 LX FPGA |
| FPGA Family | Spartan-6 LX | Spartan-6 LX |
| Logic Cells | 24,051 cells | 24,051 cells |
| I/O Count | 266 I/O | — |
| Internal Frequency | 500 MHz | 500 MHz |
| Speed Grade | -3 | -2 |
| Process Technology | 45 nm CMOS | — |
| Package Type | 484-BBGA | 484-BBGA |
| Package Pin Count | 484 pins | — |
| Package Body Size | 15 mm x 15 mm | — |
| Ball Pitch | 0.80 mm | — |
| Temperatura de funcionamiento | 0°C to 85°C | 0 C to 85 C |
| Lead-Free Status | Lead-free package | Contains Lead |
| Terminal Form | BGA balls | — |
| Core Supply Voltage | [DATA_NEEDED: core supply voltage] | — |
| Power Consumption | [DATA_NEEDED: typical and maximum power consumption] | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | RoHS Non-Compliant |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| Number of I/O | — | 266 I/O |
| Technology | — | 45 nm CMOS |
| Tensión de alimentación | — | 1.2 V |
| Encapsulado | — | 484-pin FBGA |
| Package Dimensions | — | 15 x 15 mm |
| Package Pitch | — | 0.80 mm |
| Terminals | — | 484 balls |
| Tipo de montaje | — | Surface Mount |
| Configuración de salida | — | Field Programmable Gate Array |
| Device Revision | — | [DATA_NEEDED: device revision] |
| Block RAM | — | [DATA_NEEDED: block RAM capacity] |
| DSP Slices | — | [DATA_NEEDED: DSP slice count] |