XC6SLX25-2FG484I - 24,051-Cell Spartan-6 LX FPGA | AMD
N.º de pieza: XC6SLX25-2FG484I ✗ Fin de vidaXC6SLX25-2FG484I Descripción general
The Spartan-6 LX FPGA family is a programmable-logic device family within the broader FPGA and semiconductor hierarchy. Unlike a fixed-function application-specific integrated circuit, an FPGA allows logic behavior, interfaces, and signal processing to be configured after manufacture. This flexibility supports design revisions, shorter product-development cycles, and consolidation of multiple control functions into one programmable device when appropriate system partitioning and validation are performed.
Key verified characteristics include 24,051 logic cells, 266 I/O, 1.2 V operation, 45 nm CMOS construction, and a 484-pin FBGA package. The -2 speed grade provides a defined performance class within the Spartan-6 LX family. The I/O count makes the device suitable for systems requiring parallel buses, multiple control signals, external memory interfaces, converters, and communication transceivers. Because the package is ball-grid and densely routed, PCB layout requires careful ball assignment, power planning, decoupling, and signal-integrity review.
Typical uses include industrial PLC and automation controllers, embedded instrumentation, communications equipment, video and image-processing front ends, and low-power control subsystems. The FPGA can implement parallel algorithms, state machines, protocol bridges, and control logic in parallel, reducing reliance on multiple discrete controllers. Its programming flexibility also allows firmware-like field updates when the surrounding flash and configuration architecture are included.
Design considerations center on thermal performance, decoupling, configuration, and high-speed board layout. The 1.2 V core and dense 484-ball package require multiple supply rails and careful placement of bypass capacitors. Designers should use the AMD Spartan-6 package pinout and device documentation for exact ball assignments, power sequencing, configuration pins, and I/O standards before layout release.
This page combines verified distributor and manufacturer-source information with package, purchasing, and engineering guidance designed to make the XC6SLX25-2FG484I selection process faster.
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Variantes de esta serie
Modelos de la misma serie compatibles directamente con XC6SLX25-2FG484I (mismo factor de forma y huella) — difiere en Speed Grade, Operating Temperature, Device Type, Lead-Free Status, Package.
XC6SLX25-2FGG484I
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XC6SLX25-3FG484I
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Ver hoja de datos →XC6SLX25-2FG484I Valores máximos y características eléctricas
| Device Type | Spartan-6 LX FPGA |
| Logic Cells | 24,051 cells |
| Number of I/O | 266 I/O |
| Technology | 45 nm CMOS |
| Tensión de alimentación | 1.2 V |
| Encapsulado | 484-pin FBGA |
| Package Type | 484-BBGA |
| Package Dimensions | 15 x 15 mm |
| Package Pitch | 0.80 mm |
| Speed Grade | -2 |
| Temperatura de funcionamiento | 0 C to 85 C |
| Internal Frequency | 500 MHz |
| Terminals | 484 balls |
| Tipo de montaje | Surface Mount |
| Lead-Free Status | Contains Lead |
| Estado RoHS | RoHS Non-Compliant |
| Configuración de salida | Field Programmable Gate Array |
| FPGA Family | Spartan-6 LX |
Guía de configuración de pines de XC6SLX25-2FG484I 0.80 mm
Configuración de pines para XC6SLX25-2FG484I (encapsulado 0.80 mm). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para XC6SLX25-2FG484I.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
XC6SLX25-2FG484I es adecuado para 6 aplicacións: Industrial Automation Controller, Communications Equipment, Embedded Instrumentation, Digital Signal Processing Front End, Programmable Control Platform, Video and Image Processing.
Industrial Automation Controller
The XC6SLX25-2FG484I is suitable for industrial automation because it combines 24,051 programmable logic cells with 266 I/O in a 484-BBGA package and supports operation from 0 C to 85 C. Its programmable architecture can implement motion sequencing, machine interlocks, sensor conditioning, actuator control, and communications protocols in parallel. The 1.2 V core and dense ball-grid package require a carefully planned multilayer PCB, but they allow a compact controller with extensive external connectivity. Compared with several fixed-function controllers, an FPGA permits logic revisions and protocol updates after manufacture. Design teams should reserve I/O for isolated sensing and drive interfaces, verify timing with the -2 speed grade, and use AMD package files to assign power, configuration, clock, and differential I/O balls.
Recomendado
Communications Equipment
The XC6SLX25-2FG484I can support communications equipment requiring parallel packet handling, framing, buffering, and interface conversion. Its 24,051 logic cells provide substantial parallel processing capacity, while 266 I/O permit connection to transceivers, memories, and backplane signals. The -2 speed grade and verified internal-frequency listing of 500 MHz provide a basis for clocked designs, although system-level timing must be validated with the actual tool flow and board. For a communications line card, the FPGA can implement framing, CRC, filtering, and data-rate adaptation in parallel. The 484-BBGA package makes short escape routes practical for high-speed digital interfaces, although power and return-path planning remain critical. Differential pairs, clocks, and configuration lines should follow AMD and board-design guidance.
Recomendado
Embedded Instrumentation
The XC6SLX25-2FG484I fits embedded instrumentation that combines acquisition control, digital filtering, calibration, and a user interface. Its 266 available I/O can support parallel ADC and DAC connections, external memory, status indicators, and communication ports, while the programmable logic allows filtering algorithms and timing sequences to be updated independently. The 0 C to 85 C range is suitable for many industrial laboratory environments. A practical design can place the FPGA beside converters and interface transceivers, with separate routing for analog and digital grounds. Because the device uses a 1.2 V core in a dense 484-ball FBGA, designers must validate regulator capacity, decoupling, thermal rise, and configuration memory before layout release. Timing analysis should use the -2 device model to avoid optimistic results.
Recomendado
Digital Signal Processing Front End
The XC6SLX25-2FG484I is applicable to digital signal-processing front ends that require parallel arithmetic, real-time timing, and numerous data connections. The verified 24,051-cell density and 500 MHz internal-frequency listing make it relevant to filtering, decimation, correlation, and fixed-point processing designs. Its 266 I/O can connect to parallel converters, capture memory, and data-processing peripherals, while the -2 grade provides a defined timing target for system implementation. The FPGA should use synchronized clocking and pipeline stages that meet timing at the selected speed grade. In a mixed-signal instrument, separate analog and digital sections can reduce coupling, but the dense 484-BBGA footprint still requires solid reference planes and close decoupling. Verify exact DSP resources and memory specifications in the manufacturer datasheet because those values were not included in the supplied data.
Recomendado
Programmable Control Platform
The XC6SLX25-2FG484I can serve as the programmable control platform for equipment requiring multiple independent I/O groups and field-updatable behavior. Its 24,051 logic cells support state machines, timing units, counters, protocols, and supervisory logic in one device, while the -2 speed grade is appropriate for designs whose timing budget has been closed at that grade. Configuration flash, clock generation, reset supervision, and communication interfaces can surround the FPGA to form a reusable control platform. The industrial temperature range supports factory equipment, but enclosure temperature, airflow, and power dissipation must still be considered. Engineers should keep configuration and clock routing away from noisy switching paths, provide deterministic reset behavior, and test bitstream reload procedures. Because exact configuration supply requirements were not supplied, consult the AMD device documentation before final schematic completion.
Recomendado
Video and Image Processing
The XC6SLX25-2FG484I is suitable for embedded video and image-processing functions that require parallel pixel pipelines, control logic, and external memory interfaces. The 24,051-cell Spartan-6 LX device can implement filtering, color conversion, timing generation, and interface bridging while its 266 I/O connect to sensors, capture devices, or display controllers. The 484-BBGA package supports compact integration on a multilayer PCB, provided the design accounts for its 0.80 mm pitch and 1.2 V core supply. Video designs are especially sensitive to clock jitter, return-path discontinuities, and crosstalk, so clocks and high-speed interfaces should be routed with reference planes and controlled impedance. Signal integrity and timing must be verified for the actual board stack-up. Exact video-specific I/O standards and supported memory interfaces should be confirmed from AMD documentation.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para XC6SLX25-2FG484I — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | XC6SLX25-2FGG484I | XC6SLX25-2FG484C | XC6SLX25-2FGG484C | XC6SLX25-3FG484I |
|---|---|---|---|---|---|
| Package | 484-BBGA | 484-BBGA | 484-BBGA | 484-BBGA | 484-BBGA |
| Brand | AMD | AMD | AMD | AMD | AMD |
| FPGA Family | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX |
| Logic Cells | 24,051 cells | 24,051 cells | 24,051 cells | 24,051 cells | 24,051 cells |
| Number of I/O | 266 I/O | 266 I/O | 266 I/O | 266 I/O | 266 I/O |
| Technology | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Speed Grade | -2 | -2 | -2 | -2 | -3 |
| Operating Temperature | 0 C to 85 C industrial | Industrial grade indicated by I | Commercial grade indicated by C | Commercial grade indicated by C | Industrial grade indicated by I |
Diferenciadores clave
- Industrial temperature option with the same core density (frente a XC6SLX25-2FG484C)
- Defined -2 performance class with substantial programmable resources (frente a XC6SLX25-3FG484I)
- High-density 266-I/O interface in the verified 484-BBGA package (frente a XC6SLX25-2FGG484I)
Notas de diseño
Use the official AMD Spartan-6 package files to assign every 484-ball position before schematic and PCB layout release. The supplied data identifies a 15 x 15 mm body with 0.80 mm pitch, which requires escape routing through a multilayer stack-up and careful via placement. Keep power and ground ball escapes direct, preserve continuous reference planes beneath high-speed routes, and validate pad, solder-mask, and paste geometry with the PCB assembler's capability requirements.
Do not derive a complete power tree from the verified 1.2 V core figure alone. Obtain the complete AMD power, auxiliary-supply, I/O-supply, sequencing, and configuration requirements from the manufacturer documentation. Place local high-frequency decoupling directly at the relevant supply balls and separate noisy switching supplies from sensitive FPGA rails where the architecture permits. Validate source current, droop, startup sequencing, and worst-case utilization in the final power tree.
The 484-BBGA package has many solder balls and a dense 15 x 15 mm footprint, so pad escape and via patterns strongly influence thermal performance. Use the manufacturer's recommended land pattern and thermal-via guidance, maintain copper under the device where permitted, and model the actual PCB stack-up and enclosure. Thermal analysis should include adjacent regulators, memory, and forced-air conditions rather than relying on a generic junction-temperature estimate.
Clock and high-speed I/O routing in the 484-BBGA package should use short, symmetric paths with continuous return paths and no plane splits. Apply the I/O standard, board impedance, and timing constraints from the selected AMD device and board-design documentation. Keep configuration pins away from noisy adjacent sources, apply defined series termination only where the device guidance requires it, and perform post-layout signal-integrity simulations for interfaces operating near device limits.
Do not treat FG and FGG ordering identifiers, or I and C temperature suffixes, as automatically interchangeable. Verify the complete ordering code, package ballout, speed grade, temperature range, and lifecycle status with AMD before purchasing a substitute. Likewise, a distributor search result does not by itself confirm pin compatibility, and programming support may be affected by device, package, and revision combinations.
Información de cumplimiento
The verified Digchip specification states RoHS Non-Compliant and Contains Lead for this exact MPN. Other environmental and conflict-minerals declarations were not present in the supplied data.
