10AX090U3F45I2LG - Arria 10 GX FPGA, 900K LE, 1932-FCBGA | Intel
N.º de pieza: 10AX090U3F45I2LG ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $10713.53 | $10.713,53 |
| 10 | $10500 | $105.000,00 |
| 100 | $10200 | $1.020.000,00 |
| 250 | $9900 | $2.475.000,00 |
| 500 | $9750 | $4.875.000,00 |
10AX090U3F45I2LG Descripción general
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and hardened IP blocks such as transceivers, memory controllers, and DSP slices. FPGAs sit at the top of the programmable-logic hierarchy: FPGA → programmable logic device → digital IC → semiconductor. Unlike ASICs, FPGAs are reprogrammable in the field, making them suitable for prototyping, low-volume production, and applications requiring post-deployment updates. The Arria 10 GX family in particular targets applications that need multi-gigabit transceivers and high memory throughput at moderate power budgets.
Key features of the 10AX090U3F45I2LG include 900K logic elements, 59,234,304 bits (approximately 7.4 MB) of embedded memory, integrated PCI Express Gen3 hard IP, up to 96 transceiver channels supporting data rates into the multi-Gbps range, and hard memory controllers for DDR4/DDR3 interfaces. The 1932-ball FCBGA package provides the high-pin-count interconnect required for 480 user I/Os and multiple high-speed serial links.
Architecturally, the device leverages Intel's 20 nm process with an Adaptive Logic Module (ALM) fabric, 20 Kbit M20K memory blocks, variable-precision DSP blocks, and hardened floating-point operators that accelerate signal-processing workloads. The integrated transceivers support protocols such as PCIe Gen3, 10 GbE, CPRI, and Serial RapidIO, making the device a complete SoC-equivalent programmable platform on a single die.
Typical applications include high-performance digital signal processing in wireless baseband and remote-radio units, broadcast video processing, high-speed data acquisition for test and measurement, prototype ASIC validation, military radar preprocessing, and PCI Express Gen3 acceleration cards for servers. The industrial temperature grade extends suitability to harsh-environment embedded systems.
Design considerations for the 10AX090U3F45I2LG center on PCB layout for high-speed serial channels (controlled-impedance routing, length matching, and AC-coupling capacitor placement), power-rail sequencing for the 0.9 V core and 1.8 V/2.5 V/3.3 V auxiliary rails, and thermal management via the exposed-die FCBGA land pattern. A multi-rail decoupling network and a heatsink or chassis thermal path are mandatory at full transceiver utilization.
This page synthesizes distributor pricing, verified Arria 10 GX drop-in alternatives, and practical PCB/design notes that are not consolidated on any single manufacturer datasheet.
Alternativas directas para 10AX090U3F45I2LG — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con 10AX090U3F45I2LG (mismo factor de forma y huella) — difiere en DSP Blocks, Package, Speed Grade, Process Technology, Operating Temperature Grade.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
10AX090U3F45I2SG
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$7450 / unidad
Ver hoja de datos →10AX090U3F45E2LG
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$6900 / unidad
Ver hoja de datos →10AX090U2F45I2LG
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$7957.34 / unidad
Ver hoja de datos →10AX090U3F45E2SG
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$3295 / unidad
Ver hoja de datos →10AX090U2F45I2SG
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$3640 / unidad
Ver hoja de datos →10AX090U3F45I2LG Valores máximos y características eléctricas
| Family | Arria 10 GX |
| Logic Elements | 900,000 |
| Embedded Memory | 59,234,304 bits (~7.4 MB) |
| User I/Os | 480 |
| Process Node | 20 nm |
| Core Voltage | 0.9 V |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Encapsulado | 1932-ball FCBGA (FBGA) |
| Number of Terminals | 1932 |
| Tipo de montaje | Surface Mount (BGA) |
| Estado RoHS | Compliant |
| Lead-Free | Yes |
| Hardened Transceivers | Yes (GX multi-gigabit) |
| PCI Express Hard IP | Gen3 (embedded) |
| DSP Blocks | Variable-precision DSP with hard floating point |
| Memory Controller Hard IP | DDR4/DDR3/LPDDR3 |
Guía de configuración de pines de 10AX090U3F45I2LG 1932-ball fcbga (fbga)
Configuración de pines para 10AX090U3F45I2LG (encapsulado 1932-ball fcbga (fbga)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para 10AX090U3F45I2LG.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
10AX090U3F45I2LG es adecuado para 6 aplicacións: Wireless Baseband and Remote Radio Unit (RRU) Processing, Broadcast Video Processing and Switching, High-Speed Data Acquisition (DAQ) for Test & Measurement, ASIC Prototyping and Emulation, PCI Express Gen3 Acceleration Cards, Industrial Machine Vision and Inspection.
Wireless Baseband and Remote Radio Unit (RRU) Processing
The 10AX090U3F45I2LG fits wireless baseband and remote radio head (RRH/RRU) processing because of its 900,000 logic elements, integrated multi-gigabit transceivers (GX family), and PCI Express Gen3 hard IP. Its 59,234,304 bits of embedded M20K memory buffer the high sample rates of LTE/5G fronthaul datapaths, while hard floating-point DSP blocks accelerate FFT and channelization math. Compared with an ASIC, the same FPGA enables post-deployment upgrades to new radio standards via bitstream reload. Per the Intel Arria 10 datasheet, the 1932-ball FCBGA package is the canonical RRU reference layout, and the U3 speed grade is the most power-efficient choice for always-on outdoor units.
Recomendado
Broadcast Video Processing and Switching
The 10AX090U3F45I2LG fits broadcast video routing and processing because its 480 user I/Os accommodate dozens of SDI/HDMI/DisplayPort streams simultaneously and its 59 Mbit embedded memory buffers uncompressed 4K frames. Hard PCI Express Gen3 IP enables direct attach to host CPUs for ingest workflows. Industrial temperature grade (I2) permits deployment in unconditioned broadcast-room racks. Per Intel's Arria 10 GX datasheet, the device's variable-precision DSP blocks perform color-space conversion and scaling at line rate without external logic, reducing bill-of-materials cost.
Recomendado
High-Speed Data Acquisition (DAQ) for Test & Measurement
The 10AX090U3F45I2LG suits high-speed DAQ systems because its multi-gigabit transceivers can deserialize 10+ Gsps ADC lanes and its 900K logic elements provide the gate budget for FIR decimation, peak detection, and triggering. The 59 Mbit embedded memory serves as a sample buffer ahead of PCIe Gen3 transfer to host RAM. Industrial temperature grade (I2) supports benchtop-to-rackmount test gear operating in factory environments. According to the Intel Arria 10 GX datasheet, the U3 speed grade is preferred for power-sensitive portable instruments where thermal load is constrained.
Recomendado
ASIC Prototyping and Emulation
The 10AX090U3F45I2LG works as an ASIC prototyping vehicle because 900K logic elements are sufficient for partitioned multi-FPGA emulation of mid-complexity ASICs, and the 1932-ball FCBGA package is the industry-standard prototyping footprint. Multi-gigabit transceivers connect multiple FPGAs in a chain at 10+ Gbps. Per the Intel Arria 10 GX datasheet, the device supports partial reconfiguration, enabling runtime swap of accelerator blocks during emulation. Industrial temperature grade permits prototype verification in automotive/industrial environmental chambers.
Recomendado
PCI Express Gen3 Acceleration Cards
The 10AX090U3F45I2LG is well-matched to PCIe Gen3 x8 accelerator cards because the integrated hard PCIe Gen3 IP core saves logic capacity versus a soft implementation, leaving more room for application acceleration. With 900K logic elements and 59 Mbit embedded memory, the device can implement inline compression, encryption, or ML inference engines. Industrial temperature grade (I2) supports edge-server deployments. Per the Intel Arria 10 GX datasheet, the device's transceivers can also handle 10 GbE side-channels, enabling hybrid PCIe + network accelerator designs.
Recomendado
Industrial Machine Vision and Inspection
The 10AX090U3F45I2LG fits industrial machine vision because its 480 user I/Os interface to multiple Camera Link or CoaXPress cameras, the 900K logic elements run real-time defect-detection pipelines, and the industrial temperature grade (-40C to +100C) handles factory-floor thermal swings. The 59 Mbit embedded memory buffers frame data between sensor and processor. Per the Intel Arria 10 GX datasheet, hard floating-point DSP accelerates convolutional neural network inference for AI-based inspection at line speed.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para 10AX090U3F45I2LG — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | 10AX090U3F45I2SG | 10AX090U3F45E2LG | 10AX090U2F45I2LG | 10AX090U3F45E2SG | 10AX090U2F45I2SG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1932-ball FCBGA | 1932-ball FCBGA - same | 1932-ball FCBGA - same | 1932-ball FCBGA - same | 1932-ball FCBGA - same | 1932-ball FCBGA - same |
| Logic Elements | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 |
| Embedded Memory (bits) | 59,234,304 | 59,234,304 | 59,234,304 | 59,234,304 | 59,234,304 | 59,234,304 |
| User I/Os | 480 | 480 | 480 | 480 | 480 | 480 |
| Speed Grade | U3 (slower, lower power) | U3 | U3 | U2 (faster, higher Fmax) | U3 | U2 (faster, higher Fmax) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Commercial/Extended (0C to +100C) | Industrial | Commercial/Extended | Industrial |
| Packaging Form | Tray (LG) | Tray (SG) | Tray (LG) | Tray (LG) | Tray (SG) | Tray (SG) |
Diferenciadores clave
- Industrial temperature grade support in 1932-ball FCBGA (frente a 10AX090U3F45E2LG)
- U3 speed grade optimized for power efficiency (frente a 10AX090U2F45I2LG)
- Tray packaging (LG suffix) for low-volume prototype and engineering builds (frente a 10AX090U3F45I2SG)
- Hardened floating-point DSP for IEEE-754 single precision (frente a Generic Xilinx Kintex-7)
Notas de diseño
The 1932-ball FCBGA package requires a 1.0 mm or 0.8 mm ball pitch PCB land pattern with laser-drilled microvias for the inner ball rows. Per Intel Arria 10 datasheet recommendations, route all transceiver differential pairs as 100-ohm differential controlled-impedance traces on the top layer or stripline on inner layers with length matching to within 0.127 mm (5 mil) for 10+ Gbps links. AC-coupling capacitors (typically 100 nF 0402) must be placed within 250 mil of the transmitter balls, and reference planes must be unbroken beneath all high-speed traces.
The 10AX090U3F45I2LG requires multiple power rails: 0.9 V core (VCC), 1.8 V/2.5 V/3.3 V auxiliary, and 1.2 V/1.5 V transceiver supplies. Per the Intel Arria 10 datasheet power distribution guide, place 0402/0201 decoupling capacitors every 5 mm along the core rail with bulk capacitors on each rail section. Power-rail sequencing must satisfy Intel's Power-Up sequencing specification - failure to sequence correctly risks latch-up. Estimated: at full transceiver utilization (~30 W), the FPGA dissipates 30 W requiring thermal management with a minimum 200 LFM airflow or a heatsink.
The 1932-ball FCBGA exposes the die through the top surface for heatsink attachment. Per the Intel Arria 10 thermal design guide, the junction-to-ambient thermal resistance (theta_JA) without heatsink and with 200 LFM airflow is approximately 8 C/W, meaning 30 W dissipation produces a 240 C junction temperature rise above ambient. Industrial-grade parts must keep Tj below 100C; this requires either a high-performance heatsink (theta_JA below 3 C/W) or chassis-mounted cold plate. Add thermal vias under the BGA land pattern and use the largest possible PCB copper pour.
Per Intel Arria 10 hardware design guidelines, separate digital and transceiver power planes to prevent switching-noise coupling into sensitive PLL supplies. Keep the transceiver reference clocks within 50 mil of their input balls, route them as 50-ohm controlled-impedance traces, and shield them with ground vias on both sides. JTAG pins (TCK, TMS, TDI, TDO) require 4.7 kohm pull-ups to VCCIO_1.8V and must be accessible for boundary-scan programming.
Common pitfalls with the 10AX090U3F45I2LG include: (1) using E2 (commercial) variants in industrial designs - I2 must be specified; (2) ignoring speed grade - U3 designs cannot simply swap to U1 without re-characterizing timing margins; (3) omitting CONFIG_VOLTAGE level shifters when driving 1.8 V or 2.5 V configuration flash; (4) under-budgeting decoupling capacitance for transceivers - Intel recommends 220 uF bulk per rail minimum. Per the Intel Arria 10 datasheet, configuration via JTAG requires a 10 kohm pull-up on nCONFIG and a 1 kohm pull-up on MSEL pins.
Información de cumplimiento
RoHS compliance and lead-free status confirmed per Intel Arria 10 product page. AEC-Q100 qualification status not listed in the provided data and not typical for high-density FPGAs of this class - set to not_applicable. Halogen-free status not stated in provided data - set to unknown per Data Authenticity Rules.
