10AX090U3F45E2LG - Arria 10 GX 900K LE FPGA 1932-FCBGA | Intel
MPN: 10AX090U3F45E2LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8500 | $8,500.00 |
| 10 | $8200 | $82,000.00 |
| 100 | $7800 | $780,000.00 |
| 500 | $7350 | $3,675,000.00 |
| 1,000 | $6900 | $6,900,000.00 |
10AX090U3F45E2LG Overview
A Field-Programmable Gate Array (FPGA) is a semiconductor device whose digital logic fabric, interconnect, and I/O can be reconfigured after manufacturing by loading a user-defined bitstream. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) -> programmable logic ICs -> integrated circuits -> semiconductors, and are differentiated from CPLDs (lower density, non-volatile) and ASICs (fixed function). The Arria 10 family targets applications that need ASIC-class performance-per-watt with FPGA flexibility, bridging between the lower-cost Cyclone series and the high-end Stratix series.
Key features of the 10AX090U3F45E2LG include up to 28.05 Gbps backplane-capable transceivers, hardened PCI Express Gen3 x8 controllers, hardened 10 GbE and 100 GbE MACs, partial reconfiguration support, and advanced DSP blocks optimized for wireless baseband and video processing. The device also integrates high-speed external memory interfaces supporting DDR4, DDR3, QDR IV, and RLDRAM 3 with hardened PHY, enabling high-bandwidth data buffering without consuming FPGA fabric resources.
Typical applications for this part span 4K/8K video broadcast equipment, 100G optical transport network line cards, LTE and 5G baseband processing, military radar signal processing, medical imaging accelerators, and high-performance computing (HPC) prototyping. The 1932-ball FCBGA package provides the high pin density required for hundreds of serial links and parallel memory interfaces while supporting the thermal envelope necessary for sustained operation at high toggle rates.
When designing with this device, pay particular attention to PCB stackup and signal integrity at the BGA breakout - the FCBGA's 1.0 mm pitch (typical for this class) requires laser-drilled or sequential-lamination microvia HDI stackups. Power delivery must use a high-density core rail with hundreds of decoupling capacitors and a high-efficiency PoL converter stage capable of delivering the device's high transient current. Use Intel Quartus Prime for synthesis, place-and-route, and timing closure.
Drop-in alternatives for 10AX090U3F45E2LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with 10AX090U3F45E2LG (same form factor and footprint) — differing in Package, Process Technology, DSP Blocks, Embedded Memory, Operating Temperature Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AX090U3F45E2SG
✅ Drop-In✓ In Stock
$3295 / Unit
View Datasheet →10AX090U3F45E1LG
✅ Drop-In📋 Reference alternative (not in catalog)
10AX090U2F45E2LG
✅ Drop-In✓ In Stock
$3647.5 / Unit
View Datasheet →10AX090U3F45I2LG
✅ Drop-In✓ In Stock
$9750 / Unit
View Datasheet →10AX090U3F45I2SG
✅ Drop-In✓ In Stock
$7450 / Unit
View Datasheet →10AX090U3F45E2LG Maximum Ratings & Electrical Characteristics
| Series | Arria 10 GX |
| Logic Elements (LE) | 900,000 |
| Embedded Memory Bits | 59,234,304 bits |
| Number of Transceivers | 48 transceiver macro channels (480 I/O references) |
| Hard Memory Controllers | Yes - DDR4, DDR3, QDR IV, RLDRAM 3 with hardened PHY |
| Hard PCIe Controllers | PCIe Gen3 x8 |
| Hard Ethernet MACs | 10GbE and 100GbE MACs |
| Maximum User I/O Pins | 480 (per DigiKey listing) |
| Package | 1932-BBGA, FCBGA |
| Operating Temperature Grade | OTHER / Extended (per Partstack listing) |
| Process Technology | 20nm TSMC |
| Configuration Method | Serial (active/passive) and parallel via Quartus Prime |
| RoHS Status | Compliant |
| Development Tool | Intel Quartus Prime |
10AX090U3F45E2LG 1932-bbga, fcbga Pin Configuration Guide
Pin configuration for 10AX090U3F45E2LG (1932-bbga, fcbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX090U3F45E2LG.
Refer to the datasheet for full pin configuration.
Typical Applications
10AX090U3F45E2LG is suitable for 7 applications: 100G Optical Transport Network Line Card, 4K/8K Video Broadcast Encoder/Decoder, 5G/LTE Baseband Processing Platform, Military Radar Signal Processing, Medical Imaging Accelerator (CT/MRI), High-Performance Computing Prototyping, Network Interface Card with On-Board Processing.
100G Optical Transport Network Line Card
The 10AX090U3F45E2LG is well-suited for 100G OTN line cards because of its hard 100 GbE and 10 GbE MACs, hardened PCS for OTU4 framing, and 48 transceiver macro channels supporting rates up to 28.05 Gbps. The 900K logic elements and 59.23 Mbits of embedded memory provide capacity for OTN framer, mapper, and FEC encoder logic without exhausting fabric resources. Hard DDR4 controllers at up to 1,600 Mbps enable deep packet buffer FIFOs, eliminating soft memory interfaces and freeing DSP blocks for traffic management.
Recommended
4K/8K Video Broadcast Encoder/Decoder
In 4K and 8K broadcast encoders, the 10AX090U3F45E2LG delivers the DSP throughput needed for real-time HEVC/H.265 and AVC/H.264 compression at 60 fps. The variable-precision DSP blocks accelerate motion estimation and transform coding, while the hard memory controllers sustain DDR4 read/write bandwidth for raw 4K video frames. The 480 user I/Os accommodate multiple 12G-SDI and HDMI 2.0 input/output streams without external multiplexer ICs.
Recommended
5G/LTE Baseband Processing Platform
The 10AX090U3F45E2LG is widely deployed in 5G and LTE baseband units where its combination of hardened CPRI/OBSAI interfaces (over transceivers), floating-point capable DSP blocks, and 900K LE matches the resource budget for PHY-layer acceleration. The hardened PCIe Gen3 x8 controller provides the host interface to baseband server cards, while the high transceiver count enables multiple radio unit (RU) connections via CPRI Option 7-2 at 10.1 Gbps per link.
Recommended
Military Radar Signal Processing
Radar systems rely on the 10AX090U3F45E2LG for real-time FFT computation and pulse-Doppler processing. The variable-precision DSP blocks implement multi-channel FFTs at sample rates exceeding 1 GSPS, while the 59.23 Mbits of embedded memory hold windowing coefficients and overlap-save buffers. The 1932-ball FCBGA package supports the thermal envelope of sustained operation, and the hardened 10 GbE MACs enable raw radar data streaming to downstream signal processors.
Recommended
Medical Imaging Accelerator (CT/MRI)
In CT and MRI image reconstruction, the 10AX090U3F45E2LG provides the DSP parallelism required for back-projection and iterative reconstruction algorithms. The hard memory controllers sustain DDR4-2400 bandwidth for raw sensor data, while the high logic capacity holds reconstructed image buffers. Its high-reliability 20nm process and long-term Intel lifecycle support suit the 10-15 year service life of medical imaging equipment.
Recommended
High-Performance Computing Prototyping
HPC architects use the 10AX090U3F45E2LG as an ASIC prototyping platform because of its 900K LE capacity, 28.05 Gbps transceivers for chip-to-chip interconnect emulation, and abundant DSP blocks. The hardened PCIe Gen3 and 100 GbE MACs allow direct attachment to host CPU sockets via FPGA-based prototyping boards. The Quartus Prime toolchain supports rapid design iteration with cycle-accurate simulation, enabling pre-silicon software development.
Recommended
Network Interface Card with On-Board Processing
Smart NIC designs leverage the 10AX090U3F45E2LG for in-line packet processing, kernel bypass, and storage offload. The hard 10 GbE/100 GbE MACs interface directly to SFP+/QSFP28 optical modules via the 28 Gbps transceivers, while the PCIe Gen3 x8 link connects to the host CPU. The 900K LE fabric holds TCAM-based flow tables and cryptographic accelerators, offloading work from the host CPU and reducing data-center total cost of ownership.
Recommended
Recommended Products Summary
Engineering reference data for 10AX090U3F45E2LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX090U3F45E2SG | 10AX090U3F45E1LG | 10AX090U2F45E2LG | 10AX090U3F45I2LG | 10AX090U3F45I2SG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1932-FCBGA (F45) | 1932-FCBGA (F45) - same | 1932-FCBGA (F45) - same | 1932-FCBGA (F45) - same | 1932-FCBGA (F45) - same | 1932-FCBGA (F45) - same |
| Logic Elements | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 |
| Transceiver Grade | U3 (28.05 Gbps) | U3 (28.05 Gbps) | U3 (28.05 Gbps) | U2 (17.4 Gbps) | U3 (28.05 Gbps) | U3 (28.05 Gbps) |
| Speed Grade | -2 (E2) | -2 | -1 | -2 | -2 | -2 |
| Temperature Grade | E2 (Extended) | E2 (Extended) | E1 (Extended) | E2 (Extended) | I2 (Industrial) | I2 (Industrial) |
| Embedded Memory Bits | 59,234,304 | 59,234,304 | 59,234,304 | 59,234,304 | 59,234,304 | 59,234,304 |
| Packaging Format | Tray | Tape & Reel | Tray | Tray | Tray | Tape & Reel |
Key Differentiators
- Highest available transceiver data rate in the 10AX090 F45 family (vs 10AX090U2F45E2LG)
- Highest available speed grade for the Arria 10 GX 900K LE die (vs 10AX090U3F45E1LG)
- Extended temperature range optimized for commercial and industrial deployments (vs 10AX090U3F45I2LG)
Design Notes
The 1932-ball FCBGA package of the 10AX090U3F45E2LG requires an HDI PCB stackup with laser-drilled microvias or sequential lamination to escape the dense BGA field. Plan for a 14-16 layer stackup with at least 4 ground layers and a high-density core rail. The package's thermal pad needs a 4-6 oz copper plane stitched with thermal vias (typically 0.3 mm drill on 0.6 mm pitch, 8-12 vias per cm^2) to meet the device's sustained current demand at maximum toggle rates. Signal-integrity simulation is mandatory at the 28.05 Gbps transceiver speeds - use HyperLynx or ANSYS SIwave.
Estimated: At 100% logic utilization and 80% toggle rate, the 10AX090U3F45E2LG dissipates approximately 25-35 W of power depending on transceiver utilization. The 1932-FCBGA package has theta_JA of approximately 8-10 C/W with a properly designed thermal pad and airflow of 200 LFM. Above 30 W, forced-air cooling with at least 1 m/s airflow is mandatory. For fanless applications, derate logic utilization to 60% or use the lower-speed 10AX090U3F45E1LG variant which consumes ~15% less dynamic power.
Do not mix -1 and -2 speed grade variants in the same JTAG chain without checking the Quartus Prime multi-device JTAG configuration rules. The 10AX090U3F45E2LG's configuration flash interface is sensitive to voltage rise time - use Intel's recommended 25 MHz reference clock on the MSEL pins. LVDS channels require external 100-ohm differential termination matching the trace impedance, not the parallel termination built into the FPGA's I/O structures, for data rates above 1 Gbps.
The 10AX090U3F45E2LG requires multiple supply rails: 0.95V core, 0.95V transceiver analog, 1.5V/1.8V transceiver auxiliary, and 1.5V/1.8V/2.5V/3.3V I/O. Use a high-density 12-phase PoL converter stage for the core rail - the device draws peak transient currents of up to 80 A during logic block switching events. Decoupling must include at least 200 low-ESR MLCCs of 10 nF/100 nF/1 uF mix on the bottom layer directly under the BGA. SmartPower in Quartus Prime can estimate current draw per rail to size your PoL stages correctly.
At 28.05 Gbps, every millimeter of BGA breakout trace matters. Use Intel's pin-out tool to identify signal assignments that allow straight-through breakout routing for high-speed serial links. Reference clocks require 50-ohm controlled impedance with guard traces on both sides and length matching to within 5 mils across all transceiver channels. For the DDR4 interfaces, follow Intel's External Memory Interface Handbook pin-out guidelines and run IBIS-AMI simulations through the controller's hard PHY - the hard PHY handles the bulk of signal integrity but still requires clean PCB layout.
Compliance Information
RoHS and REACH compliance per Intel product page. Not AEC-Q100 qualified - FPGAs are not typically AEC-Q100 qualified; for automotive, refer to Intel Cyclone V or newer automotive-grade FPGAs. Conflict-mineral compliance per Intel's published CMRT filings.