10AX090U2F45I2LG - Arria 10 GX 900K LE FPGA | Intel / Altera
MPN: 10AX090U2F45I2LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $11367.63 | $11,367.63 |
| 10 | $10230.87 | $102,308.70 |
| 100 | $9094.1 | $909,410.00 |
| 500 | $8525.73 | $4,262,865.00 |
| 1,000 | $7957.34 | $7,957,340.00 |
Drop-in alternatives for 10AX090U2F45I2LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AX090U2F45I1SG
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View Datasheet →10AX090U2F45E2LG
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View Datasheet →10AX090U2F45E2SG
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$5995 / Unit
View Datasheet →10AX090U2F45E1SG
✅ Drop-In✓ In Stock
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View Datasheet →10AX090U1F45I1SG
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View Datasheet →10AX090U1F45E1SG
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View Datasheet →10AX090U2F45I2LG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 GX |
| Logic Elements | 900,000 |
| Embedded Memory (Bits) | 59,234,304 |
| User I/O Count | 480 |
| Number of Terminals | 1932 |
| Package Type | 1932-BBGA, FCBGA |
| Package Code | BGA, FCBGA, square |
| Form of Terminal | Ball |
| Operating Temperature Grade | Industrial |
| Process Technology | 20 nm |
| Speed Grade | F45 |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Lead-Free | Yes |
10AX090U2F45I2LG bga, fcbga, square Pin Configuration Guide
Complete pinout information for 10AX090U2F45I2LG (bga, fcbga, square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX090U2F45I2LG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX090U2F45I2LG is suitable for 6 applications: 100G/400G Networking Line Cards, Wireless Baseband Processing, Broadcast Video Processing, Medical Imaging Systems, ASIC Prototyping, High-Performance Industrial Test Equipment.
100G/400G Networking Line Cards
The 10AX090U2F45I2LG is well-suited for 100G/400G Ethernet line cards and switch fabrics because the Arria 10 GX architecture provides up to 28.3 Gbps transceivers (24 channels on this die), enabling multiple 100G ports with MAC and PCS hard IP offload. The 900K logic elements and 7.2 MB embedded memory handle packet headers, lookup tables, and traffic manager functions without external memory contention. The 480 user I/O support QSFP28 / QSFP-DD cage interfaces alongside board control logic. Industrial temperature grade ensures reliability in thermally-loaded switch chassis. Quartus Prime Pro provides hardened 100G MAC + PCS + FEC IP, accelerating time-to-market for telecom-grade designs.
Recommended
Wireless Baseband Processing
The 10AX090U2F45I2LG serves wireless baseband and radio unit (RRU) baseband applications because the 900K LE fabric implements LTE and 5G NR physical-layer functions including channel coding, FFT/iFFT, and MIMO detection. The hardened floating-point DSP blocks deliver up to 1.5 TFLOPs compute density, offloading turbo decoder and LDPC functions from soft cores. High-speed transceivers connect directly to RF ADC/DAC via JESD204B/C interfaces, eliminating FPGA-to-converter glue logic. The 1932-ball FCBGA package supports the high I/O count required for multi-antenna radio designs. Industrial temperature grade supports outdoor and thermally-challenged base station installations.
Recommended
Broadcast Video Processing
The 10AX090U2F45I2LG is widely deployed in broadcast video processing equipment, including contribution encoders, playout servers, and video routing switchers. The 7.2 MB embedded memory and 900K LE fabric implement multi-stream HEVC/H.264 encoding with motion estimation and rate control. High-speed transceivers handle uncompressed 12G-SDI / UHD-SDI interfaces for broadcast video routers, supporting SMPTE ST 2082 and ST 425 standards. The 480 user I/O support HDMI 2.0, DisplayPort 1.4, and SDI connectivity simultaneously. Industrial temperature grade and 1932-ball FCBGA package meet professional broadcast equipment thermal and reliability requirements for 24/7 operation.
Recommended
Medical Imaging Systems
The 10AX090U2F45I2LG serves medical imaging systems such as CT, MRI, and ultrasound scanners because the 900K LE fabric implements real-time beamforming, image reconstruction (back-projection, FBP, iterative reconstruction), and DICOM preprocessing pipelines. The 7.2 MB embedded memory holds intermediate image slices, and the 24 transceiver channels connect to multi-element ultrasound transducer arrays at JESD204B rates. The industrial temperature grade supports continuous operation in medical equipment environments. PCI Express Gen3 hard IP enables direct attachment to host CPUs for image transfer. The 1932-ball FCBGA package provides the high I/O count required for parallel transducer interfaces.
Recommended
ASIC Prototyping
The 10AX090U2F45I2LG is widely used as an ASIC prototyping platform because the 900K LE fabric maps medium-complexity ASIC RTL with reasonable timing closure on the F45 speed grade. The 7.2 MB embedded memory replaces SRAM macros, and the 480 user I/O support ASIC peripheral pinout emulation. Multiple Arria 10 devices can be partitioned on a single prototyping board using high-speed transceiver channels to bridge between FPGAs. Quartus Prime Pro supports ASIC-style synthesis flows and constraint entry. The 1932-ball FCBGA package provides a manufacturable form factor suitable for prototype bring-up labs and customer evaluation platforms before ASIC tape-out.
Recommended
High-Performance Industrial Test Equipment
The 10AX090U2F45I2LG powers high-performance industrial test equipment including ATE, protocol analyzers, and high-speed digitizers. The 24 transceiver channels support multi-lane protocols such as PCIe Gen3, SATA, USB 3.0, and 10/40/100 Gigabit Ethernet in parallel, allowing a single device to exercise multiple DUT interfaces simultaneously. The 900K LE fabric implements protocol-aware test pattern generators and analyzers, while the 7.2 MB embedded memory buffers captured traces at line rate. Industrial temperature grade and the 1932-ball FCBGA package fit thermally-constrained PXI and LXI chassis. PCI Express Gen3 hard IP enables integration with host controller boards.
Recommended
Recommended Products Summary
Engineering reference data for 10AX090U2F45I2LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX090U2F45I1SG | 10AX090U2F45E2LG | 10AX090U2F45E2SG | 10AX090U2F45E1SG | 10AX090U1F45I1SG |
|---|---|---|---|---|---|---|
| Package | 1932-BBGA, FCBGA | 1932-BBGA, FCBGA - same | 1932-BBGA, FCBGA - same | 1932-BBGA, FCBGA - same | 1932-BBGA, FCBGA - same | 1932-BBGA, FCBGA - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 900,000 | 900,000 - same | 900,000 - same | 900,000 - same | 900,000 - same | 900,000 - same |
| Embedded Memory (bits) | 59,234,304 | 59,234,304 - same | 59,234,304 - same | 59,234,304 - same | 59,234,304 - same | 59,234,304 - same |
| User I/O | 480 | 480 - same | 480 - same | 480 - same | 480 - same | 480 - same |
| Speed Grade | F45 (U2) | F45 (U2) - same | F45 (U2) - same | F45 (U2) - same | F45 (U2) - same | F45 (U1, slower bin) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial - same range | Extended (E2) | Extended (E2) | Extended (E1) | Industrial - same range |
| Ball Finish | Lead-free (LG) | Tin-lead (SG) | Lead-free (LG) - same | Tin-lead (SG) | Tin-lead (SG) | Tin-lead (SG) |
| Approximate 1k+ Price (USD) | $7,957.34 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- 900K LE fabric in midrange Arria 10 family with full 28.3 Gbps transceiver support (vs 10AX090U1F45I1SG (same die, slower speed bin))
- Lead-free ball finish for RoHS-compliant production (vs 10AX090U2F45I1SG (tin-lead ball finish))
- 1932-ball FCBGA exposes full 24-channel transceiver capability (vs 10AX090S3F45I2LG (Arria 10 SX variant, 1932-ball FCBGA))
Design Notes
Estimated: at full fabric utilization with all 24 transceivers active, the 10AX090U2F45I2LG can dissipate up to approximately 30W of total power in the 1932-ball FCBGA package. A top-side heatsink with thermal interface material is required, and the PCB stack-up should include a thermal via array under the package thermal balls to spread heat to internal copper planes. At sustained >85% utilization, forced-air cooling or a cold-plate is recommended for industrial temperature environments. Designers should refer to the Altera Arria 10 thermal management application note for case-to-ambient thermal resistance data.
The 1932-ball FCBGA package requires a high-layer-count PCB stack-up (typically 12 to 16 layers) with microvia-in-pad technology to fan out the dense ball grid. Impedance-controlled routing (100 ohm differential for transceivers, 50 ohm single-ended for general-purpose I/O) must be verified with a 3D EM field solver before tape-out. Length matching within transceiver channels must be within 5 mils per inch of trace length to meet 28.3 Gbps signal integrity. Power plane decoupling requires 0.1uF X7R capacitors at every FPGA power pin with short traces.
Do not confuse the Arria 10 GX (10AX090) variant with the Arria 10 SX (10AS090) variant - the SX has a dual-core ARM Cortex-A9 hard processor system with different HPS pin assignments and is NOT pin-compatible despite the similar part number. Similarly, do not substitute 10AX090 with 10AX115 (higher-density die) on the same PCB - the 115 has more transceivers and the same package footprint but additional power and ground pins may differ. Always verify the exact ball map against the Quartus Prime Pro Pin Planner before committing to a design.
Place the 10AX090U2F45I2LG close to the board edge nearest to external connectors (QSFP28 cages, SMA connectors for transceivers) to minimize high-speed trace lengths. Transceiver channels should be routed on inner stripline layers with reference planes on both sides to control impedance. The configuration flash memory (typically EPCQ-L or equivalent) should be placed within 6 inches of the FPGA configuration pins to ensure reliable AS configuration. JTAG chain components should be accessible for boundary-scan testing.
Compliance Information
RoHS compliant per Altera product page (LG suffix = lead-free ball finish). Industrial temperature grade -40C to +100C. AEC-Q100 is not applicable for FPGAs in automotive grade; Altera offers automotive-qualified Cyclone V and Cyclone 10 devices for that segment.
