10AX115N3F40E2LG - Arria 10 GX FPGA 1150K LE | Altera | F40 FCBGA
N.º de pieza: 10AX115N3F40E2LG ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $2850 | $2.850,00 |
| 10 | $2680 | $26.800,00 |
| 100 | $2495 | $249.500,00 |
| 500 | $2310 | $1.155.000,00 |
| 1.000 | $2125 | $2.125.000,00 |
10AX115N3F40E2LG Descripción general
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded DSP blocks, high-speed transceivers, and on-chip memory that can be re-programmed post-manufacture to implement arbitrary digital logic. FPGAs occupy the tier between general-purpose microcontrollers and fixed-function ASICs in the programmable logic hierarchy: FPGA -> programmable logic -> logic device -> semiconductor. They are widely used for high-throughput parallel processing, hardware-accelerated compute, and protocol bridging where CPU performance or ASIC NRE cost is prohibitive.
The Arria 10 architecture integrates up to 96 full-duplex transceivers supporting data rates to 17.4 Gbps (GXT) and 12.5 Gbps (GX), hardened PCI Express Gen3 hard IP blocks, dual ARM Cortex-A9 hard processor system options (in SoC variants), and 20 nm process technology. The 10AX115 device class provides 1,518 18x19 multipliers and approximately 1,766 GMACS of fixed-point DSP throughput, targeting mid-to-high-end DSP, broadcast, and 100G/400G wireline applications.
The F40 package denotes a 40 mm square FCBGA substrate with 1.0 mm ball pitch, while the -2 speed grade specifies performance and power balance for mid-bandwidth designs. This specific OPN 10AX115N3F40E2LG targets industrial/commercial temperature envelopes with the lead-free (LG) finish. It is pin-compatible with sibling OPNs in the same F40 footprint across the Arria 10 GX family.
Typical applications include 100G/400G optical transport line cards, broadcast video processing (4K/8K UHD), military radar signal processing, medical imaging backplanes, and high-performance test & measurement instrumentation. Designers leverage the 17.4 Gbps transceivers for chip-to-chip and backplane serial links, while the DSP blocks accelerate FFT, FIR, and channelization functions.
When designing with this device, perform signal-integrity simulation on the 17.4 Gbps SERDES channels early in the cycle and allocate sufficient PCB layers for reference-plane continuity under the BGA field. Thermal design must account for the 1517-ball FCBGA junction-to-ambient resistance and the variable power dissipation across logic utilization, with a recommended heatsink for sustained workloads above 60 percent logic utilization.
This page synthesizes distributor pricing, Altera ordering code decoding, drop-in alternatives within the Arria 10 GX family, and practical design notes not consolidated in the manufacturer datasheet.
Alternativas directas para 10AX115N3F40E2LG — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con 10AX115N3F40E2LG (mismo factor de forma y huella) — difiere en Package, Process Technology, DSP Blocks, Operating Temperature, PCIe Hard IP.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
10AX115N2F40E2LG
✅ Sustitución directa✓ En stock
$1980 / unidad
Ver hoja de datos →10AX115N3F40I2LG
✅ Sustitución directa✓ En stock
$8100 / unidad
Ver hoja de datos →10AX115N3F40E2SG
✅ Sustitución directa✓ En stock
$5450 / unidad
Ver hoja de datos →10AX115N2F40I2LG
✅ Sustitución directa✓ En stock
$7965.99 / unidad
Ver hoja de datos →10AX115N3F40E1SG
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
10AX115N3F40E2LG Valores máximos y características eléctricas
| Series | Arria 10 GX |
| Family | 10AX115 |
| Logic Elements (LE) | 1,150,000 |
| Embedded Memory Bits | 68,857,856 |
| Number of I/O | 600 |
| Encapsulado | 1517-BBGA, FCBGA (F40, 40 mm, 1.0 mm pitch) |
| Speed Grade | -2 |
| Core Performance Grade | N (nominal) |
| Process Technology | 20 nm |
| Transceivers (GXT, up to 17.4 Gbps) | up to 24 per device family |
| Transceivers (GX, up to 12.5 Gbps) | up to 48 per device family |
| DSP Blocks (18x19 Multipliers) | 1,518 |
| PCIe Hard IP | Gen3 x4 / x8 hard blocks |
| Temperatura de funcionamiento | -40C to +100C (junction, industrial envelope) |
| Lead-Free Finish | Yes (LG suffix) |
| Tipo de montaje | Surface Mount (BGA) |
Guía de configuración de pines de 10AX115N3F40E2LG 1517-bbga, fcbga (f40, 40 mm, 1.0 mm pitch)
Configuración de pines para 10AX115N3F40E2LG (encapsulado 1517-bbga, fcbga (f40, 40 mm, 1.0 mm pitch)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para 10AX115N3F40E2LG.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
10AX115N3F40E2LG es adecuado para 6 aplicacións: 100G/400G Optical Transport Line Card, 4K/8K UHD Broadcast Video Processing, Military Radar and Electronic Warfare, Medical Imaging Accelerator Backplane, High-Performance Test & Measurement Instrumentation, High-Performance Computing (HPC) Acceleration Card.
100G/400G Optical Transport Line Card
The 10AX115N3F40E2LG fits 100G/400G optical transport designs because its 17.4 Gbps GXT transceivers and up to 96 full-duplex SERDES channels support CAUI-4, OTU4, and Interlaken aggregation directly. The 1,150,000 logic elements and 1,518 DSP blocks accelerate FEC, OTN framer, and MACsec processing for line-card designs. Placed on the datapath between QSFP28/QSFP-DD optics and the switch fabric ASIC, the device sustains multi-terabit throughput. Engineers typically choose the -3 speed grade to close 156.25 MHz core timing and 17.4 Gbps SERDES margins in parallel.
Recomendado
4K/8K UHD Broadcast Video Processing
In 4K/8K broadcast studios, the 10AX115N3F40E2LG provides the parallel pixel pipelines required for SDI de/embedders, HDR/WCG color conversion, and multi-stream scaling. Its 68 Mbit embedded memory buffers full-raster 8K frames at 60p, while the 600 user I/O lanes drive 12G-SDI quad-link and HDMI 2.1 aggregation. The Arria 10 GX architecture's hardened PCIe Gen3 host interface simplifies control-plane connection to the studio CPU. Designers in this space choose the -3 bin to maintain timing margin across high-fanout pixel pipelines.
Recomendado
Military Radar and Electronic Warfare
Radar and EW subsystems leverage the 10AX115N3F40E2LG for high-throughput FFT, pulse compression, and digital channelization across hundreds of MHz of instantaneous bandwidth. The 1,518 18x19 multipliers implement complex FFT butterflies at sample rates above 500 MHz, while 17.4 Gbps transceivers route digitized antenna data to back-end processors. The F40 FCBGA's robust substrate supports the vibration and thermal profiles typical of airborne and shipboard platforms. Engineers pair the device with external ADC/DAC clusters via JESD204B/C links.
Recomendado
Medical Imaging Accelerator Backplane
CT, MRI, and ultrasound backplanes benefit from the 10AX115N3F40E2LG's combination of DSP density and high-speed serial links for image reconstruction pipelines. Filtered back-projection and iterative reconstruction algorithms map efficiently onto the 1,518 DSP blocks, sustaining real-time 4D reconstruction throughput. The hardened PCIe Gen3 endpoint connects directly to the host server CPU without soft-IP overhead. Designers use the device's low-latency transceivers to ingest raw detector data at multi-Gbps rates.
Recomendado
High-Performance Test & Measurement Instrumentation
Test instruments such as high-end oscilloscopes, BERTs, and signal analyzers leverage the 10AX115N3F40E2LG for real-time DSP, protocol-aware triggering, and 17.4 Gbps SERDES-based acquisition paths. The device's high logic density supports parallel pattern generation, eye-diagram post-processing, and protocol decoding (PCIe Gen3, USB 3.1, DisplayPort) simultaneously. The 600 user I/O pins drive multi-channel front ends, while embedded memory buffers long acquisition windows. The -3 speed grade ensures timing closure for 12.5 Gbps SERDES instrumentation loops.
Recomendado
High-Performance Computing (HPC) Acceleration Card
HPC and FPGA-as-a-Service acceleration cards host the 10AX115N3F40E2LG alongside host CPUs or GPUs, where it accelerates kernels such as genomics alignment, financial Monte Carlo, and database analytics. The hardened PCIe Gen3 x8 endpoint delivers low-latency host-to-FPGA DMA, while the 17.4 Gbps transceivers enable multi-FPGA mesh backplanes for cluster scaling. Designers leverage OpenCL or oneAPI DSL flows for kernel portability across Arria 10 GX and Stratix 10 platforms. The device's 20 nm power efficiency suits dense multi-FPGA accelerator shelves.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para 10AX115N3F40E2LG — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | 10AX115N2F40E2LG | 10AX115N3F40I2LG | 10AX115N3F40E2SG | 10AX115N2F40I2LG | 10AX115N3F40E1SG |
|---|---|---|---|---|---|---|
| Package | 1517-FCBGA (F40, 40 mm) | 1517-FCBGA (F40, 40 mm) - same | 1517-FCBGA (F40, 40 mm) - same | 1517-FCBGA (F40, 40 mm) - same | 1517-FCBGA (F40, 40 mm) - same | 1517-FCBGA (F40, 40 mm) - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Speed Grade | -3 | -2 (slower) | -2 (industrial temp) | -3 (SnPb finish) | -2 (industrial temp) | -1 (slowest) |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 |
| Embedded Memory (Mbits) | 68.86 | 68.86 | 68.86 | 68.86 | 68.86 | 68.86 |
| DSP Blocks (18x19) | 1,518 | 1,518 | 1,518 | 1,518 | 1,518 | 1,518 |
| User I/O Pins | 600 | 600 | 600 | 600 | 600 | 600 |
| Temperature Grade | Commercial (extended) | Commercial | Industrial | Commercial | Industrial | Commercial |
| Lead-Free Finish (LG suffix) | Yes | Yes | Yes | No (SnPb SG) | Yes | No (SnPb SG) |
Diferenciadores clave
- Highest -3 speed grade in the 1517-ball F40 package (frente a 10AX115N2F40E2LG)
- Lead-free (LG) finish for RoHS-compliant assemblies (frente a 10AX115N3F40E2SG)
- Within-family density with lower power than larger Arria 10 dies (frente a 10AX090N3F40E2LG)
Notas de diseño
Estimated: at typical utilization of 70 percent logic and 60 percent DSP at 250 MHz core, the Arria 10 GX 10AX115 device dissipates approximately 20-25 W. With the F40 FCBGA package theta-JA of approximately 8-12 C/W (forced airflow with heatsink), the junction temperature rise above ambient stays below 25-30 C, keeping Tj well within the 100 C industrial limit. Without a heatsink or with still air, theta-JA climbs above 15 C/W and Tj may exceed ratings under sustained load; always consult the Altera PowerPlay Early Power Estimator (EPE) and application note AN765 before final layout.
Allocate a minimum 12-layer PCB stack-up for the F40 1517-ball FCBGA with continuous GND and PWR reference planes under the entire BGA field. Use 1.0 mm BGA pitch escape rules (8-mil trace, 12-mil space) with microvia-in-pad for fanout. Pair every transceiver differential pair with a 100-ohm differential impedance, length-matched to within 5 mil across P and N, and follow the Altera Arria 10 GX Transceiver Layout Guidelines document for via-stitching and AC-coupling capacitor placement.
Simulate 17.4 Gbps GXT channels using the Altera Arria 10 GX IBIS-AMI models in a channel simulator such as ANSYS SIwave or Keysight ADS before committing to PCB fab. Apply transmit de-emphasis and receive CTLE/DFE settings per Altera application note AN745 to recover eye margins above 100 mV. Pre-emphasis and equalization coefficient sweeps must be performed over the full range of process, voltage, and temperature (PVT) corners.
Do not assume the lead-free (LG) finish reflows identically to SnPb (SG); LG parts require SAC305 or SAC405 profiles with peak temperature 245-260 C per JEDEC J-STD-020. Mixing SG and LG parts on the same board can cause tombstoning on smaller passives. Also verify the Quartus Prime device selection matches the OPN exactly; mismatches between -1/-2/-3 speed grades result in timing analysis failures that do not necessarily surface as placement errors.
Información de cumplimiento
LG suffix indicates lead-free SAC ball finish per Altera ordering code decoder. RoHS and REACH status inferred from the LG lead-free designation; AEC-Q100 is not applicable to FPGAs. Confirm halogen-free status with the manufacturer datasheet or supplier declaration.
