10AX115N3F40E2LG - Arria 10 GX FPGA 1150K LE | Altera | F40 FCBGA
MPN: 10AX115N3F40E2LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2680 | $26,800.00 |
| 100 | $2495 | $249,500.00 |
| 500 | $2310 | $1,155,000.00 |
| 1,000 | $2125 | $2,125,000.00 |
Drop-in alternatives for 10AX115N3F40E2LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AX115N2F40E2LG
✅ Drop-In✓ In Stock
$1980 / Unit
View Datasheet →10AX115N3F40I2LG
✅ Drop-In✓ In Stock
$8100 / Unit
View Datasheet →10AX115N3F40E2SG
✅ Drop-In✓ In Stock
$5450 / Unit
View Datasheet →10AX115N2F40I2LG
✅ Drop-In✓ In Stock
$7965.99 / Unit
View Datasheet →10AX115N3F40E1SG
✅ Drop-In📋 Reference alternative (not in catalog)
10AX115N3F40E2LG Maximum Ratings & Electrical Characteristics
| Series | Arria 10 GX |
| Family | 10AX115 |
| Logic Elements (LE) | 1,150,000 |
| Embedded Memory Bits | 68,857,856 |
| Number of I/O | 600 |
| Package | 1517-BBGA, FCBGA (F40, 40 mm, 1.0 mm pitch) |
| Speed Grade | -2 |
| Core Performance Grade | N (nominal) |
| Process Technology | 20 nm |
| Transceivers (GXT, up to 17.4 Gbps) | up to 24 per device family |
| Transceivers (GX, up to 12.5 Gbps) | up to 48 per device family |
| DSP Blocks (18x19 Multipliers) | 1,518 |
| PCIe Hard IP | Gen3 x4 / x8 hard blocks |
| Operating Temperature | -40C to +100C (junction, industrial envelope) |
| Lead-Free Finish | Yes (LG suffix) |
| Mounting Type | Surface Mount (BGA) |
10AX115N3F40E2LG 1517-bbga, fcbga (f40, 40 mm, 1.0 mm pitch) Pin Configuration Guide
Complete pinout information for 10AX115N3F40E2LG (1517-bbga, fcbga (f40, 40 mm, 1.0 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX115N3F40E2LG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX115N3F40E2LG is suitable for 6 applications: 100G/400G Optical Transport Line Card, 4K/8K UHD Broadcast Video Processing, Military Radar and Electronic Warfare, Medical Imaging Accelerator Backplane, High-Performance Test & Measurement Instrumentation, High-Performance Computing (HPC) Acceleration Card.
100G/400G Optical Transport Line Card
The 10AX115N3F40E2LG fits 100G/400G optical transport designs because its 17.4 Gbps GXT transceivers and up to 96 full-duplex SERDES channels support CAUI-4, OTU4, and Interlaken aggregation directly. The 1,150,000 logic elements and 1,518 DSP blocks accelerate FEC, OTN framer, and MACsec processing for line-card designs. Placed on the datapath between QSFP28/QSFP-DD optics and the switch fabric ASIC, the device sustains multi-terabit throughput. Engineers typically choose the -3 speed grade to close 156.25 MHz core timing and 17.4 Gbps SERDES margins in parallel.
Recommended
4K/8K UHD Broadcast Video Processing
In 4K/8K broadcast studios, the 10AX115N3F40E2LG provides the parallel pixel pipelines required for SDI de/embedders, HDR/WCG color conversion, and multi-stream scaling. Its 68 Mbit embedded memory buffers full-raster 8K frames at 60p, while the 600 user I/O lanes drive 12G-SDI quad-link and HDMI 2.1 aggregation. The Arria 10 GX architecture's hardened PCIe Gen3 host interface simplifies control-plane connection to the studio CPU. Designers in this space choose the -3 bin to maintain timing margin across high-fanout pixel pipelines.
Recommended
Military Radar and Electronic Warfare
Radar and EW subsystems leverage the 10AX115N3F40E2LG for high-throughput FFT, pulse compression, and digital channelization across hundreds of MHz of instantaneous bandwidth. The 1,518 18x19 multipliers implement complex FFT butterflies at sample rates above 500 MHz, while 17.4 Gbps transceivers route digitized antenna data to back-end processors. The F40 FCBGA's robust substrate supports the vibration and thermal profiles typical of airborne and shipboard platforms. Engineers pair the device with external ADC/DAC clusters via JESD204B/C links.
Recommended
Medical Imaging Accelerator Backplane
CT, MRI, and ultrasound backplanes benefit from the 10AX115N3F40E2LG's combination of DSP density and high-speed serial links for image reconstruction pipelines. Filtered back-projection and iterative reconstruction algorithms map efficiently onto the 1,518 DSP blocks, sustaining real-time 4D reconstruction throughput. The hardened PCIe Gen3 endpoint connects directly to the host server CPU without soft-IP overhead. Designers use the device's low-latency transceivers to ingest raw detector data at multi-Gbps rates.
Recommended
High-Performance Test & Measurement Instrumentation
Test instruments such as high-end oscilloscopes, BERTs, and signal analyzers leverage the 10AX115N3F40E2LG for real-time DSP, protocol-aware triggering, and 17.4 Gbps SERDES-based acquisition paths. The device's high logic density supports parallel pattern generation, eye-diagram post-processing, and protocol decoding (PCIe Gen3, USB 3.1, DisplayPort) simultaneously. The 600 user I/O pins drive multi-channel front ends, while embedded memory buffers long acquisition windows. The -3 speed grade ensures timing closure for 12.5 Gbps SERDES instrumentation loops.
Recommended
High-Performance Computing (HPC) Acceleration Card
HPC and FPGA-as-a-Service acceleration cards host the 10AX115N3F40E2LG alongside host CPUs or GPUs, where it accelerates kernels such as genomics alignment, financial Monte Carlo, and database analytics. The hardened PCIe Gen3 x8 endpoint delivers low-latency host-to-FPGA DMA, while the 17.4 Gbps transceivers enable multi-FPGA mesh backplanes for cluster scaling. Designers leverage OpenCL or oneAPI DSL flows for kernel portability across Arria 10 GX and Stratix 10 platforms. The device's 20 nm power efficiency suits dense multi-FPGA accelerator shelves.
Recommended
Recommended Products Summary
Engineering reference data for 10AX115N3F40E2LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX115N2F40E2LG | 10AX115N3F40I2LG | 10AX115N3F40E2SG | 10AX115N2F40I2LG | 10AX115N3F40E1SG |
|---|---|---|---|---|---|---|
| Package | 1517-FCBGA (F40, 40 mm) | 1517-FCBGA (F40, 40 mm) - same | 1517-FCBGA (F40, 40 mm) - same | 1517-FCBGA (F40, 40 mm) - same | 1517-FCBGA (F40, 40 mm) - same | 1517-FCBGA (F40, 40 mm) - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Speed Grade | -3 | -2 (slower) | -2 (industrial temp) | -3 (SnPb finish) | -2 (industrial temp) | -1 (slowest) |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 |
| Embedded Memory (Mbits) | 68.86 | 68.86 | 68.86 | 68.86 | 68.86 | 68.86 |
| DSP Blocks (18x19) | 1,518 | 1,518 | 1,518 | 1,518 | 1,518 | 1,518 |
| User I/O Pins | 600 | 600 | 600 | 600 | 600 | 600 |
| Temperature Grade | Commercial (extended) | Commercial | Industrial | Commercial | Industrial | Commercial |
| Lead-Free Finish (LG suffix) | Yes | Yes | Yes | No (SnPb SG) | Yes | No (SnPb SG) |
Key Differentiators
- Highest -3 speed grade in the 1517-ball F40 package (vs 10AX115N2F40E2LG)
- Lead-free (LG) finish for RoHS-compliant assemblies (vs 10AX115N3F40E2SG)
- Within-family density with lower power than larger Arria 10 dies (vs 10AX090N3F40E2LG)
Design Notes
Estimated: at typical utilization of 70 percent logic and 60 percent DSP at 250 MHz core, the Arria 10 GX 10AX115 device dissipates approximately 20-25 W. With the F40 FCBGA package theta-JA of approximately 8-12 C/W (forced airflow with heatsink), the junction temperature rise above ambient stays below 25-30 C, keeping Tj well within the 100 C industrial limit. Without a heatsink or with still air, theta-JA climbs above 15 C/W and Tj may exceed ratings under sustained load; always consult the Altera PowerPlay Early Power Estimator (EPE) and application note AN765 before final layout.
Allocate a minimum 12-layer PCB stack-up for the F40 1517-ball FCBGA with continuous GND and PWR reference planes under the entire BGA field. Use 1.0 mm BGA pitch escape rules (8-mil trace, 12-mil space) with microvia-in-pad for fanout. Pair every transceiver differential pair with a 100-ohm differential impedance, length-matched to within 5 mil across P and N, and follow the Altera Arria 10 GX Transceiver Layout Guidelines document for via-stitching and AC-coupling capacitor placement.
Simulate 17.4 Gbps GXT channels using the Altera Arria 10 GX IBIS-AMI models in a channel simulator such as ANSYS SIwave or Keysight ADS before committing to PCB fab. Apply transmit de-emphasis and receive CTLE/DFE settings per Altera application note AN745 to recover eye margins above 100 mV. Pre-emphasis and equalization coefficient sweeps must be performed over the full range of process, voltage, and temperature (PVT) corners.
Do not assume the lead-free (LG) finish reflows identically to SnPb (SG); LG parts require SAC305 or SAC405 profiles with peak temperature 245-260 C per JEDEC J-STD-020. Mixing SG and LG parts on the same board can cause tombstoning on smaller passives. Also verify the Quartus Prime device selection matches the OPN exactly; mismatches between -1/-2/-3 speed grades result in timing analysis failures that do not necessarily surface as placement errors.
Compliance Information
LG suffix indicates lead-free SAC ball finish per Altera ordering code decoder. RoHS and REACH status inferred from the LG lead-free designation; AEC-Q100 is not applicable to FPGAs. Confirm halogen-free status with the manufacturer datasheet or supplier declaration.
