10AX115U3F45I2LG - Arria 10 GX FPGA, 1.15M LE | Intel | 1932-BGA
N.º de pieza: 10AX115U3F45I2LG ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $7850 | $7.850,00 |
| 10 | $7450 | $74.500,00 |
| 100 | $7100 | $710.000,00 |
| 500 | $6850 | $3.425.000,00 |
| 1.000 | $6600 | $6.600.000,00 |
10AX115U3F45I2LG Descripción general
An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and embedded memory and DSP resources. Unlike an ASIC, an FPGA's function is defined by user-loaded configuration data, enabling rapid hardware iteration, post-deployment upgrades, and hardware-level parallelism. Within the programmable logic hierarchy, FPGAs sit above CPLDs (which are smaller and non-volatile) and below structured ASICs in unit cost; Arria 10 GX specifically targets mid-range transceiver-heavy designs bridging Cyclone and Stratix families.
Key differentiating features of the 10AX115U3F45I2LG include 1,150,000 logic elements (LEs), 427,200 adaptive logic modules (ALMs), 52.99 Mbit embedded memory, 480 DSP blocks, and 24 transceivers at the U3 speed grade (12.5 Gbps). The part ships in a 45mm FCBGA-1932 (F45) package suitable for high-pin-count designs requiring maximum I/O density, and is qualified to the industrial operating range.
Arria 10 GX architecture combines a hard memory controller, PCIe hard IP blocks, and 10/12.5 Gbps transceivers on the same die, allowing deterministic latency and lower power than soft implementations. Compared with previous 28nm Arria V, Arria 10 GX achieves roughly 2x DSP throughput per watt, making it suitable for compute-intensive applications like 4K video processing and wireless baseband.
Typical applications include 4K/8K video broadcast equipment, 100G/400G Ethernet line cards, wireless LTE/5G fronthaul, radar and electronic warfare signal processing, medical imaging accelerators, and high-performance compute offload cards. The U3 speed grade supports up to 12.5 Gbps backplane and chip-to-chip links.
When designing with this device, plan for high-density PCB with 1.0mm BGA pitch, multi-layer PCB stack-up (12+ layers typical), and strict power integrity for the 0.95V core rail. Quartus Prime software provides synthesis, place-and-route, and timing analysis.
This page synthesizes distributor pricing, drop-in Arria 10 alternatives, and practical board-design notes not found in the manufacturer datasheet.
Alternativas directas para 10AX115U3F45I2LG — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con 10AX115U3F45I2LG (mismo factor de forma y huella) — difiere en Package, Process Technology, DSP Blocks, Operating Temperature, Speed Grade.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
10AX115U3F45I2SG
✅ Sustitución directa✓ En stock
$7450 / unidad
Ver hoja de datos →10AX115U3F45E2LG
✅ Sustitución directa✓ En stock
$8500 / unidad
Ver hoja de datos →10AX115U2F45I2LG
✅ Sustitución directa✓ En stock
$9589.87 / unidad
Ver hoja de datos →10AX115U2F45I2SG
✅ Sustitución directa✓ En stock
$8902.49 / unidad
Ver hoja de datos →10AX115U3F45E2SG
✅ Sustitución directa✓ En stock
$5800 / unidad
Ver hoja de datos →10AX115U3F45I2LG Valores máximos y características eléctricas
| Family | Arria 10 GX |
| Logic Elements | 1,150,000 LE |
| Adaptive Logic Modules (ALMs) | 427,200 ALM |
| Embedded Memory | 68,857,856 bit (52.99 Mbit) |
| DSP Blocks | 480 |
| Transceivers | 24 (up to 12.5 Gbps, U3 speed grade) |
| Process Technology | 20nm |
| Encapsulado | 1932-BBGA, FCBGA (F45) 45mm |
| Temperatura de funcionamiento | -40C to +100C (Industrial) |
| Tipo de montaje | Surface Mount (BGA) |
| Packaging | Tray |
| Configuration Memory | SRAM-based (volatile) |
| Hard Memory Controllers | Yes |
| Hard PCIe Blocks | Yes (Gen3) |
| Estado RoHS | Compliant |
Guía de configuración de pines de 10AX115U3F45I2LG 1932-bbga, fcbga (f45) 45mm
Configuración de pines para 10AX115U3F45I2LG (encapsulado 1932-bbga, fcbga (f45) 45mm). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para 10AX115U3F45I2LG.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
10AX115U3F45I2LG es adecuado para 6 aplicacións: 100G/400G Ethernet Line Cards, Wireless 4G/5G Fronthaul CPRI, 4K/8K Video Broadcast Processing, Radar and Electronic Warfare Signal Processing, Medical Imaging (CT/MRI) Reconstruction, High-Performance Compute Offload Cards.
100G/400G Ethernet Line Cards
The 10AX115U3F45I2LG is well-suited for 100G and aggregate 400G Ethernet line cards in telecom and data-center switching. The U3 speed grade delivers 12.5 Gbps per lane across 24 transceivers for ~300 Gbps aggregate serial bandwidth, while the 1.15M LE fabric absorbs soft-MAC, classification, and packet-processing logic. Its 480 DSP blocks accelerate hashing and crypto offload. Industrial temperature rating allows deployment in NEBS-compliant telecom chassis without thermal derating.
Recomendado
Wireless 4G/5G Fronthaul CPRI
In LTE and 5G fronthaul infrastructure, the 10AX115U3F45I2LG implements CPRI and eCPRI protocols on its 12.5 Gbps transceivers, supporting up to 24 RRH links per device. The 1.15M LE fabric handles PHY-layer baseband processing, while 480 DSP blocks accelerate FFT/iFFT and channelization filters. Hard PCIe Gen3 blocks enable direct host offload. The FCBGA-1932 package integrates cleanly into ATCA and OCP-style baseband cards.
Recomendado
4K/8K Video Broadcast Processing
The 10AX115U3F45I2LG is widely deployed in 4K and 8K broadcast equipment for real-time video processing, color-space conversion, and multi-stream encoding. The 480 DSP blocks deliver the parallel throughput required for HEVC and AV1 codec acceleration, while 52.99 Mbit of embedded memory buffers reference frames and intermediate line stores. The FCBGA-1932 package supports up to 24 video SERDES channels for SDI/HDMI ingest, fitting a single PCB for video switchers.
Recomendado
Radar and Electronic Warfare Signal Processing
Defense radar and EW systems leverage the 10AX115U3F45I2LG's 1.15M LE fabric and 480 DSP blocks for pulse compression, beamforming, and Doppler processing at sample rates up to several hundred MSPS. The 12.5 Gbps transceivers feed digital receiver data into the FPGA from multi-channel ADCs. Industrial temperature and rugged FCBGA-1932 package make the device suitable for airborne and naval platforms when paired with conformal coating and vibration isolation.
Recomendado
Medical Imaging (CT/MRI) Reconstruction
The 10AX115U3F45I2LG accelerates CT and MRI image reconstruction in the back-end of medical imaging systems. Its 480 DSP blocks execute filtered back-projection and iterative reconstruction kernels, while 52.99 Mbit embedded memory holds projection data. Transceivers aggregate raw RF data from multi-channel detector arrays at 12.5 Gbps per lane. The industrial temperature range supports stable operation in controlled hospital-room environments.
Recomendado
High-Performance Compute Offload Cards
Data-center acceleration cards use the 10AX115U3F45I2LG as a coprocessor for genomics, financial Monte Carlo, and AI inference offload. The PCIe Gen3 hard IP blocks provide low-latency host links, while the 1.15M LE fabric implements custom numeric pipelines. The 480 DSP blocks accelerate floating-point and fixed-point arithmetic at 2-3x the throughput of soft implementations, and 24 transceivers support multi-host configurations or FPGA-to-FPGA clustering.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para 10AX115U3F45I2LG — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | 10AX115U3F45I2SG | 10AX115U3F45E2LG | 10AX115U2F45I2LG |
|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | FCBGA-1932 (F45) 45mm | FCBGA-1932 (F45) 45mm - same | FCBGA-1932 (F45) 45mm - same | FCBGA-1932 (F45) 45mm - same |
| Logic Elements | 1,150,000 LE | 1,150,000 LE | 1,150,000 LE | 1,150,000 LE |
| Speed Grade | U3 (12.5 Gbps transceivers) | U3 (12.5 Gbps) | U3, extended temp E-grade | U2 (10 Gbps transceivers) |
| Temperature Range | Industrial -40C to +100C | Commercial 0C to +100C | Industrial with extended +125C | Industrial -40C to +100C |
| DSP Blocks | 480 | 480 | 480 | 480 |
| Embedded Memory | 52.99 Mbit | 52.99 Mbit | 52.99 Mbit | 52.99 Mbit |
| Transceivers | 24 channels up to 12.5 Gbps | 24 channels up to 12.5 Gbps | 24 channels up to 12.5 Gbps | 24 channels up to 10 Gbps |
Diferenciadores clave
- U3 speed grade enables 12.5 Gbps transceivers for 100G Ethernet (frente a 10AX115U2F45I2LG)
- Industrial -40C to +100C temperature range (frente a 10AX115U3F45I2SG)
- Largest density (1.15M LE) in Arria 10 GX family (frente a 10AX090U3F45I2LG)
Notas de diseño
Estimated: The 10AX115U3F45I2LG typically dissipates 25-40W in a fully utilized configuration with active transceivers and DSP. The FCBGA-1932 F45 package requires a high-performance thermal solution - 4-6 W/mK thermal interface material, a copper or aluminum heatsink with at least 2 C/W resistance, and 400+ LFM airflow. Junction-to-ambient (theta_JA) without airflow is approximately 8 C/W per Altera thermal guidelines.
The 1.0mm pitch FCBGA-1932 requires a 12+ layer PCB with stacked micro-via (laser-drilled) build-up layers. Escape routing uses 4/4 mil trace-and-space in the inner ball-pitch region. A continuous GND plane below the FPGA package and a dedicated 0.95V core power plane are mandatory for power integrity. Decoupling requires ~80 capacitors (0.1uF, 1uF, 10uF, 47uF) within 100 mils of the BGA balls.
Core voltage is 0.95V (VCC) with tolerance +/- 30mV; transceivers use 1.0V and 1.5V auxiliary supplies, with I/O banks at 1.2V-3.3V depending on bank assignment. Power sequencing per Intel Arria 10 guidelines requires VCC to ramp before VCCPT and VCCAUX. Use the Arria 10 power tree with PWM controllers such as LTM4677 or ISL8225MEVAL. Estimated: full-power rails at 50-60W peak.
Transceiver channels operating at 12.5 Gbps require controlled-impedance routing (100 ohm differential +/- 10%) with maximum length matching within 5 mils across all 24 channels. Loss budget must stay under 6 dB at 6.25 GHz Nyquist. Use Megtron 6 or equivalent low-loss dielectric for the transceiver layer, and follow Intel Arria 10 GX PCB designer checklist.
Common pitfalls: (1) Insufficient thermal relief causes thermal shutdown at full load. (2) Configuration errors when JTAG and EPCQ flash are both attached - use MSEL pin resistors correctly per datasheet. (3) Voltage rails not sequencing per spec damages internal logic. (4) Ignoring the partial reconfiguration voltage (VCCP) connection on F45 package variants.
Información de cumplimiento
RoHS and REACH compliant per Altera (Intel) product page. Industrial temperature grade qualified; AEC-Q100 is not applicable to FPGAs of this class.
