10CL055YF484C6G - Cyclone 10 LP FPGA, 55K LE, 484-FBGA | Intel
N.º de pieza: 10CL055YF484C6G ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $168 | $168,00 |
| 10 | $152.5 | $1.525,00 |
| 100 | $138.2 | $13.820,00 |
| 500 | $124.8 | $62.400,00 |
| 1.000 | $112.4 | $112.400,00 |
10CL055YF484C6G Descripción general
A Cyclone 10 LP FPGA is a SRAM-based programmable logic device from Intel (formerly Altera) positioned in the low-power, low-cost segment of the FPGA market hierarchy: FPGA → programmable logic → semiconductor. It combines programmable logic fabric, embedded memory blocks (M9K), embedded multipliers (18 × 18), and a PLL-based clock network on a single die, allowing a single chip to replace dozens of discrete logic ICs while remaining reprogrammable in the field via JTAG or Active Serial configuration.
Key features include 55,856 logic elements, 2,396,160 bits (≈234 Kbit) of embedded RAM organized as M9K blocks, 156 embedded 18 × 18 multipliers, 4 general-purpose PLLs, and 321 maximum user I/Os. Per-bank LVDS support and on-chip hard memory controllers simplify external SDRAM and DDR SDRAM interfacing without external bridge ICs.
The 10CL055YF484C6G is fabricated on a low-power TSMC process and uses a 1.2 V core with multi-voltage I/O banks supporting 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.0 V, and 3.3 V standards. Configuration is supported through JTAG, Active Serial (AS), Passive Serial (PS), and Fast Passive Parallel (FPP) modes, with bitstream encryption and design security features available.
Typical applications include industrial motor control, video bridging and display controllers, low-cost software-defined radio (SDR) front-ends, I/O expansion and protocol bridging in embedded systems, and prototyping platforms for ASIC verification. The combination of integrated DSP blocks and LVDS transceivers makes it well-suited to digital signal processing front-ends.
Design consideration: use Intel Quartus Prime Lite Edition for synthesis, place-and-route, and bitstream generation; confirm that the selected pin assignments fall within the supported I/O standards of the targeted bank, and verify that LVDS usage respects the per-bank LVDS channel limits documented in the device handbook.
This page synthesizes distributor pricing, drop-in same-family alternatives from the Site MPN list, comparison parameters, and practical design notes that complement — but do not replace — the device handbook and Cyclone 10 LP family datasheet.
Alternativas directas para 10CL055YF484C6G — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con 10CL055YF484C6G (mismo factor de forma y huella) — difiere en Package, Speed Grade, Process Technology, Maximum User I/O, Core Voltage.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
10CL055YF484C8G
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$56.85 / unidad
Ver hoja de datos →10CL055YF484I7G
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$46.09 / unidad
Ver hoja de datos →10CL040YF484C6G
✅ Sustitución directa✓ En stock
$108.25 / unidad
Ver hoja de datos →10CL040YF484C8G
✅ Sustitución directa✓ En stock
$39.8 / unidad
Ver hoja de datos →10CL040YF484I7G
✅ Sustitución directa✓ En stock
$29.74 / unidad
Ver hoja de datos →10CL055YF484C6G Valores máximos y características eléctricas
| Family | Cyclone 10 LP |
| Logic Elements (LE) | 55,856 |
| Embedded Memory (bits) | 2,396,160 |
| Embedded Memory Blocks | M9K |
| Embedded 18x18 Multipliers | 156 |
| General-Purpose PLLs | 4 |
| Maximum User I/O | 321 |
| Encapsulado | 484-ball FBGA (F484) |
| Speed Grade | -6 |
| Temperatura de funcionamiento | 0 °C to +85 °C (commercial) |
| Core Voltage | 1.2 V |
| I/O Standards Supported | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V LVCMOS/LVTTL; LVDS |
| Configuration Modes | JTAG, Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP) |
| Process Technology | Low-power CMOS (TSMC) |
| Estado RoHS | Compliant |
| Tipo de montaje | Surface Mount |
| Nivel MSL | 3 (per JEDEC J-STD-020) |
Guía de configuración de pines de 10CL055YF484C6G 484-ball fbga (f484)
Configuración de pines para 10CL055YF484C6G (encapsulado 484-ball fbga (f484)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para 10CL055YF484C6G.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
10CL055YF484C6G es adecuado para 6 aplicacións: Industrial Motor Control, Video Bridging and Display Controllers, Low-Cost Software Defined Radio (SDR) Front-End, Embedded I/O Expansion and Protocol Bridging, ASIC Prototyping and Design Verification, IoT Edge Sensor Aggregation Hubs.
Industrial Motor Control
The 10CL055YF484C6G is well suited to multi-axis industrial motor control thanks to its 156 embedded 18×18 multipliers that implement field-oriented control (FOC) and space-vector PWM without external DSP chips. With 55,856 logic elements it can host encoder interfaces, Hall-sensor decoding, current-loop PI controllers, and protection state machines on a single die. The -6 speed grade supports the 100–200 MHz system clocks typical of FOC loops at 10–20 kHz PWM, while the 321 user I/Os accommodate multi-axis gate-driver and feedback connections. Industrial users leverage the LVDS-capable banks for high-speed encoder signaling, and the 4 PLLs provide jitter-cleaned clocks for ADC sampling.
Recomendado
Video Bridging and Display Controllers
The 10CL055YF484C6G's 2,396,160 bits of M9K memory make it ideal for line- and frame-buffering in video bridging applications such as TTL-to-LVDS conversion, HDMI/DVI pre-processing, or LCD timing controller aggregation. Its 156 hardware multipliers accelerate scaling and color-space conversion (RGB↔YUV), while the LVDS I/O banks drive flat-panel interfaces directly. The 321 available I/Os in the F484 footprint accommodate 24-bit parallel RGB plus control, sync, and backlight PWM signals without external muxing. Designers use the PLL resources to generate pixel clocks at exact fractional rates required by WVGA and 720p panels.
Recomendado
Low-Cost Software Defined Radio (SDR) Front-End
The 10CL055YF484C6G provides enough DSP throughput for narrow-band SDR front-ends in the HF/VHF/UHF range, where its 156 18×18 multipliers implement digital down-conversion, FIR filtering, and FM/PSK demodulation. The 55,856 LEs host FFT cores up to 1024 points while leaving headroom for protocol stacks. Its 4 PLLs generate the 60–200 MHz sample clocks needed by 12–14 bit ADC interfaces, and LVDS pairs simplify connection to high-speed ADCs such as the AD9238 family. The commercial temperature grade fits laboratory and indoor SDR enclosures.
Recomendado
Embedded I/O Expansion and Protocol Bridging
The 10CL055YF484C6G acts as a flexible bridge between mismatched buses (UART, SPI, I²C, parallel GPIO, and PCIe-style LVDS links), aggregating 321 user I/Os in a single chip to replace multiple slower CPLDs. Its M9K memory provides FIFO buffering for asynchronous clock-domain crossings without external SRAM. The -6 speed grade comfortably drives 50–100 MHz LVDS-side logic while keeping the slower serial-side logic glitch-free. Designers use it to expand MCU/MPU pin count, level-shift between 1.8 V and 3.3 V domains, and add custom interrupts or PWM channels on demand.
Recomendado
ASIC Prototyping and Design Verification
Engineers use the 10CL055YF484C6G as a low-cost ASIC prototype vehicle because 55,856 LEs is enough to map many sub-million-gate ASIC blocks. The M9K memory blocks emulate SRAM macros, and the embedded multipliers map DSP datapaths. JTAG-based configuration allows rapid design iteration without re-programming flash, while AS mode supports unattended regression testing. The Cyclone 10 LP family is supported by Intel Quartus Prime Lite Edition, which is free for this device and includes simulation, synthesis, and timing analysis tools needed for sign-off quality verification.
Recomendado
IoT Edge Sensor Aggregation Hubs
The 10CL055YF484C6G is suitable for IoT edge gateways that aggregate many low-speed sensor buses (I²C, SPI, UART, one-wire) and pre-process data before forwarding to a wireless module. Its 321 I/Os in F484 accommodate dozens of sensor interfaces in a single chip, while the 156 multipliers accelerate local FFT or threshold-detection algorithms. LVDS pairs connect to high-speed MEMS or camera sensors, and the 4 PLLs derive multiple independent timing domains for radios, sensors, and host processors. Low static power and a 1.2 V core suit battery-backed edge installations.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para 10CL055YF484C6G — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | 10CL055YF484C8G | 10CL055YF484I7G | 10CL040YF484C6G | 10CL040YF484C8G | 10CL040YF484I7G |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-ball FBGA (F484) | 484-ball FBGA (F484) — same | 484-ball FBGA (F484) — same | 484-ball FBGA (F484) — same | 484-ball FBGA (F484) — same | 484-ball FBGA (F484) — same |
| Logic Elements | 55,856 | 55,856 | 55,856 | 40,000 | 40,000 | 40,000 |
| Embedded Memory (bits) | 2,396,160 | 2,396,160 | 2,396,160 | 1,134,000 (40K family) | 1,134,000 (40K family) | 1,134,000 (40K family) |
| 18x18 Multipliers | 156 | 156 | 156 | 81 (40K family) | 81 (40K family) | 81 (40K family) |
| Maximum User I/O | 321 | 321 | 321 | 321 | 321 | 321 |
| Speed Grade | -6 | -8 | -7 | -6 | -8 | -7 |
| Operating Temperature | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | -40 °C to +100 °C (industrial) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | -40 °C to +100 °C (industrial) |
| Configuration Modes | JTAG, AS, PS, FPP | JTAG, AS, PS, FPP | JTAG, AS, PS, FPP | JTAG, AS, PS, FPP | JTAG, AS, PS, FPP | JTAG, AS, PS, FPP |
Diferenciadores clave
- Higher logic density than 40K LE alternatives at the same footprint (frente a 10CL040YF484C6G)
- Higher internal Fmax than -8 speed-grade alternatives (frente a 10CL055YF484C8G)
- Commercial temperature window matches low-cost product BOMs (frente a 10CL055YF484I7G)
Notas de diseño
The 10CL055YF484C6G core runs at 1.2 V while I/O banks support 1.2–3.3 V. Decouple each VCCINT pin with a 0.1 µF X7R ceramic placed within 100 mils of the ball, and add a single 10 µF bulk cap per VCCIO bank. Per the Cyclone 10 LP device handbook, shared VCCIO banks driving LVDS require additional 0.001 µF caps near each LVDS pair to limit simultaneous switching noise.
The 484-ball FBGA has a 1.0 mm ball pitch; use at least a 4-layer PCB with continuous GND and PWR planes directly under the BGA. Escape traces on the top layer should not exceed a 1:1 aspect ratio with 4-mil traces. Fanout via-in-pad is not recommended — use dog-bone fanout with microvias to a 0.5 mm-pitch breakout layer to keep manufacturing yield high.
Do not leave unused LVDS pairs floating; tie each unused LVDS input pair to a defined logic level through a 10 kΩ resistor to avoid supply-current drift during configuration. Configuration pins nCONFIG, nSTATUS, CONF_DONE must each have a 4.7 kΩ pull-up to VCCIO of the configuration bank, otherwise the device may fail to enter user mode after power-up.
Información de cumplimiento
RoHS compliance per Intel/Altera product page; REACH, halogen-free, and conflict-minerals status not stated in the verified web data and marked as 'unknown' per data authenticity rules.