10CL055YF484C6G - Cyclone 10 LP FPGA, 55K LE, 484-FBGA | Intel
MPN: 10CL055YF484C6G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $168 | $168.00 |
| 10 | $152.5 | $1,525.00 |
| 100 | $138.2 | $13,820.00 |
| 500 | $124.8 | $62,400.00 |
| 1,000 | $112.4 | $112,400.00 |
Drop-in alternatives for 10CL055YF484C6G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10CL055YF484C8G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$56.85 / Unit
View Datasheet →10CL055YF484I7G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$46.09 / Unit
View Datasheet →10CL040YF484C6G
✅ Drop-In✓ In Stock
$108.25 / Unit
View Datasheet →10CL040YF484C8G
✅ Drop-In✓ In Stock
$39.8 / Unit
View Datasheet →10CL040YF484I7G
✅ Drop-In✓ In Stock
$28.85 / Unit
View Datasheet →10CL055YF484C6G Maximum Ratings & Electrical Characteristics
| Family | Cyclone 10 LP |
| Logic Elements (LE) | 55,856 |
| Embedded Memory (bits) | 2,396,160 |
| Embedded Memory Blocks | M9K |
| Embedded 18x18 Multipliers | 156 |
| General-Purpose PLLs | 4 |
| Maximum User I/O | 321 |
| Package | 484-ball FBGA (F484) |
| Speed Grade | -6 |
| Operating Temperature | 0 °C to +85 °C (commercial) |
| Core Voltage | 1.2 V |
| I/O Standards Supported | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V LVCMOS/LVTTL; LVDS |
| Configuration Modes | JTAG, Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP) |
| Process Technology | Low-power CMOS (TSMC) |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount |
| MSL Level | 3 (per JEDEC J-STD-020) |
10CL055YF484C6G 484-ball fbga (f484) Pin Configuration Guide
Complete pinout information for 10CL055YF484C6G (484-ball fbga (f484) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10CL055YF484C6G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10CL055YF484C6G is suitable for 6 applications: Industrial Motor Control, Video Bridging and Display Controllers, Low-Cost Software Defined Radio (SDR) Front-End, Embedded I/O Expansion and Protocol Bridging, ASIC Prototyping and Design Verification, IoT Edge Sensor Aggregation Hubs.
Industrial Motor Control
The 10CL055YF484C6G is well suited to multi-axis industrial motor control thanks to its 156 embedded 18×18 multipliers that implement field-oriented control (FOC) and space-vector PWM without external DSP chips. With 55,856 logic elements it can host encoder interfaces, Hall-sensor decoding, current-loop PI controllers, and protection state machines on a single die. The -6 speed grade supports the 100–200 MHz system clocks typical of FOC loops at 10–20 kHz PWM, while the 321 user I/Os accommodate multi-axis gate-driver and feedback connections. Industrial users leverage the LVDS-capable banks for high-speed encoder signaling, and the 4 PLLs provide jitter-cleaned clocks for ADC sampling.
Recommended
Video Bridging and Display Controllers
The 10CL055YF484C6G's 2,396,160 bits of M9K memory make it ideal for line- and frame-buffering in video bridging applications such as TTL-to-LVDS conversion, HDMI/DVI pre-processing, or LCD timing controller aggregation. Its 156 hardware multipliers accelerate scaling and color-space conversion (RGB↔YUV), while the LVDS I/O banks drive flat-panel interfaces directly. The 321 available I/Os in the F484 footprint accommodate 24-bit parallel RGB plus control, sync, and backlight PWM signals without external muxing. Designers use the PLL resources to generate pixel clocks at exact fractional rates required by WVGA and 720p panels.
Recommended
Low-Cost Software Defined Radio (SDR) Front-End
The 10CL055YF484C6G provides enough DSP throughput for narrow-band SDR front-ends in the HF/VHF/UHF range, where its 156 18×18 multipliers implement digital down-conversion, FIR filtering, and FM/PSK demodulation. The 55,856 LEs host FFT cores up to 1024 points while leaving headroom for protocol stacks. Its 4 PLLs generate the 60–200 MHz sample clocks needed by 12–14 bit ADC interfaces, and LVDS pairs simplify connection to high-speed ADCs such as the AD9238 family. The commercial temperature grade fits laboratory and indoor SDR enclosures.
Recommended
Embedded I/O Expansion and Protocol Bridging
The 10CL055YF484C6G acts as a flexible bridge between mismatched buses (UART, SPI, I²C, parallel GPIO, and PCIe-style LVDS links), aggregating 321 user I/Os in a single chip to replace multiple slower CPLDs. Its M9K memory provides FIFO buffering for asynchronous clock-domain crossings without external SRAM. The -6 speed grade comfortably drives 50–100 MHz LVDS-side logic while keeping the slower serial-side logic glitch-free. Designers use it to expand MCU/MPU pin count, level-shift between 1.8 V and 3.3 V domains, and add custom interrupts or PWM channels on demand.
Recommended
ASIC Prototyping and Design Verification
Engineers use the 10CL055YF484C6G as a low-cost ASIC prototype vehicle because 55,856 LEs is enough to map many sub-million-gate ASIC blocks. The M9K memory blocks emulate SRAM macros, and the embedded multipliers map DSP datapaths. JTAG-based configuration allows rapid design iteration without re-programming flash, while AS mode supports unattended regression testing. The Cyclone 10 LP family is supported by Intel Quartus Prime Lite Edition, which is free for this device and includes simulation, synthesis, and timing analysis tools needed for sign-off quality verification.
Recommended
IoT Edge Sensor Aggregation Hubs
The 10CL055YF484C6G is suitable for IoT edge gateways that aggregate many low-speed sensor buses (I²C, SPI, UART, one-wire) and pre-process data before forwarding to a wireless module. Its 321 I/Os in F484 accommodate dozens of sensor interfaces in a single chip, while the 156 multipliers accelerate local FFT or threshold-detection algorithms. LVDS pairs connect to high-speed MEMS or camera sensors, and the 4 PLLs derive multiple independent timing domains for radios, sensors, and host processors. Low static power and a 1.2 V core suit battery-backed edge installations.
Recommended
Recommended Products Summary
Engineering reference data for 10CL055YF484C6G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10CL055YF484C8G | 10CL055YF484I7G | 10CL040YF484C6G | 10CL040YF484C8G | 10CL040YF484I7G |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-ball FBGA (F484) | 484-ball FBGA (F484) — same | 484-ball FBGA (F484) — same | 484-ball FBGA (F484) — same | 484-ball FBGA (F484) — same | 484-ball FBGA (F484) — same |
| Logic Elements | 55,856 | 55,856 | 55,856 | 40,000 | 40,000 | 40,000 |
| Embedded Memory (bits) | 2,396,160 | 2,396,160 | 2,396,160 | 1,134,000 (40K family) | 1,134,000 (40K family) | 1,134,000 (40K family) |
| 18x18 Multipliers | 156 | 156 | 156 | 81 (40K family) | 81 (40K family) | 81 (40K family) |
| Maximum User I/O | 321 | 321 | 321 | 321 | 321 | 321 |
| Speed Grade | -6 | -8 | -7 | -6 | -8 | -7 |
| Operating Temperature | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | -40 °C to +100 °C (industrial) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | -40 °C to +100 °C (industrial) |
| Configuration Modes | JTAG, AS, PS, FPP | JTAG, AS, PS, FPP | JTAG, AS, PS, FPP | JTAG, AS, PS, FPP | JTAG, AS, PS, FPP | JTAG, AS, PS, FPP |
| Approx. Unit Price @ 1k pcs (USD) | 112.40 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Higher logic density than 40K LE alternatives at the same footprint (vs 10CL040YF484C6G)
- Higher internal Fmax than -8 speed-grade alternatives (vs 10CL055YF484C8G)
- Commercial temperature window matches low-cost product BOMs (vs 10CL055YF484I7G)
Design Notes
The 10CL055YF484C6G core runs at 1.2 V while I/O banks support 1.2–3.3 V. Decouple each VCCINT pin with a 0.1 µF X7R ceramic placed within 100 mils of the ball, and add a single 10 µF bulk cap per VCCIO bank. Per the Cyclone 10 LP device handbook, shared VCCIO banks driving LVDS require additional 0.001 µF caps near each LVDS pair to limit simultaneous switching noise.
The 484-ball FBGA has a 1.0 mm ball pitch; use at least a 4-layer PCB with continuous GND and PWR planes directly under the BGA. Escape traces on the top layer should not exceed a 1:1 aspect ratio with 4-mil traces. Fanout via-in-pad is not recommended — use dog-bone fanout with microvias to a 0.5 mm-pitch breakout layer to keep manufacturing yield high.
Do not leave unused LVDS pairs floating; tie each unused LVDS input pair to a defined logic level through a 10 kΩ resistor to avoid supply-current drift during configuration. Configuration pins nCONFIG, nSTATUS, CONF_DONE must each have a 4.7 kΩ pull-up to VCCIO of the configuration bank, otherwise the device may fail to enter user mode after power-up.
Compliance Information
RoHS compliance per Intel/Altera product page; REACH, halogen-free, and conflict-minerals status not stated in the verified web data and marked as 'unknown' per data authenticity rules.
