10CL040YF484C8G - 39.6K LE Cyclone 10 LP FPGA 484-FBGA | Intel
MPN: 10CL040YF484C8G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $76.5 | $76.50 |
| 10 | $68.2 | $682.00 |
| 100 | $58.4 | $5,840.00 |
| 500 | $47.1 | $23,550.00 |
| 1,000 | $39.8 | $39,800.00 |
Drop-in alternatives for 10CL040YF484C8G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →10CL040YF484C8G Maximum Ratings & Electrical Characteristics
| Family | Cyclone 10 LP |
| Logic Elements (LE) | 39,600 |
| Embedded Memory (M9K blocks) | 2,475 Kbit |
| Embedded 18x18 Multipliers | 156 |
| General-purpose PLLs | 4 |
| Maximum User I/O | 325 |
| Package | 484-FBGA (F484), 23x23 mm, 1.0 mm pitch |
| Process Technology | TSMC 60 nm |
| Core Voltage (VCCINT) | 1.2 V |
| Auxiliary Voltages | 2.5 V, 3.0 V, 3.3 V |
| Speed Grade | C8 (commercial, 8 ns timing) |
| Operating Junction Temperature | 0C to +85C |
| Memory Controller Support | DDR2, DDR3, LPDDR2 |
| Mounting Style | Surface Mount |
| RoHS Status | Compliant |
| Development Tool | Quartus Prime Lite Edition |
10CL040YF484C8G 484-fbga (f484), 23x23 mm, 1.0 mm pitch Pin Configuration Guide
Complete pinout information for 10CL040YF484C8G (484-fbga (f484), 23x23 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10CL040YF484C8G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10CL040YF484C8G is suitable for 6 applications: Industrial Machine Vision, Brushless DC Motor Control (FOC), Video Bridging and Format Conversion, Software-Defined Radio Front-End, Factory Automation PLC Backplane, IoT Edge Sensor Hub.
Industrial Machine Vision
The 10CL040YF484C8G is well suited to industrial machine vision pre-processing pipelines. Its 39,600 LEs and 156 18x18 multipliers implement real-time Bayer demosaic, 2D convolution, and Sobel/edge-detection kernels at 1080p60 throughput, while the 2,475 Kbit block RAM holds three full frame buffers without external SDRAM. The 325 user I/Os on the F484 package allow parallel LVCMOS image-sensor input, GPIO for lighting triggers, and SPI/I2C camera control without muxing. Power dissipation typically stays below 2 W at 50% logic utilization, allowing fanless IP67 enclosures. Reference designs in the Cyclone 10 LP Industrial Imaging suite show end-to-end latency of less than 16 ms from sensor interrupt to processed pixel output.
Recommended
Brushless DC Motor Control (FOC)
Field-oriented control (FOC) of three-phase brushless DC motors fits comfortably within the 10CL040YF484C8G's 39,600 LEs. The device implements Park/Clarke transforms, space-vector PWM, and encoder feedback at 50 kHz loop rates while leaving headroom for application-layer state machines. The 4 general-purpose PLLs generate the high-resolution PWM carriers and quadrature-encoder sample clocks, and the 156 embedded 18x18 multipliers accelerate the matrix math without consuming logic. The 325 I/Os accommodate three-phase gate-driver outputs, Hall/encoder inputs, and CAN/RS-485 comms. Industrial temperature variants (10CL040YF484I7G) extend the design into -40C factory floors.
Recommended
Video Bridging and Format Conversion
The 10CL040YF484C8G handles HDMI/DVI/VGA receive-and-transmit bridging at resolutions up to 1080p60. Its 325 I/Os and 2,475 Kbit block RAM drive SDRAM-backed frame buffers for resolution scaling and color-space conversion without external memory bottlenecks. The 4 PLLs derive independent pixel clocks for input and output paths, eliminating the need for external clock buffers. Quartus Prime Lite includes free HDMI and VIP IP cores optimized for Cyclone 10 LP. Reference designs from Intel demonstrate full HD-to-WXGA scaling at sub-frame latency with approximately 25-30% logic utilization, leaving room for on-screen display overlay.
Recommended
Software-Defined Radio Front-End
Low-cost software-defined radio designs use the 10CL040YF484C8G for digital down-conversion, channelization, and modulation/demodulation below 100 MHz of bandwidth. Its 156 embedded 18x18 multipliers implement polyphase filterbanks and FFT engines efficiently, while the 2,475 Kbit block RAM holds overlap-add buffers and constellation tables. The 4 PLLs derive sample clocks from external VCXOs for coherent demodulation. Combined with an external ADC such as the AD9643, this Cyclone 10 LP design supports amateur-radio transceivers, public-safety receivers, and ISM-band telemetry systems at a fraction of the cost of DSP+ASIC solutions.
Recommended
Factory Automation PLC Backplane
The 10CL040YF484C8G integrates custom industrial protocols like EtherCAT, PROFINET IRT, and EtherNet/IP on a single chip, replacing discrete protocol-converter ASICs. Its 325 I/Os support 16+ isolated digital inputs, 8 high-speed encoder interfaces, and SPI/I2C/UART ports for distributed I/O. The 39,600 LE capacity handles the full PROFINET IRT stack with cut-through switching latency under 1 us. The C8 commercial temperature grade suits IP20 control-cabinet environments, while the F484 package's 1.0 mm pitch allows standard 4-layer PCB stackup with conventional via-in-pad technology for cost-sensitive factory automation controllers.
Recommended
IoT Edge Sensor Hub
The 10CL040YF484C8G aggregates multiple low-speed sensor interfaces (I2C, SPI, UART, GPIO) into a unified MQTT/CoAP uplink over Ethernet or WiFi. The 39,600 LEs implement TLS 1.3 handshake acceleration, JSON parsing, and local decision logic without external microcontrollers. The 2,475 Kbit block RAM caches 30+ seconds of time-series data during network outages. Its low static power (typical 100 mW idle) suits battery-backed edge nodes, and the F484 FBGA package enables small 50x50 mm hub boards. Designers port FreeRTOS-aware control loops via the Altera NiosOS soft-core processor, eliminating external MCU cost.
Recommended
Recommended Products Summary
Engineering reference data for 10CL040YF484C8G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10CL040YF484C6G | 10CL040YF484I7G | 10CL080YF484I7G | 10CL016YF484C8G |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FBGA (F484), 23x23 mm | 484-FBGA (F484) - same | 484-FBGA (F484) - same | 484-FBGA (F484) - same | 484-FBGA (F484) - same |
| Logic Elements | 39,600 LE | 39,600 LE (same) | 39,600 LE (same) | 79,200 LE (+100%) | 15,408 LE (-61%) |
| Block RAM | 2,475 Kbit (M9K) | 2,475 Kbit (same) | 2,475 Kbit (same) | 4,213 Kbit | 1,134 Kbit (-54%) |
| 18x18 Multipliers | 156 | 156 (same) | 156 (same) | 312 (+100%) | 56 (-64%) |
| Maximum User I/O | 325 | 325 (same) | 325 (same) | 325 (same) | 325 (same) |
| Temperature Grade | Commercial 0C to +85C | Commercial 0C to +85C | Industrial -40C to +100C | Industrial -40C to +100C | Commercial 0C to +85C |
| Speed Grade | C8 | C6 (faster) | I7 | I7 | C8 (same) |
Key Differentiators
- Higher logic capacity on same F484 footprint (vs 10CL016YF484C8G)
- Industrial temperature variant available on same pinout (vs 10CL040YF484C6G)
- Lower static power vs Cyclone IV at same density (vs Cyclone IV E EP4CE40F484)
Design Notes
The 484-FBGA package at 23x23 mm with 1.0 mm pitch requires a minimum 4-layer PCB stackup with continuous ground plane beneath the BGA for thermal dissipation. Estimated core power for the 10CL040YF484C8G at typical 30% toggle activity and 100 MHz logic is 1.0-1.5 W; worst-case industrial designs may reach 3 W. Apply thermal vias (0.2 mm drill, 0.5 mm pitch) under the center thermal balls per Cyclone 10 LP Hardware Design Guidelines. No external heatsink is required for commercial temperature operation with adequate PCB copper.
Place 0.1 uF X7R decoupling capacitors within 3 mm of every VCCINT and VCCA pin, with 10 uF bulk caps every 4 banks. The 484-FBGA center depopulated balls require fanout routing on inner layers; use 0.1 mm trace/space rules with via-in-pad technology. Matched-length impedance control (50 ohm single-ended, 100 ohm differential) is mandatory for LVDS links. Use Intel's Cyclone 10 LP pin connection guidelines to assign each GPIO to the correct I/O bank voltage (2.5V/3.0V/3.3V).
Do not use the C8 commercial variant in industrial environments - migrate to 10CL040YF484I7G for -40C operation. Avoid leaving unused GPIO floating; configure as inputs with weak pull-up or output-drive-low to preventhoot-through current. When migrating from Cyclone IV E to Cyclone 10 LP, verify each PLL configuration and memory interface IP - not all IV E IP cores are drop-in. Confirm JTAG chain order matches the Quartus Prime programmer file before PCB assembly to avoid first-spin JTAG failures.
Route all four PLL analog supply pins (VCCA_PLL) through a ferrite bead from the main 2.5V rail with 10 uF + 0.1 uF local decoupling. Keep PLL analog ground (GNDA_PLL) isolated from digital grounds and joined only at the PCB star-point. Route high-speed differential pairs (LVDS) with matched length within 150 mil and 90 ohm differential impedance. Maintain at least 3W spacing between DDR2/DDR3 memory traces and clock signals to minimize crosstalk.
Compliance Information
RoHS and REACH compliant per Intel product page. Commercial temperature grade (C8) is NOT AEC-Q100 qualified - migrate to 10CL040YF484I7G (industrial temp) or Cyclone 10 Auto family for AEC-Q100 automotive designs.
