10M04SCM153C8G - MAX 10 FPGA 4K LE, 112 I/O, 153-MBGA | Intel
N.º de pieza: 10M04SCM153C8G ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $12.27 | $12,27 |
| 10 | $11.42 | $114,20 |
| 100 | $9.85 | $985,00 |
| 500 | $8.62 | $4.310,00 |
| 1.000 | $7.49 | $7.490,00 |
10M04SCM153C8G Descripción general
What is a non-volatile FPGA? A Field Programmable Gate Array (FPGA) is a semiconductor device whose logic, interconnect, and I/O behaviour are defined by user-supplied configuration data. Within the broader programmable logic taxonomy (FPGA -> programmable logic -> digital IC -> semiconductor), MAX 10 parts are "instant-on" non-volatile FPGAs: configuration is stored on-chip in Flash, so the device behaves like an ASIC at power-up without an external boot memory. This makes MAX 10 a hybrid positioned between small CPLDs and SRAM-based FPGAs, suitable for glue logic, I/O expansion, and control-plane functions.
Key features include 4,000 logic elements, 250 logic array blocks (CLBs), 193,536 bits (≈189 Kbit) of user SRAM, 112 general-purpose I/Os, integrated Flash configuration memory, on-chip user Flash (typically 30 to 60 Kbyte per density), and built-in PLLs and ADCs that are characteristic of the MAX 10 family. The 153-MBGA package gives a compact 8x8 mm to 9x9 mm ball grid that suits space-constrained industrial and consumer designs where density and instant-on behaviour both matter.
Architecturally, MAX 10 uses a 55 nm TSMC process with a Flash-based configuration cell underneath each logic island. This dual-oxide Flash cell stores the bitstream at wafer level, removing the need for external configuration devices and giving deterministic behaviour at t=0. The fabric mixes 4-input LUTs, embedded multipliers (DSP blocks), and user SRAM; the 04 (4K LE) density is the lowest LE count in the family, optimised for low-cost logic integration rather than DSP throughput.
Typical applications include industrial motor control, sensor interfacing and I/O aggregation, low-volume glue logic replacement, communication protocol bridging (UART/SPI/I2C-to-LVDS), and consumer display or LED control. The integrated ADC and on-chip Flash also make it popular for system management and housekeeping functions in larger CPU/SoC boards.
When designing with this part, pay attention to MBGA PCB layout rules: the 0.5 mm pitch balls require microvia or via-in-pad technology, controlled-impedance routing for high-speed interfaces, and decoupling close to every GND/VCC pair. Quartus Prime (Intel FPGA design software) is required for synthesis, place-and-route, and bitstream generation; only MAX 10 device support targets remain in current Quartus releases.
This page synthesises authorised distributor pricing, same-package drop-in equivalents from the MAX 10 family, and PCB-layout guidance that the manufacturer datasheet alone does not present in one place.
Alternativas directas para 10M04SCM153C8G — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con 10M04SCM153C8G (mismo factor de forma y huella) — difiere en Package, Family, Logic Elements (LE), Configuration Memory, Temperature Grade.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
10M04SAM153C8G
✅ Sustitución directa✓ En stock
$4.85 / unidad
Ver hoja de datos →10M04SAM153I7G
✅ Sustitución directa✓ En stock
$9.2 / unidad
Ver hoja de datos →10M04SCM153C8G Valores máximos y características eléctricas
| Family | MAX 10 |
| Logic Elements (LE) | 4,000 |
| Logic Array Blocks / CLBs | 250 |
| Embedded SRAM (bits) | 193,536 |
| User I/Os | 112 |
| Process Technology | 55 nm |
| Maximum Internal Clock Frequency | 402 MHz |
| Core Supply Voltage (nominal) | 3.0 V (range 2.85 V to 3.15 V) |
| I/O Supply Voltage | 3.3 V |
| Rango de temperatura de funcionamiento | 0 °C to 85 °C (commercial, C suffix) |
| Configuration Memory | On-chip Flash (non-volatile, instant-on) |
| Encapsulado | 153-MBGA (153-VFBGA, 0.5 mm pitch) |
| Tipo de montaje | Surface Mount |
| Estado RoHS | Compliant |
| Programming Tool | Intel Quartus Prime (MAX 10 device support) |
Guía de configuración de pines de 10M04SCM153C8G 153-mbga (153-vfbga, 0.5 mm pitch)
Configuración de pines para 10M04SCM153C8G (encapsulado 153-mbga (153-vfbga, 0.5 mm pitch)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para 10M04SCM153C8G.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
10M04SCM153C8G es adecuado para 6 aplicacións: Industrial Motor Control, Sensor I/O Aggregation and Bridging, Glue Logic Replacement and ASIC Bridge, Communication Protocol Bridging, Display and LED Control, System Management and Housekeeping.
Industrial Motor Control
The 10M04SCM153C8G is well suited to industrial motor control boards where instant-on behaviour, PWM generation, and quadrature encoder capture must coexist on a single low-cost device. Its 4,000 logic elements and 112 I/Os comfortably host multi-axis PWM, hall/encoder interfaces, fault logic, and a soft UART/SPI link to a host MCU, while on-chip Flash removes the boot PROM that would otherwise inflate BOM cost in high-volume motor drives.
Recomendado
Sensor I/O Aggregation and Bridging
In factory automation panels the 10M04SCM153C8G aggregates dozens of digital and analog sensor inputs and bridges them to a host controller over SPI, I2C, UART, or LVDS. With 112 I/Os the part can scan key matrices and LED indicators without external muxes, while its integrated ADC and 193 Kbit of SRAM allow local filtering before uplink, reducing host CPU load. The 0.5 mm MBGA keeps the aggregation hub small enough to mount near connector brackets.
Recomendado
Glue Logic Replacement and ASIC Bridge
Designers replacing ageing 74-series glue logic or small ASICs often turn to the 10M04SCM153C8G for its non-volatile instant-on behaviour and 4K LE capacity. Because configuration is stored on-chip, the part powers up into a known state, emulating an ASIC's deterministic behaviour while remaining field-reprogrammable for late ECOs. The 153-MBGA suits replacement of multi-chip TTL boards where board real-estate is constrained but pin count is high.
Recomendado
Communication Protocol Bridging
The 10M04SCM153C8G is frequently used as a UART/SPI/I2C-to-LVDS or UART-to-MIPI bridge inside larger SoC boards where the host processor lacks the required physical interface. Its 112 I/Os support multiple parallel bridges simultaneously, and the on-chip user Flash stores configuration parameters such as baud rate tables or EEPROM emulation data. Industrial 24 V tolerant I/O banks (with external protection) make it a flexible gateway between logic domains.
Recomendado
Display and LED Control
Consumer LED matrices, small TFT panels, and signage drivers benefit from the 10M04SCM153C8G's 112 I/Os and integrated SRAM for frame buffering. The fabric easily drives multiple PWM channels for dimming while staying synchronised to refresh-rate timing, and on-chip Flash lets the device boot directly into a stored animation without external memory. The compact 153-MBGA also fits behind the display module's bezel.
Recomendado
System Management and Housekeeping
The 10M04SCM153C8G's integrated ADC, on-chip user Flash, and PLLs make it a popular system-management companion to a larger CPU or SoC. Designers use it for voltage-rail sequencing, watchdog timers, fan PWM, and boot-time power-rail margining, offloading these housekeeping tasks from the main processor. The non-volatile configuration guarantees that housekeeping logic is active before the host even powers up, which is critical for safe board bring-up.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para 10M04SCM153C8G — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | 10M04SAM153C8G | 10M04SAM153I7G | 10M04SCE144A7G |
|---|---|---|---|---|
| Package | 153-MBGA | 153-MBGA (same) | 153-MBGA (same) | 144-EQFP (different) |
| Brand | Intel | Intel (same) | Intel (same) | Intel (same) |
| Family | MAX 10 (non-volatile) | MAX 10 (non-volatile) | MAX 10 (non-volatile) | MAX 10 (non-volatile) |
| Logic Elements | 4,000 | 4,000 | 4,000 | 4,000 |
| Embedded SRAM (bits) | 193,536 | 193,536 | 193,536 | 193,536 |
| Core Voltage (nominal) | 3.0 V | 3.0 V | 3.0 V | 3.0 V |
| Operating Temperature | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | -40 C to 100 C (industrial) | 0 C to 85 C (commercial) |
| Configuration Memory | On-chip Flash | On-chip Flash | On-chip Flash | On-chip Flash |
| Process Technology | 55 nm | 55 nm | 55 nm | 55 nm |
Diferenciadores clave
- Identical 153-MBGA footprint with industrial-temperature upgrade path (frente a 10M04SAM153I7G)
- Instant-on non-volatile configuration in a 4K LE fabric (frente a 10M04SCE144A7G)
- Standard speed/power bin aligned to most commercial designs (frente a 10M04SAM153C8G)
Notas de diseño
The 153-MBGA uses a 0.5 mm ball pitch; design the PCB with microvia or via-in-pad technology to escape the inner balls. Use a 1-2-1 or 1-2-1-2 stack-up with 0.4 mm via pad and 0.2 mm drill, and follow the Intel MAX 10 pin connection guidelines for ball-side fan-out. Place at least one 0.1 uF decoupling capacitor per VCC/GND pair and a 10 uF bulk capacitor near the core supply pin to meet MAX 10 power-integrity requirements.
Keep LVDS and clock traces length-matched within the skew budget documented in the MAX 10 device handbook. Route high-speed differential pairs on the top layer over a continuous ground plane, avoiding splits between analog and digital grounds. Use 50 ohm single-ended and 100 ohm differential controlled impedance for the high-speed I/O bank; mismatched impedance will degrade the 402 MHz fMAX that the part advertises.
Do not confuse the SC and SA MAX 10 speed/power bins: the SC bin is the standard offering and the SA bin typically denotes a different static-power or speed characterisation. The C8G temperature suffix is commercial (0 C to 85 C); for industrial designs choose the I7G variant in the same 153-MBGA footprint (for example 10M04SAM153I7G). Verify the device prefix against the Quartus Prime device list before tape-out, because mixed-bin boards are a common ECO source.
Información de cumplimiento
RoHS and lead-free compliance inferred from Intel MAX 10 product family datasheet packaging information; MSL level and halogen-free status not confirmed by the verified web data and require datasheet verification.
