10M04SCM153C8G - MAX 10 FPGA 4K LE, 112 I/O, 153-MBGA | Intel
MPN: 10M04SCM153C8G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $12.27 | $12.27 |
| 10 | $11.42 | $114.20 |
| 100 | $9.85 | $985.00 |
| 500 | $8.62 | $4,310.00 |
| 1,000 | $7.49 | $7,490.00 |
Drop-in alternatives for 10M04SCM153C8G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M04SAM153C8G
✅ Drop-In✓ In Stock
$4.85 / Unit
View Datasheet →10M04SAM153I7G
✅ Drop-In✓ In Stock
$9.2 / Unit
View Datasheet →10M04SCM153C8G Maximum Ratings & Electrical Characteristics
| Family | MAX 10 |
| Logic Elements (LE) | 4,000 |
| Logic Array Blocks / CLBs | 250 |
| Embedded SRAM (bits) | 193,536 |
| User I/Os | 112 |
| Process Technology | 55 nm |
| Maximum Internal Clock Frequency | 402 MHz |
| Core Supply Voltage (nominal) | 3.0 V (range 2.85 V to 3.15 V) |
| I/O Supply Voltage | 3.3 V |
| Operating Temperature Range | 0 °C to 85 °C (commercial, C suffix) |
| Configuration Memory | On-chip Flash (non-volatile, instant-on) |
| Package | 153-MBGA (153-VFBGA, 0.5 mm pitch) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Programming Tool | Intel Quartus Prime (MAX 10 device support) |
10M04SCM153C8G 153-mbga (153-vfbga, 0.5 mm pitch) Pin Configuration Guide
Complete pinout information for 10M04SCM153C8G (153-mbga (153-vfbga, 0.5 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M04SCM153C8G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M04SCM153C8G is suitable for 6 applications: Industrial Motor Control, Sensor I/O Aggregation and Bridging, Glue Logic Replacement and ASIC Bridge, Communication Protocol Bridging, Display and LED Control, System Management and Housekeeping.
Industrial Motor Control
The 10M04SCM153C8G is well suited to industrial motor control boards where instant-on behaviour, PWM generation, and quadrature encoder capture must coexist on a single low-cost device. Its 4,000 logic elements and 112 I/Os comfortably host multi-axis PWM, hall/encoder interfaces, fault logic, and a soft UART/SPI link to a host MCU, while on-chip Flash removes the boot PROM that would otherwise inflate BOM cost in high-volume motor drives.
Recommended
Sensor I/O Aggregation and Bridging
In factory automation panels the 10M04SCM153C8G aggregates dozens of digital and analog sensor inputs and bridges them to a host controller over SPI, I2C, UART, or LVDS. With 112 I/Os the part can scan key matrices and LED indicators without external muxes, while its integrated ADC and 193 Kbit of SRAM allow local filtering before uplink, reducing host CPU load. The 0.5 mm MBGA keeps the aggregation hub small enough to mount near connector brackets.
Recommended
Glue Logic Replacement and ASIC Bridge
Designers replacing ageing 74-series glue logic or small ASICs often turn to the 10M04SCM153C8G for its non-volatile instant-on behaviour and 4K LE capacity. Because configuration is stored on-chip, the part powers up into a known state, emulating an ASIC's deterministic behaviour while remaining field-reprogrammable for late ECOs. The 153-MBGA suits replacement of multi-chip TTL boards where board real-estate is constrained but pin count is high.
Recommended
Communication Protocol Bridging
The 10M04SCM153C8G is frequently used as a UART/SPI/I2C-to-LVDS or UART-to-MIPI bridge inside larger SoC boards where the host processor lacks the required physical interface. Its 112 I/Os support multiple parallel bridges simultaneously, and the on-chip user Flash stores configuration parameters such as baud rate tables or EEPROM emulation data. Industrial 24 V tolerant I/O banks (with external protection) make it a flexible gateway between logic domains.
Recommended
Display and LED Control
Consumer LED matrices, small TFT panels, and signage drivers benefit from the 10M04SCM153C8G's 112 I/Os and integrated SRAM for frame buffering. The fabric easily drives multiple PWM channels for dimming while staying synchronised to refresh-rate timing, and on-chip Flash lets the device boot directly into a stored animation without external memory. The compact 153-MBGA also fits behind the display module's bezel.
Recommended
System Management and Housekeeping
The 10M04SCM153C8G's integrated ADC, on-chip user Flash, and PLLs make it a popular system-management companion to a larger CPU or SoC. Designers use it for voltage-rail sequencing, watchdog timers, fan PWM, and boot-time power-rail margining, offloading these housekeeping tasks from the main processor. The non-volatile configuration guarantees that housekeeping logic is active before the host even powers up, which is critical for safe board bring-up.
Recommended
Recommended Products Summary
Engineering reference data for 10M04SCM153C8G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M04SAM153C8G | 10M04SAM153I7G | 10M04SCE144A7G |
|---|---|---|---|---|
| Package | 153-MBGA | 153-MBGA (same) | 153-MBGA (same) | 144-EQFP (different) |
| Brand | Intel | Intel (same) | Intel (same) | Intel (same) |
| Family | MAX 10 (non-volatile) | MAX 10 (non-volatile) | MAX 10 (non-volatile) | MAX 10 (non-volatile) |
| Logic Elements | 4,000 | 4,000 | 4,000 | 4,000 |
| User I/Os | 112 | 112 | 112 | [DATA_NEEDED] |
| Embedded SRAM (bits) | 193,536 | 193,536 | 193,536 | 193,536 |
| Core Voltage (nominal) | 3.0 V | 3.0 V | 3.0 V | 3.0 V |
| Operating Temperature | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | -40 C to 100 C (industrial) | 0 C to 85 C (commercial) |
| Configuration Memory | On-chip Flash | On-chip Flash | On-chip Flash | On-chip Flash |
| Process Technology | 55 nm | 55 nm | 55 nm | 55 nm |
Key Differentiators
- Identical 153-MBGA footprint with industrial-temperature upgrade path (vs 10M04SAM153I7G)
- Instant-on non-volatile configuration in a 4K LE fabric (vs 10M04SCE144A7G)
- Standard speed/power bin aligned to most commercial designs (vs 10M04SAM153C8G)
Design Notes
The 153-MBGA uses a 0.5 mm ball pitch; design the PCB with microvia or via-in-pad technology to escape the inner balls. Use a 1-2-1 or 1-2-1-2 stack-up with 0.4 mm via pad and 0.2 mm drill, and follow the Intel MAX 10 pin connection guidelines for ball-side fan-out. Place at least one 0.1 uF decoupling capacitor per VCC/GND pair and a 10 uF bulk capacitor near the core supply pin to meet MAX 10 power-integrity requirements.
Keep LVDS and clock traces length-matched within the skew budget documented in the MAX 10 device handbook. Route high-speed differential pairs on the top layer over a continuous ground plane, avoiding splits between analog and digital grounds. Use 50 ohm single-ended and 100 ohm differential controlled impedance for the high-speed I/O bank; mismatched impedance will degrade the 402 MHz fMAX that the part advertises.
Do not confuse the SC and SA MAX 10 speed/power bins: the SC bin is the standard offering and the SA bin typically denotes a different static-power or speed characterisation. The C8G temperature suffix is commercial (0 C to 85 C); for industrial designs choose the I7G variant in the same 153-MBGA footprint (for example 10M04SAM153I7G). Verify the device prefix against the Quartus Prime device list before tape-out, because mixed-bin boards are a common ECO source.
Compliance Information
RoHS and lead-free compliance inferred from Intel MAX 10 product family datasheet packaging information; MSL level and halogen-free status not confirmed by the verified web data and require datasheet verification.
