10M50DAF672C7G - MAX 10 FPGA, 50K LE, 672-FBGA | Intel/Altera
N.º de pieza: 10M50DAF672C7G ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $71.77 | $71,77 |
| 10 | $64.59 | $645,90 |
| 100 | $57.42 | $5.742,00 |
| 250 | $52.83 | $13.207,50 |
| 500 | $48.25 | $24.125,00 |
10M50DAF672C7G Descripción general
What is an FPGA? An FPGA (Field-Programmable Gate Array) is a programmable logic device whose interconnect and function blocks can be reconfigured after manufacture. MAX 10 FPGAs belong to Intel's non-volatile family that combines logic fabric with on-chip flash for instant-on operation, positioning them between small CPLDs and larger Cyclone/Stratix families in the programmable-logic taxonomy: programmable logic -> FPGA -> non-volatile FPGA -> low-power FPGA family.
Key features of the 10M50DAF672C7G include 500 logic array blocks (LAB), 1,677,312 total memory bits, integrated 12-bit ADC blocks, dual-boot flash configuration support, and DSP blocks for fixed-point arithmetic. The 672-FBGA package provides high I/O density for parallel interfaces, while the commercial temperature grade targets industrial and embedded applications.
Technically, the device uses a non-volatile SRAM-backed architecture with embedded flash that loads configuration at power-on in microseconds - far faster than external-boot FPGAs. The 55 nm process balances power and cost, while the integrated ADC and analog blocks allow mixed-signal designs without external converters.
Typical applications include industrial motor control, factory automation I/O expansion, portable medical instrumentation, low-cost video bridging, and embedded vision pre-processing where instant-on, mixed-signal, and parallel I/O are required.
When designing with this FPGA, allocate sufficient PCB area for the 672-ball FBGA fanout and follow Intel's MAX 10 power-sequencing guidelines; the C7 speed grade offers balanced timing closure for most embedded workloads.
This page synthesizes distributor pricing, drop-in alternatives within the MAX 10 family, and practical design notes not found in the manufacturer datasheet alone.
Alternativas directas para 10M50DAF672C7G — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con 10M50DAF672C7G (mismo factor de forma y huella) — difiere en Package, Operating Temperature, Speed Grade, Configuration Memory, DSP Blocks.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
10M50DAF672C8G
✅ Sustitución directa✓ En stock
$97.6 / unidad
Ver hoja de datos →10M50DAF672I7G
✅ Sustitución directa✓ En stock
$144.2 / unidad
Ver hoja de datos →10M40DAF672C7G
✅ Sustitución directa✓ En stock
$67.2 / unidad
Ver hoja de datos →10M40DAF672C8G
✅ Sustitución directa✓ En stock
$86.1 / unidad
Ver hoja de datos →10M40DAF672I7G
✅ Sustitución directa✓ En stock
$65.85 / unidad
Ver hoja de datos →10M50DAF672C7G Valores máximos y características eléctricas
| Family | MAX 10 |
| Logic Elements (LE) | 50,000 |
| Logic Array Blocks (LAB) | 500 |
| Total Memory Bits | 1,677,312 |
| Embedded Memory | 1,638 Kbit |
| Process Technology | 55 nm |
| Core Voltage | 1.2 V |
| Encapsulado | 672-FBGA (F672) |
| Package Code | BGA, Square, Ball |
| Number of Terminals | 672 |
| Configuration Memory | Dual-boot on-chip flash |
| Speed Grade | C7 |
| Temperature Grade | Commercial (other) |
| Tipo de montaje | Surface Mount |
| Estado RoHS | Compliant |
| Integrated ADC | Yes (12-bit, on-chip) |
| DSP Blocks | Yes |
Guía de configuración de pines de 10M50DAF672C7G bga, square, ball
Configuración de pines para 10M50DAF672C7G (encapsulado bga, square, ball). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para 10M50DAF672C7G.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
10M50DAF672C7G es adecuado para 6 aplicacións: Industrial Motor Control, Factory Automation I/O Expansion, Portable Medical Instrumentation, Low-Cost Video Bridging, Embedded Vision Pre-Processing, IoT Edge Gateways.
Industrial Motor Control
The 10M50DAF672C7G's 50,000 logic elements and integrated 12-bit ADC blocks make it ideal for industrial motor-control designs. The 672-FBGA provides sufficient I/O for parallel encoder, resolver, and PWM interfaces, while the on-chip ADC samples current and voltage feedback without external converters. The MAX 10's dual-boot flash supports field firmware updates critical for installed-base motor drives. Compared with a discrete MCU-plus-FPGA partition, the integrated ADC cuts BOM cost and PCB area, while the non-volatile instant-on enables safe torque-disable within milliseconds of power-up.
Recomendado
Factory Automation I/O Expansion
The 10M50DAF672C7G's high I/O count in the 672-FBGA package suits factory automation I/O expansion modules. With 50K LE the device can implement dozens of industrial protocols (Modbus, EtherCAT slaves, Profibus) in soft logic while the on-chip flash stores configuration and field-calibration data. The commercial C7 speed grade meets timing closure for sub-microsecond deterministic I/O response required by PLC backplanes. Engineers typically pair this FPGA with external PHY transceivers for galvanic isolation, leveraging the MAX 10's flexible I/O voltage standards.
Recomendado
Portable Medical Instrumentation
The 10M50DAF672C7G's low-power non-volatile architecture and integrated ADC blocks suit battery-powered medical instrumentation such as patient monitors and portable ultrasound front-ends. The on-chip flash enables instant-on boot for clinician-activated devices, while the 1.2 V core minimizes quiescent power. The 12-bit ADC captures analog sensor channels (ECG, SpO2, temperature) directly, eliminating separate ADC ICs. Designers should verify IEC 60601 compliance for patient-contact circuits; the FPGA itself does not provide isolation, so external barrier components are still required.
Recomendado
Low-Cost Video Bridging
The 10M50DAF672C7G's 50K LE supports video bridge designs converting between MIPI CSI-2, LVDS, CMOS parallel, and HDMI streams. The 672-FBGA's high I/O count accommodates wide parallel video buses plus LVDS serializer channels. Embedded DSP blocks accelerate scaling and color-space conversion, while the integrated ADC is unused in pure-digital video paths. The non-volatile flash allows rapid boot for camera modules and display controllers, and the commercial C7 grade meets timing for 1080p60 pixel-clock domains at moderate logic utilization.
Recomendado
Embedded Vision Pre-Processing
The 10M50DAF672C7G delivers enough logic (50K LE) and DSP blocks to perform front-end image pre-processing (filtering, thresholding, Bayer conversion) before passing data to a host processor. The 672-FBGA's I/O count enables direct connection to parallel image sensors, while the integrated ADC monitors illumination and supply rails. Dual-boot flash supports A/B firmware schemes for safe field upgrades in vision-equipped IoT nodes. Compared with running pre-processing on the host CPU, the FPGA offloads deterministic per-pixel work, lowering system latency and power.
Recomendado
IoT Edge Gateways
The 10M50DAF672C7G's combination of non-volatile boot, integrated ADC, and 50K LE makes it a fit for IoT edge gateways aggregating sensor data before forwarding to the cloud. The 672-FBGA package provides GPIO for RS-485, CAN, and I2C sensor networks, while the MAX 10's low standby power suits solar or battery-powered installations. The dual-boot flash enables OTA firmware rollback, and the commercial temperature grade covers most outdoor enclosures without requiring industrial-temp parts.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para 10M50DAF672C7G — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | 10M50DAF672C8G | 10M50DAF672I7G | 10M40DAF672C7G | 10M40DAF672C8G | 10M40DAF672I7G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-FBGA (F672) | 672-FBGA (F672) - same | 672-FBGA (F672) - same | 672-FBGA (F672) - same | 672-FBGA (F672) - same | 672-FBGA (F672) - same |
| Logic Elements | 50,000 LE | 50,000 LE | 50,000 LE | 40,000 LE (-20%) | 40,000 LE (-20%) | 40,000 LE (-20%) |
| Speed Grade | C7 | C8 (slower) | I7 (industrial) | C7 | C8 (slower) | I7 (industrial) |
| Temperature Grade | Commercial | Commercial | Industrial (-40C to +100C) | Commercial | Commercial | Industrial (-40C to +100C) |
| Embedded Memory | 1,638 Kbit | 1,638 Kbit | 1,638 Kbit | 1,260 Kbit (-23%) | 1,260 Kbit (-23%) | 1,260 Kbit (-23%) |
| Integrated ADC | Yes (12-bit) | Yes (12-bit) | Yes (12-bit) | Yes (12-bit) | Yes (12-bit) | Yes (12-bit) |
| Non-Volatile Configuration | Yes (dual-boot flash) | Yes (dual-boot flash) | Yes (dual-boot flash) | Yes (dual-boot flash) | Yes (dual-boot flash) | Yes (dual-boot flash) |
Diferenciadores clave
- Highest logic density in the 672-FBGA MAX 10 family (frente a 10M40DAF672C7G)
- Faster speed grade than C8 equivalent (frente a 10M50DAF672C8G)
- Commercial temperature grade offers lower cost versus industrial grade (frente a 10M50DAF672I7G)
Notas de diseño
The 672-FBGA package requires a 1.0 mm pitch BGA fanout with microvia or via-in-pad technology for escape routing. Recommended stackup is a 6- or 8-layer PCB with continuous ground planes beneath the device to control return paths for high-speed LVDS and DDR interfaces. Decoupling capacitors (100 nF plus 10 uF bulk) must be placed within 5 mm of each power pin pair; Intel's MAX 10 hardware reference design provides a validated decoupling network.
The 1.2 V core supply must ramp monotonically within 0.2 ms to 100 ms; out-of-spec ramp rates can trigger configuration failures or partial flash writes. Use a sequenced power-supply IC (such as Intel's MAX 10 power-tree reference) with explicit Power-On-Reset (POR) monitoring. The I/O voltage rails (1.8 V, 2.5 V, 3.3 V) can be independent of core voltage but must settle before the configuration phase ends.
Do not confuse MAX 10 speed grades with one another: C7 is faster than C8 by one speed step, and selecting C8 may fail timing closure at the target Fmax. Also, the commercial temperature grade (this part) limits operation to 0 C to +85 C; for industrial environments, select the I7 suffix variant (e.g. 10M50DAF672I7G) without changing the PCB footprint.
Información de cumplimiento
RoHS compliant per Intel/Altera product page. AEC-Q100 not applicable (industrial/commercial FPGA, not automotive-qualified). Industrial temperature grade available as 10M50DAF672I7G variant.
