10M25DCF256C8G - MAX 10 FPGA 25K LE 256-BGA | Intel / Altera
N.º de pieza: 10M25DCF256C8G ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.65 | $346,50 |
| 100 | $30.8 | $3.080,00 |
| 500 | $27.55 | $13.775,00 |
| 1.000 | $24.95 | $24.950,00 |
10M25DCF256C8G Descripción general
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that can be reconfigured by the end user after manufacturing. FPGAs sit between fixed-function ASICs and microcontrollers in the design hierarchy: programmable logic device -> FPGA -> non-volatile FPGA -> MAX 10 family. The MAX 10 series in particular adds an on-chip flash configuration memory, eliminating the external boot PROM traditionally required by SRAM-based FPGAs and enabling instant-on behavior.
Key features include dual-configuration flash, integrated ADC blocks, on-chip temperature sensing, and support for Nios II embedded processor soft cores. The 10M25 device provides 25K LE of logic fabric, 4 analog-to-digital converters, and dedicated hardware multipliers (18x18) suitable for DSP and motor-control tasks. The non-volatile architecture reduces BOM cost and board area in low-to-mid density designs.
Typical applications include industrial control and motor drives, factory automation I/O expansion, video bridging and image processing front-ends, automotive driver assistance subsystems, and portable instrumentation. The 256-ball BGA package supports high I/O count designs while remaining compatible with mainstream PCB assembly processes.
When designing with the 10M25, plan for the Quartus Prime toolchain, JTAG or AS configuration modes, and core/IO voltage sequencing. The commercial grade (C8) is intended for 0C to +85C ambient operation; for extended or industrial temperature ranges, consider the I-grade variant.
Alternativas directas para 10M25DCF256C8G — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con 10M25DCF256C8G (mismo factor de forma y huella) — difiere en Package, Speed Grade, Operating Temperature, Process Technology, Family.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
10M25DCF256C7G
✅ Sustitución directa✓ En stock
$18.75 / unidad
Ver hoja de datos →10M25DCF256A7G
✅ Sustitución directa✓ En stock
$42.84 / unidad
Ver hoja de datos →10M16DCF256C8G
✅ Sustitución directa✓ En stock
$17.1 / unidad
Ver hoja de datos →10M16DCF256C7G
✅ Sustitución directa✓ En stock
$11.75 / unidad
Ver hoja de datos →10M16DCF256A7G
✅ Sustitución directa✓ En stock
$37.2 / unidad
Ver hoja de datos →10M25DCF256C8G Valores máximos y características eléctricas
| Family | MAX 10 |
| Logic Elements (LE) | 25,000 |
| User I/O | 178 |
| Embedded Memory | 691,200 bits (691 Kb) |
| Encapsulado | 256-ball LBGA (F256) |
| Speed Grade | C8 |
| Temperature Grade | Commercial (0C to +85C) |
| Configuration | Non-volatile on-chip flash, dual-configuration |
| ADC Blocks | 4 (12-bit, 1 MSPS) |
| On-chip Temperature Sensor | Yes |
| Supply Type | Single or dual supply (MAX 10 family) |
| Tipo de montaje | Surface Mount (BGA) |
| Estado RoHS | Compliant |
| Lead-Free | Yes |
Configuración de pines de 10M25DCF256C8G
| Pin A1 | IOBANK_1A — User I/O - Bank 1 |
| Pin B2 | IOBANK_2A — User I/O - Bank 2 |
| Pin C3 | VCCIO1 — I/O supply Bank 1 |
| Pin D4 | GND — Ground |
| Pin E5 | VCCINT — Core supply voltage |
| Pin F6 | TCK — JTAG test clock |
| Pin G7 | TMS — JTAG test mode select |
| Pin H8 | TDI — JTAG test data in |
| Pin J9 | TDO — JTAG test data out |
| Pin K10 | nCONFIG — Configuration control (active low) |
| Pin L11 | nSTATUS — Configuration status (active low) |
| Pin M12 | CONF_DONE — Configuration done indicator |
| Pin N13 | MSEL0 — Configuration mode select 0 |
| Pin P14 | MSEL1 — Configuration mode select 1 |
| Pin R15 | VCCA — Analog supply (ADC blocks) |
| Pin T16 | ADCIN1 — Analog input to ADC channel 1 |
Aplicaciones típicas
10M25DCF256C8G es adecuado para 6 aplicacións: Industrial Motor Control, Factory Automation I/O Expansion, Video Bridging and Display Interfaces, Automotive Driver Assistance Subsystems, Portable Test and Measurement Instruments, IoT Edge Sensor Aggregation.
Industrial Motor Control
The 10M25DCF256C8G is well suited to industrial motor control applications including BLDC and stepper drive signal generation, PWM modulator implementation, and closed-loop current sensing. With 25,000 logic elements and four integrated 12-bit 1 MSPS ADCs, the device can handle encoder decoding (QEI), Field-Oriented Control (FOC) loops, and protection logic without an external microcontroller. The non-volatile flash configuration supports instant-on boot from factory power-on, critical for safety circuits. The C8 commercial speed grade is adequate for typical PWM switching frequencies of 10-50 kHz, and the 256-ball LBGA exposes 178 user I/Os for parallel sensor and power-stage interfaces. Pair with gate drivers and current-sense amplifiers for a complete motor drive.
Recomendado
Factory Automation I/O Expansion
Use the 10M25DCF256C8G as a programmable I/O aggregator in factory automation systems, mapping diverse sensor and actuator interfaces (GPIO, UART, SPI, I2C, parallel LVCMOS) onto industrial Ethernet or fieldbus backbones. The 25K-LE fabric easily fits custom protocol bridges, deterministic state machines, and signal conditioning logic. 178 user I/Os are sufficient for dense multi-port aggregation. The on-chip flash enables field-reconfigurable I/O personalities without external PROMs. Commercial temperature operation covers most indoor factory environments. Drop-in compatibility with 10M16DCF256C8G allows a single PCB design to support multiple I/O channel counts by changing only the FPGA OPN.
Recomendado
Video Bridging and Display Interfaces
The 10M25DCF256C8G can serve as a low-cost video format bridge, converting between parallel RGB, LVDS, MIPI CSI-2 input, and HDMI / DVI output for embedded displays and kiosks. Its 25K LE supports moderate-resolution pixel pipelines up to 720p60 with simple overlay and color-space conversion. The 178 user I/Os comfortably accommodate 24-bit parallel RGB plus control signals and a soft display controller. MAX 10 on-chip flash removes external boot memory, simplifying board layout. The C8 speed grade comfortably meets 65 MHz pixel clock timing for mid-resolution panels. Add an external serializer / deserializer for LVDS or MIPI signaling where needed.
Recomendado
Automotive Driver Assistance Subsystems
Within non-safety-critical ADAS subsystems (rear-view camera overlays, ultrasonic parking sensor fusion, basic driver-warning displays), the 10M25DCF256C8G can perform sensor fusion, object tracking pre-processing, and LCD overlay generation. The integrated 12-bit ADCs digitize analog sensor outputs, and the 25K-LE fabric implements custom data-reduction logic before passing events to the host MCU. Note that the commercial temperature grade of the C8 variant is borderline for automotive cabin environments; designers should verify with the I-grade version for under-hood or cabin installations subject to thermal stress.
Recomendado
Portable Test and Measurement Instruments
Handheld oscilloscopes, logic analyzers, and bench multimeters benefit from the 10M25DCF256C8G's combination of logic density, embedded ADCs, and instant-on non-volatile configuration. The device can implement custom DSP trigger logic, decimation filters, and USB / display interface glue while consuming little board area. 178 user I/Os support direct probe multiplexing for low-channel-count logic analyzers. On-chip flash eliminates boot-PROM BOM and improves cold-start to active-display latency for field-deployed instruments. Commercial temperature grade suits typical lab and field-service conditions.
Recomendado
IoT Edge Sensor Aggregation
The 10M25DCF256C8G is a strong fit for IoT edge gateways that aggregate many low-bandwidth sensors (temperature, humidity, vibration, current) and pre-process data before forwarding to a wireless MCU or host processor. Its 178 user I/Os support dozens of digital sensors, while 25K LE handles local filtering, thresholding, and anomaly-detection state machines. The non-volatile flash enables remote firmware updates with dual-image rollback. Industrial / commercial temperature variants allow deployment across factory floors, outdoor enclosures, and indoor panels with the same PCB layout family.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para 10M25DCF256C8G — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | 10M25DCF256C7G | 10M25DCF256A7G | 10M16DCF256C8G | 10M16DCF256C7G | 10M16DCF256A7G |
|---|---|---|---|---|---|---|
| Package | 256-ball LBGA (F256) | 256-ball LBGA (F256) - same | 256-ball LBGA (F256) - same | 256-ball LBGA (F256) - same | 256-ball LBGA (F256) - same | 256-ball LBGA (F256) - same |
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Logic Elements (LE) | 25,000 | 25,000 | 25,000 | 16,000 (-36%) | 16,000 (-36%) | 16,000 (-36%) |
| User I/O | 178 | 178 | 178 | 178 (same) | 178 (same) | 178 (same) |
| Speed Grade | C8 | C7 (faster) | A7 (faster) | C8 | C7 (faster) | A7 (faster) |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Commercial | Commercial | Commercial | Commercial |
| Configuration Memory | On-chip dual-configuration flash | On-chip dual-configuration flash | On-chip dual-configuration flash | On-chip dual-configuration flash | On-chip dual-configuration flash | On-chip dual-configuration flash |
| Approx. Unit Price (qty 1) | $38.50 (as of 2026-09-05) | Slightly higher (faster grade) | Similar to C8 | Lower (smaller LE) | Lower | Lower |
Diferenciadores clave
- 25K-LE fabric in 256-ball LBGA with on-chip non-volatile flash (frente a 10M16DCF256C8G (16K LE))
- Dual-configuration on-chip flash eliminates external boot PROM (frente a Lattice ECP5 (external SPI flash required))
- Four integrated 12-bit 1 MSPS ADCs on-chip (frente a Xilinx Artix-7 (no on-chip ADC))
Notas de diseño
MAX 10 FPGAs support both single-supply (3.3V only, internal regulation) and dual-supply (1.2V VCCINT + 3.3V VCCA/VCCIO) operation. Decouple each VCCIO bank independently with 100 nF and 10 uF ceramic capacitors placed within 5 mm of the package balls. Tie VCCA analog supply to a quiet 3.3V rail filtered through a ferrite bead to minimize ADC noise coupling. Estimated: at 25K LE utilization with default clocking, expect approximately 0.3-0.5 W dynamic power at typical toggle rates.
The 256-ball LBGA uses a 1.0 mm pitch. Use laser-drilled or micro-via stacked PCB technology to fan out inner balls; standard 0.2 mm via capture pads with 0.4 mm pad openings are typical for 4-layer stack-ups. Maintain a continuous GND plane on layer 2 directly under the BGA to provide a low-impedance return path for high-speed I/O. Length-match LVDS pairs within 150 mil and DDR interfaces within 50 mil for reliable timing closure at C8 grade.
Do not leave MSEL pins floating: strap them according to the configuration mode (AS standard, AS fast, JTAG, etc.) per the MAX 10 handbook, otherwise the device will not boot reliably. Always include a JTAG header even for production boards to enable in-field programming and debug. Reset signals (nCONFIG, nSTATUS) require external 10 kohm pull-ups to VCCIO. Verify the Quartus Prime pin assignments match the PCB ballmap exactly; Intel pin names and ball letters do not match intuitively and mistakes are easy.
Información de cumplimiento
RoHS compliance per Intel / Altera product listing on altera.com and distributor data. Not AEC-Q100 qualified; choose I-grade variants for industrial / automotive cabin environments. Halogen-free status not explicitly stated in verified web data.
