5CSEBA4U23C8N - Cyclone V SE SoC FPGA, 40K LE, Dual ARM Cortex-A9 | Intel
N.º de pieza: 5CSEBA4U23C8N ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $185 | $185,00 |
| 10 | $175.5 | $1.755,00 |
| 100 | $162 | $16.200,00 |
| 500 | $148.75 | $74.375,00 |
| 1.000 | $138.2 | $138.200,00 |
5CSEBA4U23C8N Descripción general
What is a SoC FPGA? A SoC FPGA integrates a microprocessor subsystem (typically ARM Cortex-A) with a programmable FPGA fabric on the same silicon die. This architecture sits within the broader product hierarchy of programmable logic devices: FPGA > SoC FPGA > FPGA + hard processor > general-purpose processor. By combining a deterministic parallel hardware fabric with sequential software programmability, SoC FPGAs enable high-throughput sensor pipelines, custom accelerators, and Linux-capable control on a single chip, reducing BOM cost and board area relative to discrete CPU + FPGA designs.
Key features of the 5CSEBA4U23C8N include 40K logic elements, approximately 2,460 Kbits of embedded memory, integrated DDR3/DDR3L/LPDDR2 controller with hard PHY in the HPS, support for high-speed serial transceivers, and dual ARM Cortex-A9 MPCore CPUs with NEON media engine and single/double-precision FPU. The device offers 188 general-purpose I/Os and high-speed LVDS interfaces, making it suitable for parallel sensor aggregation.
The Cyclone V SE architecture pairs the HPS (with coherent L1/L2 caches, ECC, and Cortex-A9 NEON/FPU) with a low-power FPGA fabric that supports variable-precision DSP blocks, 18x18 multipliers, and hard memory controllers. Multiport front-end peripherals (Gigabit Ethernet, USB 2.0 OTG, CAN, UART, SPI, I2C, NAND/SDXC) connect directly to the HPS through high-bandwidth system interconnect.
Typical applications include industrial machine vision systems, motor control and industrial automation, automotive driver assistance (ADAS) front camera platforms, video surveillance with analytics, and Linux-based embedded edge gateways. The 600 MHz ARM cores support real-time Linux/RTOS hybrid systems while the FPGA fabric accelerates pixel pipelines or custom interfaces.
When designing with this device, pay careful attention to HPS-FPGA bridge bandwidth (AXI-128/64/32) and decoupling on the multi-rail power supply (1.1 V core, 1.8 V/2.5 V I/O, 3.3 V analog). For DDR3 operation, follow Intel's pin-pair length-matching rules in the device handbook. Lead-free assembly requires standard JEDEC J-STD-020 MSL3 profile.
This page synthesizes distributor inventory, drop-in same-family variants, and design notes not found in the manufacturer datasheet, providing an independent reference for procurement and engineering teams.
Alternativas directas para 5CSEBA4U23C8N — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con 5CSEBA4U23C8N (mismo factor de forma y huella) — difiere en Package, Logic Elements, Operating Temperature, Transceivers, Process Technology.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
5CSEBA4U23C7SN
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Ver hoja de datos →5CSEBA4U23C7N
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Ver hoja de datos →5CSEBA4U23C6N
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Ver hoja de datos →5CSEBA4U19C8N
✅ Sustitución directa✓ En stock
$54.75 / unidad
Ver hoja de datos →5CSEBA2U23C8N
✅ Sustitución directa✓ En stock
$55.5 / unidad
Ver hoja de datos →5CSEBA4U23A7N
✅ Sustitución directa✓ En stock
$185 / unidad
Ver hoja de datos →5CSEBA4U23C8N Valores máximos y características eléctricas
| Family | Cyclone V SE SoC FPGA |
| Logic Elements (LE) | 40,000 |
| Processor Core | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum HPS Frequency | 600 MHz |
| Multipliers | 18x18 dedicated multipliers |
| Maximum User I/O | 188 |
| Encapsulado | 672-pin UBGA (UBGA-672, 23x23 mm) |
| Process Technology | TSMC 28 nm low-power |
| HPS Peripherals | Gigabit Ethernet, USB 2.0 OTG, CAN, UART, SPI, I2C, NAND, SDXC |
| Memory Controller (HPS) | DDR3/DDR3L/LPDDR2 with hard PHY |
| Tipo de montaje | Surface Mount (BGA) |
| Estado RoHS | Compliant |
| Lead-Free | Yes |
Guía de configuración de pines de 5CSEBA4U23C8N 672-pin ubga (ubga-672, 23x23 mm)
Configuración de pines para 5CSEBA4U23C8N (encapsulado 672-pin ubga (ubga-672, 23x23 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para 5CSEBA4U23C8N.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
5CSEBA4U23C8N es adecuado para 6 aplicacións: Industrial Machine Vision Systems, Motor Control & Industrial Automation, Automotive ADAS Front Camera Platform, Video Surveillance with Edge Analytics, Embedded Linux Edge Gateways, Software-Defined Radio Baseband Processing.
Industrial Machine Vision Systems
The 5CSEBA4U23C8N is ideal for industrial machine vision platforms because its 40K logic elements and 188 user I/Os absorb Camera Link, CoaXPress, or parallel-LVDS sensor front-end pipelines while the dual 600 MHz ARM Cortex-A9 MPCore HPS runs vision analytics and TCP/IP connectivity. Integrated DDR3 controller with hard PHY streams 4K frame buffers at full bandwidth without FPGA fabric overhead. Compared to a discrete CPU + FPGA stack, the SoC FPGA reduces PCB area by 40-50% and BOM cost by 25% in conveyor-inspection and pick-and-place systems. JTAG/AS programming via Quartus accelerates factory calibration.
Recomendado
Motor Control & Industrial Automation
In motor control drives and PLC platforms, the 5CSEBA4U23C8N's hard ARM Cortex-A9 cores handle EtherCAT master stacks, motion trajectory planning, and HMI rendering, while the FPGA fabric implements deterministic PWM generators, encoder interfaces, and safety logic with sub-microsecond latency. The 28 nm low-power process keeps the SoC below 5 W typical, enabling fanless DIN-rail enclosures. 188 user I/Os aggregate multiple encoder channels, sigma-delta ADCs, and gate-driver interfaces on a single chip. Industrial temperature variants (I7 speed grade) are available in the same U23 footprint.
Recomendado
Automotive ADAS Front Camera Platform
The 5CSEBA4U23C8N supports automotive ADAS front-camera preprocessing by running lane-detection and object-classification CNN inference on the dual 600 MHz ARM Cortex-A9 with NEON vector extensions, while the 40K-LE FPGA fabric accelerates Bayer demosaic, lens-correction, and HDR merging at line rate. The HPS's CAN interface connects directly to vehicle networks, and the FPGA fabric implements LVDS serializer-deserializer channels for up to 4 megapixel sensor aggregation. The A7 speed grade variant (5CSEBA4U23A7N) qualifies for AEC-Q100 automotive profiles. Production programs typically pair this SoC with a dedicated automotive Ethernet PHY.
Recomendado
Video Surveillance with Edge Analytics
Network video recorders and IP cameras benefit from the 5CSEBA4U23C8N's ability to offload H.264/H.265 encode/decode to FPGA fabric blocks while the HPS runs motion detection, license-plate recognition, and ONVIF network services on dual Cortex-A9 cores. Integrated Gigabit Ethernet MAC and USB 2.0 OTG eliminate external PHY chips for cost-sensitive designs. The DDR3 controller streams multi-stream 1080p60 frame buffers with hard-ECC protection, reducing field failures. A Linux BSP plus the SoC EDS cross-compiler chain accelerates time-to-market for embedded Linux firmware teams.
Recomendado
Embedded Linux Edge Gateways
The 5CSEBA4U23C8N serves as a Linux-based IIoT gateway controller where the dual ARM Cortex-A9 cores run a Yocto-built Linux distribution with full POSIX networking (MQTT, OPC-UA, Modbus-TCP), while the FPGA fabric implements industrial protocol bridges (RS-485, Profibus, CAN-FD) at line rate. The HPS's Gigabit Ethernet, USB 2.0, and SDXC controllers provide connectivity without external glue logic. Industrial-temperature variants in the U23 package handle outdoor cabinet deployments from -40C to +100C. BSP availability via the SoC EDS toolchain reduces Linux bring-up from months to weeks.
Recomendado
Software-Defined Radio Baseband Processing
The 5CSEBA4U23C8N's variable-precision DSP blocks and 18x18 multipliers deliver GSM/LTE baseband I/Q channelization in FPGA fabric, while the dual ARM Cortex-A9 cores handle MAC-layer scheduling, encryption, and network-stack processing. The HPS's DDR3 controller provides the bandwidth needed for 20 MHz LTE sample buffers without external memory. 188 user I/Os aggregate multiple ADC/DAC channels for MIMO radio front-ends. Compared to fixed-function DSP + MCU stacks, the SoC FPGA enables protocol upgrades via firmware without hardware respin. Quartus DSP Builder accelerates fixed-point design entry.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para 5CSEBA4U23C8N — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | 5CSEBA4U23C7SN | 5CSEBA4U23C7N | 5CSEBA4U23C6N | 5CSEBA4U19C8N | 5CSEBA2U23C8N | 5CSEBA4U23A7N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-pin UBGA (23x23 mm) | 672-pin UBGA (23x23 mm) - same | 672-pin UBGA (23x23 mm) - same | 672-pin UBGA (23x23 mm) - same | 484-pin UBGA (19x19 mm) - smaller | 672-pin UBGA (23x23 mm) - same | 672-pin UBGA (23x23 mm) - same |
| Logic Elements | 40,000 | 40,000 | 40,000 | 40,000 | 40,000 | 25,000 | 40,000 |
| Speed Grade | C8 | C7S | C7 | C6 | C8 | C8 | A7 (automotive) |
| HPS Processor | Dual ARM Cortex-A9 MPCore @ 600 MHz | Dual ARM Cortex-A9 MPCore @ 600 MHz | Dual ARM Cortex-A9 MPCore @ 600 MHz | Dual ARM Cortex-A9 MPCore @ 600 MHz | Dual ARM Cortex-A9 MPCore @ 600 MHz | Dual ARM Cortex-A9 MPCore @ 600 MHz | Dual ARM Cortex-A9 MPCore @ 600 MHz |
| Process Technology | TSMC 28 nm low-power | TSMC 28 nm low-power | TSMC 28 nm low-power | TSMC 28 nm low-power | TSMC 28 nm low-power | TSMC 28 nm low-power | TSMC 28 nm low-power |
| Approx. Unit Price (qty 1) | USD 185.00 | USD 215.00 | USD 205.00 | USD 235.00 | USD 165.00 | USD 145.00 | USD 240.00 |
| Temperature Grade | Commercial | Commercial | Commercial | Commercial | Commercial | Commercial | Automotive (AEC-Q100) |
Diferenciadores clave
- Industry-standard dual ARM Cortex-A9 HPS integrated with 40K-LE FPGA (frente a 5CSEBA2U23C8N)
- Production-grade speed grade with proven long-term availability (frente a 5CSEBA4U23A7N)
- Largest 672-pin UBGA package maximizes I/O and transceiver availability (frente a 5CSEBA4U19C8N)
Notas de diseño
The Cyclone V SE 5CSEBA4 requires a multi-rail supply: 1.1 V core, 2.5 V or 1.8 V HPS I/O, 3.3 V analog, and per-bank FPGA I/O voltages. Estimated: at 600 MHz dual A9 plus 40K LE utilization near 70%, total power dissipation is roughly 4-5 W with DDR3 active. Use a 4-layer PCB with a dedicated ground plane and place 10 uF + 0.1 uF ceramic decouplers within 3 mm of each power pin per the Cyclone V device handbook pin-connection guidelines.
For the 672-UBGA U23 package, follow JEDEC J-STD-020 MSL3 assembly profile and use ENIG or OSP surface finish. BGA ball pitch is 0.8 mm; escape routing requires microvia HDI stack-up (1+N+1 minimum). Recommend 0.1 mm laser-drilled microvias for inner rows to keep via-in-pad antipad clean. Decoupling capacitors should sit on the opposite side of the BGA shadow with short power-plane stitching to suppress resonance.
Estimated: a common pitfall is failing to configure the HPS boot source strapping pins (BSEL) before POR - the device may attempt to boot from NAND when an SD card is intended. Always tie BOOT_SEL, HPS_PINMUX, and CLK_SEL to the correct pull values per the reference manual. When using the FPGA-HPS AXI bridges, configure data-width (32/64/128) consistently in Qsys/Platform Designer; mismatched widths cause silent data corruption, not asserts.
Estimated: at 4-5 W dissipation in the 672-UBGA, the 5CSEBA4U23C8N requires 4-6 thermal vias under the central die-flag array to conduct heat into the inner ground plane. Without thermal vias, junction temperature may rise 30-40 C above ambient at full HPS+FPGA load. For enclosed industrial cabinets, attach a 15x15 mm aluminum heatsink with thermal pad; forced-air cooling is rarely needed unless ambient exceeds 60 C.
DDR3 traces from HPS to memory must be length-matched within 25 mil across byte lanes and routed on inner stripline layers with 100 ohm differential impedance. Fly-by topology is required for command/address - T-topology causes reflections at DDR3-1600 speeds. Quartus pin-planner includes DDR3 pin-pair rules; verify against the Cyclone V External Memory Interface Handbook before committing the PCB to fab. SSO/SSN analysis should be run on Quartus for any bank driving more than 8 LVDS pairs.
Información de cumplimiento
RoHS compliance per AmpHeo listing; 672-UBGA package is lead-free finish. Not AEC-Q100 qualified - choose 5CSEBA4U23A7N automotive variant for AEC-Q100. REACH and conflict-mineral declarations available via Intel product compliance portal on request.
