5CSEBA4U23C8N - Cyclone V SE SoC FPGA, 40K LE, Dual ARM Cortex-A9 | Intel
MPN: 5CSEBA4U23C8N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $175.5 | $1,755.00 |
| 100 | $162 | $16,200.00 |
| 500 | $148.75 | $74,375.00 |
| 1,000 | $138.2 | $138,200.00 |
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View Datasheet →5CSEBA4U23C8N Maximum Ratings & Electrical Characteristics
| Family | Cyclone V SE SoC FPGA |
| Logic Elements (LE) | 40,000 |
| Processor Core | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum HPS Frequency | 600 MHz |
| Multipliers | 18x18 dedicated multipliers |
| Maximum User I/O | 188 |
| Package | 672-pin UBGA (UBGA-672, 23x23 mm) |
| Process Technology | TSMC 28 nm low-power |
| HPS Peripherals | Gigabit Ethernet, USB 2.0 OTG, CAN, UART, SPI, I2C, NAND, SDXC |
| Memory Controller (HPS) | DDR3/DDR3L/LPDDR2 with hard PHY |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
5CSEBA4U23C8N 672-pin ubga (ubga-672, 23x23 mm) Pin Configuration Guide
Complete pinout information for 5CSEBA4U23C8N (672-pin ubga (ubga-672, 23x23 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSEBA4U23C8N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSEBA4U23C8N is suitable for 6 applications: Industrial Machine Vision Systems, Motor Control & Industrial Automation, Automotive ADAS Front Camera Platform, Video Surveillance with Edge Analytics, Embedded Linux Edge Gateways, Software-Defined Radio Baseband Processing.
Industrial Machine Vision Systems
The 5CSEBA4U23C8N is ideal for industrial machine vision platforms because its 40K logic elements and 188 user I/Os absorb Camera Link, CoaXPress, or parallel-LVDS sensor front-end pipelines while the dual 600 MHz ARM Cortex-A9 MPCore HPS runs vision analytics and TCP/IP connectivity. Integrated DDR3 controller with hard PHY streams 4K frame buffers at full bandwidth without FPGA fabric overhead. Compared to a discrete CPU + FPGA stack, the SoC FPGA reduces PCB area by 40-50% and BOM cost by 25% in conveyor-inspection and pick-and-place systems. JTAG/AS programming via Quartus accelerates factory calibration.
Recommended
Motor Control & Industrial Automation
In motor control drives and PLC platforms, the 5CSEBA4U23C8N's hard ARM Cortex-A9 cores handle EtherCAT master stacks, motion trajectory planning, and HMI rendering, while the FPGA fabric implements deterministic PWM generators, encoder interfaces, and safety logic with sub-microsecond latency. The 28 nm low-power process keeps the SoC below 5 W typical, enabling fanless DIN-rail enclosures. 188 user I/Os aggregate multiple encoder channels, sigma-delta ADCs, and gate-driver interfaces on a single chip. Industrial temperature variants (I7 speed grade) are available in the same U23 footprint.
Recommended
Automotive ADAS Front Camera Platform
The 5CSEBA4U23C8N supports automotive ADAS front-camera preprocessing by running lane-detection and object-classification CNN inference on the dual 600 MHz ARM Cortex-A9 with NEON vector extensions, while the 40K-LE FPGA fabric accelerates Bayer demosaic, lens-correction, and HDR merging at line rate. The HPS's CAN interface connects directly to vehicle networks, and the FPGA fabric implements LVDS serializer-deserializer channels for up to 4 megapixel sensor aggregation. The A7 speed grade variant (5CSEBA4U23A7N) qualifies for AEC-Q100 automotive profiles. Production programs typically pair this SoC with a dedicated automotive Ethernet PHY.
Recommended
Video Surveillance with Edge Analytics
Network video recorders and IP cameras benefit from the 5CSEBA4U23C8N's ability to offload H.264/H.265 encode/decode to FPGA fabric blocks while the HPS runs motion detection, license-plate recognition, and ONVIF network services on dual Cortex-A9 cores. Integrated Gigabit Ethernet MAC and USB 2.0 OTG eliminate external PHY chips for cost-sensitive designs. The DDR3 controller streams multi-stream 1080p60 frame buffers with hard-ECC protection, reducing field failures. A Linux BSP plus the SoC EDS cross-compiler chain accelerates time-to-market for embedded Linux firmware teams.
Recommended
Embedded Linux Edge Gateways
The 5CSEBA4U23C8N serves as a Linux-based IIoT gateway controller where the dual ARM Cortex-A9 cores run a Yocto-built Linux distribution with full POSIX networking (MQTT, OPC-UA, Modbus-TCP), while the FPGA fabric implements industrial protocol bridges (RS-485, Profibus, CAN-FD) at line rate. The HPS's Gigabit Ethernet, USB 2.0, and SDXC controllers provide connectivity without external glue logic. Industrial-temperature variants in the U23 package handle outdoor cabinet deployments from -40C to +100C. BSP availability via the SoC EDS toolchain reduces Linux bring-up from months to weeks.
Recommended
Software-Defined Radio Baseband Processing
The 5CSEBA4U23C8N's variable-precision DSP blocks and 18x18 multipliers deliver GSM/LTE baseband I/Q channelization in FPGA fabric, while the dual ARM Cortex-A9 cores handle MAC-layer scheduling, encryption, and network-stack processing. The HPS's DDR3 controller provides the bandwidth needed for 20 MHz LTE sample buffers without external memory. 188 user I/Os aggregate multiple ADC/DAC channels for MIMO radio front-ends. Compared to fixed-function DSP + MCU stacks, the SoC FPGA enables protocol upgrades via firmware without hardware respin. Quartus DSP Builder accelerates fixed-point design entry.
Recommended
Recommended Products Summary
Engineering reference data for 5CSEBA4U23C8N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSEBA4U23C7SN | 5CSEBA4U23C7N | 5CSEBA4U23C6N | 5CSEBA4U19C8N | 5CSEBA2U23C8N | 5CSEBA4U23A7N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-pin UBGA (23x23 mm) | 672-pin UBGA (23x23 mm) - same | 672-pin UBGA (23x23 mm) - same | 672-pin UBGA (23x23 mm) - same | 484-pin UBGA (19x19 mm) - smaller | 672-pin UBGA (23x23 mm) - same | 672-pin UBGA (23x23 mm) - same |
| Logic Elements | 40,000 | 40,000 | 40,000 | 40,000 | 40,000 | 25,000 | 40,000 |
| Speed Grade | C8 | C7S | C7 | C6 | C8 | C8 | A7 (automotive) |
| HPS Processor | Dual ARM Cortex-A9 MPCore @ 600 MHz | Dual ARM Cortex-A9 MPCore @ 600 MHz | Dual ARM Cortex-A9 MPCore @ 600 MHz | Dual ARM Cortex-A9 MPCore @ 600 MHz | Dual ARM Cortex-A9 MPCore @ 600 MHz | Dual ARM Cortex-A9 MPCore @ 600 MHz | Dual ARM Cortex-A9 MPCore @ 600 MHz |
| Max User I/O | 188 | 188 | 188 | 188 | [DATA_NEEDED: U19 I/O count] | [DATA_NEEDED: A2 U23 I/O count] | 188 |
| Process Technology | TSMC 28 nm low-power | TSMC 28 nm low-power | TSMC 28 nm low-power | TSMC 28 nm low-power | TSMC 28 nm low-power | TSMC 28 nm low-power | TSMC 28 nm low-power |
| Approx. Unit Price (qty 1) | USD 185.00 | USD 215.00 | USD 205.00 | USD 235.00 | USD 165.00 | USD 145.00 | USD 240.00 |
| Temperature Grade | Commercial | Commercial | Commercial | Commercial | Commercial | Commercial | Automotive (AEC-Q100) |
Key Differentiators
- Industry-standard dual ARM Cortex-A9 HPS integrated with 40K-LE FPGA (vs 5CSEBA2U23C8N)
- Production-grade speed grade with proven long-term availability (vs 5CSEBA4U23A7N)
- Largest 672-pin UBGA package maximizes I/O and transceiver availability (vs 5CSEBA4U19C8N)
Design Notes
The Cyclone V SE 5CSEBA4 requires a multi-rail supply: 1.1 V core, 2.5 V or 1.8 V HPS I/O, 3.3 V analog, and per-bank FPGA I/O voltages. Estimated: at 600 MHz dual A9 plus 40K LE utilization near 70%, total power dissipation is roughly 4-5 W with DDR3 active. Use a 4-layer PCB with a dedicated ground plane and place 10 uF + 0.1 uF ceramic decouplers within 3 mm of each power pin per the Cyclone V device handbook pin-connection guidelines.
For the 672-UBGA U23 package, follow JEDEC J-STD-020 MSL3 assembly profile and use ENIG or OSP surface finish. BGA ball pitch is 0.8 mm; escape routing requires microvia HDI stack-up (1+N+1 minimum). Recommend 0.1 mm laser-drilled microvias for inner rows to keep via-in-pad antipad clean. Decoupling capacitors should sit on the opposite side of the BGA shadow with short power-plane stitching to suppress resonance.
Estimated: a common pitfall is failing to configure the HPS boot source strapping pins (BSEL) before POR - the device may attempt to boot from NAND when an SD card is intended. Always tie BOOT_SEL, HPS_PINMUX, and CLK_SEL to the correct pull values per the reference manual. When using the FPGA-HPS AXI bridges, configure data-width (32/64/128) consistently in Qsys/Platform Designer; mismatched widths cause silent data corruption, not asserts.
Estimated: at 4-5 W dissipation in the 672-UBGA, the 5CSEBA4U23C8N requires 4-6 thermal vias under the central die-flag array to conduct heat into the inner ground plane. Without thermal vias, junction temperature may rise 30-40 C above ambient at full HPS+FPGA load. For enclosed industrial cabinets, attach a 15x15 mm aluminum heatsink with thermal pad; forced-air cooling is rarely needed unless ambient exceeds 60 C.
DDR3 traces from HPS to memory must be length-matched within 25 mil across byte lanes and routed on inner stripline layers with 100 ohm differential impedance. Fly-by topology is required for command/address - T-topology causes reflections at DDR3-1600 speeds. Quartus pin-planner includes DDR3 pin-pair rules; verify against the Cyclone V External Memory Interface Handbook before committing the PCB to fab. SSO/SSN analysis should be run on Quartus for any bank driving more than 8 LVDS pairs.
Compliance Information
RoHS compliance per AmpHeo listing; 672-UBGA package is lead-free finish. Not AEC-Q100 qualified - choose 5CSEBA4U23A7N automotive variant for AEC-Q100. REACH and conflict-mineral declarations available via Intel product compliance portal on request.
