5CSEBA4U23C8N - Cyclone V SE SoC FPGA, 40K LE, Dual ARM Cortex-A9 | Intel
Référence : 5CSEBA4U23C8N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $185 | $185,00 |
| 10 | $175.5 | $1 755,00 |
| 100 | $162 | $16 200,00 |
| 500 | $148.75 | $74 375,00 |
| 1 000 | $138.2 | $138 200,00 |
5CSEBA4U23C8N Présentation
What is a SoC FPGA? A SoC FPGA integrates a microprocessor subsystem (typically ARM Cortex-A) with a programmable FPGA fabric on the same silicon die. This architecture sits within the broader product hierarchy of programmable logic devices: FPGA > SoC FPGA > FPGA + hard processor > general-purpose processor. By combining a deterministic parallel hardware fabric with sequential software programmability, SoC FPGAs enable high-throughput sensor pipelines, custom accelerators, and Linux-capable control on a single chip, reducing BOM cost and board area relative to discrete CPU + FPGA designs.
Key features of the 5CSEBA4U23C8N include 40K logic elements, approximately 2,460 Kbits of embedded memory, integrated DDR3/DDR3L/LPDDR2 controller with hard PHY in the HPS, support for high-speed serial transceivers, and dual ARM Cortex-A9 MPCore CPUs with NEON media engine and single/double-precision FPU. The device offers 188 general-purpose I/Os and high-speed LVDS interfaces, making it suitable for parallel sensor aggregation.
The Cyclone V SE architecture pairs the HPS (with coherent L1/L2 caches, ECC, and Cortex-A9 NEON/FPU) with a low-power FPGA fabric that supports variable-precision DSP blocks, 18x18 multipliers, and hard memory controllers. Multiport front-end peripherals (Gigabit Ethernet, USB 2.0 OTG, CAN, UART, SPI, I2C, NAND/SDXC) connect directly to the HPS through high-bandwidth system interconnect.
Typical applications include industrial machine vision systems, motor control and industrial automation, automotive driver assistance (ADAS) front camera platforms, video surveillance with analytics, and Linux-based embedded edge gateways. The 600 MHz ARM cores support real-time Linux/RTOS hybrid systems while the FPGA fabric accelerates pixel pipelines or custom interfaces.
When designing with this device, pay careful attention to HPS-FPGA bridge bandwidth (AXI-128/64/32) and decoupling on the multi-rail power supply (1.1 V core, 1.8 V/2.5 V I/O, 3.3 V analog). For DDR3 operation, follow Intel's pin-pair length-matching rules in the device handbook. Lead-free assembly requires standard JEDEC J-STD-020 MSL3 profile.
This page synthesizes distributor inventory, drop-in same-family variants, and design notes not found in the manufacturer datasheet, providing an independent reference for procurement and engineering teams.
Alternatives de remplacement direct pour 5CSEBA4U23C8N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 5CSEBA4U23C8N (même facteur de forme et même empreinte) — différant par Package, Logic Elements, Operating Temperature, Transceivers, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
5CSEBA4U23C7SN
✅ Remplacement direct✓ En stock
$18.2 / unité
Voir la fiche technique →5CSEBA4U23C7N
✅ Remplacement direct✓ En stock
$124.5 / unité
Voir la fiche technique →5CSEBA4U23C6N
✅ Remplacement direct✓ En stock
$86.2 / unité
Voir la fiche technique →5CSEBA4U19C8N
✅ Remplacement direct✓ En stock
$54.75 / unité
Voir la fiche technique →5CSEBA2U23C8N
✅ Remplacement direct✓ En stock
$55.5 / unité
Voir la fiche technique →5CSEBA4U23A7N
✅ Remplacement direct✓ En stock
$185 / unité
Voir la fiche technique →5CSEBA4U23C8N Valeurs maximales et caractéristiques électriques
| Family | Cyclone V SE SoC FPGA |
| Logic Elements (LE) | 40,000 |
| Processor Core | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum HPS Frequency | 600 MHz |
| Multipliers | 18x18 dedicated multipliers |
| Maximum User I/O | 188 |
| Boîtier | 672-pin UBGA (UBGA-672, 23x23 mm) |
| Process Technology | TSMC 28 nm low-power |
| HPS Peripherals | Gigabit Ethernet, USB 2.0 OTG, CAN, UART, SPI, I2C, NAND, SDXC |
| Memory Controller (HPS) | DDR3/DDR3L/LPDDR2 with hard PHY |
| Type de montage | Surface Mount (BGA) |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
Guide de configuration des broches du 5CSEBA4U23C8N 672-pin ubga (ubga-672, 23x23 mm)
Configuration des broches du 5CSEBA4U23C8N (boîtier 672-pin ubga (ubga-672, 23x23 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour 5CSEBA4U23C8N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
5CSEBA4U23C8N convient pour 6 applications: Industrial Machine Vision Systems, Motor Control & Industrial Automation, Automotive ADAS Front Camera Platform, Video Surveillance with Edge Analytics, Embedded Linux Edge Gateways, Software-Defined Radio Baseband Processing.
Industrial Machine Vision Systems
The 5CSEBA4U23C8N is ideal for industrial machine vision platforms because its 40K logic elements and 188 user I/Os absorb Camera Link, CoaXPress, or parallel-LVDS sensor front-end pipelines while the dual 600 MHz ARM Cortex-A9 MPCore HPS runs vision analytics and TCP/IP connectivity. Integrated DDR3 controller with hard PHY streams 4K frame buffers at full bandwidth without FPGA fabric overhead. Compared to a discrete CPU + FPGA stack, the SoC FPGA reduces PCB area by 40-50% and BOM cost by 25% in conveyor-inspection and pick-and-place systems. JTAG/AS programming via Quartus accelerates factory calibration.
Recommandé
Motor Control & Industrial Automation
In motor control drives and PLC platforms, the 5CSEBA4U23C8N's hard ARM Cortex-A9 cores handle EtherCAT master stacks, motion trajectory planning, and HMI rendering, while the FPGA fabric implements deterministic PWM generators, encoder interfaces, and safety logic with sub-microsecond latency. The 28 nm low-power process keeps the SoC below 5 W typical, enabling fanless DIN-rail enclosures. 188 user I/Os aggregate multiple encoder channels, sigma-delta ADCs, and gate-driver interfaces on a single chip. Industrial temperature variants (I7 speed grade) are available in the same U23 footprint.
Recommandé
Automotive ADAS Front Camera Platform
The 5CSEBA4U23C8N supports automotive ADAS front-camera preprocessing by running lane-detection and object-classification CNN inference on the dual 600 MHz ARM Cortex-A9 with NEON vector extensions, while the 40K-LE FPGA fabric accelerates Bayer demosaic, lens-correction, and HDR merging at line rate. The HPS's CAN interface connects directly to vehicle networks, and the FPGA fabric implements LVDS serializer-deserializer channels for up to 4 megapixel sensor aggregation. The A7 speed grade variant (5CSEBA4U23A7N) qualifies for AEC-Q100 automotive profiles. Production programs typically pair this SoC with a dedicated automotive Ethernet PHY.
Recommandé
Video Surveillance with Edge Analytics
Network video recorders and IP cameras benefit from the 5CSEBA4U23C8N's ability to offload H.264/H.265 encode/decode to FPGA fabric blocks while the HPS runs motion detection, license-plate recognition, and ONVIF network services on dual Cortex-A9 cores. Integrated Gigabit Ethernet MAC and USB 2.0 OTG eliminate external PHY chips for cost-sensitive designs. The DDR3 controller streams multi-stream 1080p60 frame buffers with hard-ECC protection, reducing field failures. A Linux BSP plus the SoC EDS cross-compiler chain accelerates time-to-market for embedded Linux firmware teams.
Recommandé
Embedded Linux Edge Gateways
The 5CSEBA4U23C8N serves as a Linux-based IIoT gateway controller where the dual ARM Cortex-A9 cores run a Yocto-built Linux distribution with full POSIX networking (MQTT, OPC-UA, Modbus-TCP), while the FPGA fabric implements industrial protocol bridges (RS-485, Profibus, CAN-FD) at line rate. The HPS's Gigabit Ethernet, USB 2.0, and SDXC controllers provide connectivity without external glue logic. Industrial-temperature variants in the U23 package handle outdoor cabinet deployments from -40C to +100C. BSP availability via the SoC EDS toolchain reduces Linux bring-up from months to weeks.
Recommandé
Software-Defined Radio Baseband Processing
The 5CSEBA4U23C8N's variable-precision DSP blocks and 18x18 multipliers deliver GSM/LTE baseband I/Q channelization in FPGA fabric, while the dual ARM Cortex-A9 cores handle MAC-layer scheduling, encryption, and network-stack processing. The HPS's DDR3 controller provides the bandwidth needed for 20 MHz LTE sample buffers without external memory. 188 user I/Os aggregate multiple ADC/DAC channels for MIMO radio front-ends. Compared to fixed-function DSP + MCU stacks, the SoC FPGA enables protocol upgrades via firmware without hardware respin. Quartus DSP Builder accelerates fixed-point design entry.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 5CSEBA4U23C8N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 5CSEBA4U23C7SN | 5CSEBA4U23C7N | 5CSEBA4U23C6N | 5CSEBA4U19C8N | 5CSEBA2U23C8N | 5CSEBA4U23A7N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-pin UBGA (23x23 mm) | 672-pin UBGA (23x23 mm) - same | 672-pin UBGA (23x23 mm) - same | 672-pin UBGA (23x23 mm) - same | 484-pin UBGA (19x19 mm) - smaller | 672-pin UBGA (23x23 mm) - same | 672-pin UBGA (23x23 mm) - same |
| Logic Elements | 40,000 | 40,000 | 40,000 | 40,000 | 40,000 | 25,000 | 40,000 |
| Speed Grade | C8 | C7S | C7 | C6 | C8 | C8 | A7 (automotive) |
| HPS Processor | Dual ARM Cortex-A9 MPCore @ 600 MHz | Dual ARM Cortex-A9 MPCore @ 600 MHz | Dual ARM Cortex-A9 MPCore @ 600 MHz | Dual ARM Cortex-A9 MPCore @ 600 MHz | Dual ARM Cortex-A9 MPCore @ 600 MHz | Dual ARM Cortex-A9 MPCore @ 600 MHz | Dual ARM Cortex-A9 MPCore @ 600 MHz |
| Process Technology | TSMC 28 nm low-power | TSMC 28 nm low-power | TSMC 28 nm low-power | TSMC 28 nm low-power | TSMC 28 nm low-power | TSMC 28 nm low-power | TSMC 28 nm low-power |
| Approx. Unit Price (qty 1) | USD 185.00 | USD 215.00 | USD 205.00 | USD 235.00 | USD 165.00 | USD 145.00 | USD 240.00 |
| Temperature Grade | Commercial | Commercial | Commercial | Commercial | Commercial | Commercial | Automotive (AEC-Q100) |
Principaux différenciateurs
- Industry-standard dual ARM Cortex-A9 HPS integrated with 40K-LE FPGA (vs 5CSEBA2U23C8N)
- Production-grade speed grade with proven long-term availability (vs 5CSEBA4U23A7N)
- Largest 672-pin UBGA package maximizes I/O and transceiver availability (vs 5CSEBA4U19C8N)
Notes de conception
The Cyclone V SE 5CSEBA4 requires a multi-rail supply: 1.1 V core, 2.5 V or 1.8 V HPS I/O, 3.3 V analog, and per-bank FPGA I/O voltages. Estimated: at 600 MHz dual A9 plus 40K LE utilization near 70%, total power dissipation is roughly 4-5 W with DDR3 active. Use a 4-layer PCB with a dedicated ground plane and place 10 uF + 0.1 uF ceramic decouplers within 3 mm of each power pin per the Cyclone V device handbook pin-connection guidelines.
For the 672-UBGA U23 package, follow JEDEC J-STD-020 MSL3 assembly profile and use ENIG or OSP surface finish. BGA ball pitch is 0.8 mm; escape routing requires microvia HDI stack-up (1+N+1 minimum). Recommend 0.1 mm laser-drilled microvias for inner rows to keep via-in-pad antipad clean. Decoupling capacitors should sit on the opposite side of the BGA shadow with short power-plane stitching to suppress resonance.
Estimated: a common pitfall is failing to configure the HPS boot source strapping pins (BSEL) before POR - the device may attempt to boot from NAND when an SD card is intended. Always tie BOOT_SEL, HPS_PINMUX, and CLK_SEL to the correct pull values per the reference manual. When using the FPGA-HPS AXI bridges, configure data-width (32/64/128) consistently in Qsys/Platform Designer; mismatched widths cause silent data corruption, not asserts.
Estimated: at 4-5 W dissipation in the 672-UBGA, the 5CSEBA4U23C8N requires 4-6 thermal vias under the central die-flag array to conduct heat into the inner ground plane. Without thermal vias, junction temperature may rise 30-40 C above ambient at full HPS+FPGA load. For enclosed industrial cabinets, attach a 15x15 mm aluminum heatsink with thermal pad; forced-air cooling is rarely needed unless ambient exceeds 60 C.
DDR3 traces from HPS to memory must be length-matched within 25 mil across byte lanes and routed on inner stripline layers with 100 ohm differential impedance. Fly-by topology is required for command/address - T-topology causes reflections at DDR3-1600 speeds. Quartus pin-planner includes DDR3 pin-pair rules; verify against the Cyclone V External Memory Interface Handbook before committing the PCB to fab. SSO/SSN analysis should be run on Quartus for any bank driving more than 8 LVDS pairs.
Informations de conformité
RoHS compliance per AmpHeo listing; 672-UBGA package is lead-free finish. Not AEC-Q100 qualified - choose 5CSEBA4U23A7N automotive variant for AEC-Q100. REACH and conflict-mineral declarations available via Intel product compliance portal on request.
