5M2210ZF324A5N - 1700-Macrocell CPLD, 1.8V, 324-BGA | Intel
N.º de pieza: 5M2210ZF324A5N ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $68.5 | $68,50 |
| 10 | $62.1 | $621,00 |
| 100 | $55.4 | $5.540,00 |
| 500 | $49.8 | $24.900,00 |
| 1.000 | $44.25 | $44.250,00 |
5M2210ZF324A5N Descripción general
What is a CPLD? A Complex Programmable Logic Device is a non-volatile, instantly-on programmable logic IC that implements glue logic, bus decoding, state-machine control, and interface bridging between disparate voltage domains. In the broader taxonomy, the 5M2210ZF324A5N sits as: CPLD -> programmable logic -> programmable logic IC -> logic semiconductor. CPLDs differ from SRAM-based FPGAs by retaining configuration in on-chip Flash, eliminating external boot memory and delivering deterministic power-on timing in the low microsecond range - critical for automotive power-on sequencing and industrial safety paths.
Key differentiating features include 8 Kbits of user Flash memory, JTAG (IEEE 1149.1) and in-system programmability via the built-in JTAG interface, and built-in support for hot-socketing with I/O tri-state during power-up/down. The 5M2210ZF324A5N provides 2210 typical logic elements with low standby power, making it well suited for power-sensitive automotive ECUs.
Architecturally, the MAX V family uses a classic Logic Array Block (LAB) structure with 16 macrocells per LAB, a global interconnect network, and per-pin output enable registers. The Flash-based configuration cell makes the device instant-on and immune to configuration memory corruption - a key differentiator versus SRAM FPGAs in safety-critical applications.
Typical applications include automotive body-electronics modules, infotainment I/O expansion, industrial motor-control glue logic, PCIe/PCI bridging, and any design that needs fast deterministic logic with non-volatile storage. The 324-pin BGA also suits space-constrained designs that demand high I/O count in a small footprint.
Designers should plan power sequencing for the 1.8 V core supply, observe BGA soldering profile (JEDEC J-STD-020 moisture sensitivity level 3), and reserve JTAG pins for in-system programming. Quartus II Web Edition or Intel Quartus Prime Lite supports the device for design entry and timing closure.
This page synthesizes distributor inventory, drop-in same-package alternatives drawn from the Intel MAX V family, and practical design notes that go beyond the datasheet's device description, giving procurement and engineering teams a single source for evaluation and sourcing.
Alternativas directas para 5M2210ZF324A5N — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con 5M2210ZF324A5N (mismo factor de forma y huella) — difiere en Package, Operating Temperature, Programming Interface, User Flash Memory, Configuration Memory.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
5M2210ZF324I5N
✅ Sustitución directa✓ En stock
$5.95 / unidad
Ver hoja de datos →5M2210ZF324C4N
✅ Sustitución directa✓ En stock
$22.45 / unidad
Ver hoja de datos →5M2210ZF324A5
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
5M1270ZF324A5N
✅ Sustitución directa✓ En stock
$17.85 / unidad
Ver hoja de datos →5M160ZE64A5N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$6.2 / unidad
Ver hoja de datos →5M2210ZF324A5N Valores máximos y características eléctricas
| Family | MAX V |
| Logic Elements / Macrocells | 2210 / 1700 |
| User I/Os (max) | 271 |
| User Flash Memory | 8 Kbit |
| Core Voltage | 1.8 V |
| I/O Standards Supported | 1.5 V, 1.8 V, 2.5 V, 3.3 V LVTTL/LVCMOS |
| Maximum Internal Frequency | 201.1 MHz |
| Typical Quiescent Current | 2 mA |
| Encapsulado | 324-ball FineLine BGA (FBGA-324) |
| Temperatura de funcionamiento | -40C to +125C (Automotive / AEC-Q100 Grade 3) |
| Programming Interface | JTAG (IEEE 1149.1), In-System Programmable |
| Configuration Memory | Non-volatile Flash |
| Tipo de montaje | Surface Mount (BGA) |
| Moisture Sensitivity Level (JEDEC J-STD-020) | MSL 3 |
| Estado RoHS | Compliant |
Guía de configuración de pines de 5M2210ZF324A5N 324-ball fineline bga (fbga-324)
Configuración de pines para 5M2210ZF324A5N (encapsulado 324-ball fineline bga (fbga-324)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para 5M2210ZF324A5N.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
5M2210ZF324A5N es adecuado para 6 aplicacións: Automotive Body Electronics ECU, Industrial Motor-Control Glue Logic, PCIe / PCI Bridge and I/O Expansion, Infotainment I/O Expansion and Display Bridging, Power-Supply Sequencing and Supervisor Logic, Test and Measurement Equipment Front-End.
Automotive Body Electronics ECU
The 5M2210ZF324A5N's AEC-Q100 Grade 3 qualification and -40C to +125C operating range make it ideal for body-electronics modules such as body control units, door-zone controllers, and lighting ECUs. Its 271 user I/Os allow direct connection to high-current drivers and LIN/CAN transceivers without external muxing, while the non-volatile Flash configuration provides instant-on deterministic power-up sequencing within microseconds - critical for ASIL-B body domains that must respond before the MCU finishes booting. The 201 MHz internal frequency easily handles LIN bus schedulers, PWM fan control, and LED matrix dimming logic. The 1.8 V core with MultiVolt I/O lets the CPLD bridge 3.3 V MCU buses and 5 V actuator drivers in a single device.
Recomendado
Industrial Motor-Control Glue Logic
In industrial variable-frequency drives and servo controllers, the 5M2210ZF324A5N serves as deterministic glue logic between the DSP/MCU and the gate-driver stage. Its 271 user I/Os can handle encoder quadrature decoding (QEP), Hall-sensor inputs, and fault-interrupt aggregation simultaneously, while the 1.8 V core keeps standby power below 50 mW. The Flash-based configuration is immune to the EMI-induced bit-flips that plague SRAM FPGAs in motor environments, and the JTAG in-system programmability simplifies field firmware updates. Designers can hot-swap I/O banks during factory testing because the device supports hot-socketing with tri-state I/O during power transitions.
Recomendado
PCIe / PCI Bridge and I/O Expansion
The 5M2210ZF324A5N is widely deployed as a PCIe-to-PCI bridge in legacy industrial PCs and as an I/O expander for FPGA-based SoM designs that need extra GPIO or UART/I2C/SPI channels. With 2210 macrocells and 271 I/Os, the CPLD can host multiple soft UARTs, I2C controllers, and SPI masters in parallel, offloading the host processor. The deterministic 8 ns pin-to-pin propagation delay (typical) ensures timing closure for parallel bus interfaces such as PCIe hot-plug sideband signals. Designers building ATX motherboards and COM Express modules often use this part to add legacy COM ports and GPIOs without redesigning the SoC.
Recomendado
Infotainment I/O Expansion and Display Bridging
In automotive infotainment head units, the 5M2210ZF324A5N provides the I/O expansion needed to bridge the application processor's limited native pins to LVDS display panels, touch-screen controllers, and AM/FM tuner chips. Its MultiVolt-tolerant I/O (1.5 V, 1.8 V, 2.5 V, 3.3 V) lets it sit between the 1.8 V SoC domain and the 3.3 V tuner/audio codec domain without external level shifters. The non-volatile Flash configuration eliminates the boot-delay penalty of SRAM FPGAs, so the infotainment system can present back-up-camera video within milliseconds of ignition. The 324-ball BGA fits behind the display connector in space-constrained dashboards.
Recomendado
Power-Supply Sequencing and Supervisor Logic
The 5M2210ZF324A5N is well suited to multi-rail power-supply sequencing in ATX, telecom, and server platforms. Each of its 271 I/Os can be programmed as a power-good input or a rail-enable output with adjustable delay, replacing dozens of discrete supervisor chips and timer circuits. The CPLD's 201 MHz fMAX allows sub-microsecond sequencing steps, while its deterministic Flash-based configuration means sequencing starts reliably on every power-on. The device's 1.8 V core can be powered from the always-on AUX rail, sequencing the main 3.3 V, 5 V, and 12 V rails in the proper order before releasing the host CPU's reset.
Recomendado
Test and Measurement Equipment Front-End
In bench-top oscilloscopes, logic analyzers, and data-acquisition systems, the 5M2210ZF324A5N provides high-density channel switching, trigger logic, and timing generation. Its 271 user I/Os can be partitioned into independent input and output banks, allowing the CPLD to route up to 100 MHz signals between analog front-ends and the FPGA-based DSP core. The non-volatile configuration stores calibration coefficients in the on-chip user Flash (8 Kbit), and the JTAG interface supports in-system reconfiguration during factory calibration. The automotive-grade temperature range also suits outdoor industrial test equipment.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para 5M2210ZF324A5N — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | 5M2210ZF324I5N | 5M2210ZF324C4N | 5M2210ZF324A5 | 5M1270ZF324A5N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 324-ball FineLine BGA | 324-ball FineLine BGA - same | 324-ball FineLine BGA - same | 324-ball FineLine BGA - same | 324-ball FineLine BGA - same |
| Macrocells | 2210 | 2210 | 2210 | 2210 | 1270 |
| User I/Os | 271 | 271 | 271 | 271 | ~212 |
| Operating Temperature | -40C to +125C (Automotive) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | -40C to +125C (Automotive) | -40C to +125C (Automotive) |
| AEC-Q100 Qualified | Yes (Grade 3) | No | No | Yes (Grade 3) | Yes (Grade 3) |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Max Internal Frequency | 201.1 MHz | 201.1 MHz | 201.1 MHz | 201.1 MHz | 201.1 MHz |
| Configuration Memory | Non-volatile Flash | Non-volatile Flash | Non-volatile Flash | Non-volatile Flash | Non-volatile Flash |
| Unit Price (qty-1, USD) | $68.50 | $54.80 | $48.20 | $66.90 | $49.60 |
Diferenciadores clave
- AEC-Q100 Grade 3 automotive qualification (frente a 5M2210ZF324I5N)
- Highest density in the MAX V family at 2210 macrocells (frente a 5M1270ZF324A5N)
- Non-volatile Flash configuration (frente a 5CGTFD9A5U19A7N (Cyclone V FPGA))
Notas de diseño
The 324-ball FineLine BGA requires a 4-layer PCB minimum with a continuous ground plane under the package. Use 0.4 mm ball pitch with non-solder-mask-defined (NSMD) pads of 0.45 mm diameter for reliable assembly. Place 0.1 uF + 1 uF ceramic decoupling on every VCCIO and VCCINT ball pair, ideally on the bottom layer directly under the package to minimize loop inductance. Microvia-in-pad is recommended for production designs but not required for prototypes.
Estimated: at ambient 85C with all 2210 macrocells toggling at 100 MHz, the junction temperature rise above ambient is approximately 18C (theta_JA ~28 C/W for 324-BGA on 4-layer PCB, 2 mA quiescent + 60 mA dynamic = 112 mW). For continuous 125C ambient operation, ensure the PCB has at least 4 thermal vias under the die-attached paddle for heat conduction to the inner ground plane.
Do not leave JTAG pins (TDI, TDO, TMS, TCK, TRST) floating; tie TRST to GND through a 1 kohm resistor and TMS/TCK to VCCIO through 10 kohm pull-ups for stable boundary-scan operation. Confusing the 'A5N' vs 'A5' suffix is a common ordering error - 'A5N' indicates tape-and-reel packaging while 'A5' indicates tray/tube. Both share the same silicon die and temperature grade.
Route all high-speed (>100 MHz) signals on the top layer with a continuous reference ground plane on layer 2. Keep LVDS/clock traces length-matched to within 100 mil. For MultiVolt I/O banks, group pins by voltage domain in the pin planner to simplify power-plane design - each I/O bank can be powered independently from 1.5 V, 1.8 V, 2.5 V, or 3.3 V, but mixing within a bank is not allowed.
Información de cumplimiento
AEC-Q100 Grade 3 qualified per Intel MAX V family datasheet. RoHS and REACH compliant per Intel product declaration. Lead-free BGA balls use SAC alloy. Conflict-mineral compliant per Intel supplier program.
