5M160ZE64A5N - 128 Macro Cell MAX V CPLD, 118.3MHz, 64-EQFP | Altera
MPN: 5M160ZE64A5N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $9.8 | $9.80 |
| 10 | $8.95 | $89.50 |
| 100 | $7.8 | $780.00 |
| 500 | $6.95 | $3,475.00 |
| 1,000 | $6.2 | $6,200.00 |
Drop-in alternatives for 5M160ZE64A5N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
5M160ZE64C5N
β Drop-Inβ In Stock
$4.95 / Unit
View Datasheet β5M160ZE64I5N
β Drop-Inβ In Stock
$4.13 / Unit
View Datasheet β5M160ZE64A5
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
5M160ZE64C4N
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$4.3 / Unit
View Datasheet β5M160ZE64A5N Maximum Ratings & Electrical Characteristics
| Family | MAX V |
| Device | 5M160ZE64A5N |
| Macro Cells | 128 |
| Logic Elements | 160 |
| User I/O Pins | 54 |
| Maximum Operating Frequency | 118.3 MHz |
| Pin-to-Pin Propagation Delay | 7.5 ns |
| User Flash Memory | 8 Kbits |
| Core Voltage (VCCINT) | 1.8 V (1.71 V to 1.89 V) |
| I/O Voltage Support | 1.5 V, 1.8 V, 2.5 V, 3.3 V |
| Package | 64-pin EQFP (exposed-pad QFP) |
| Operating Temperature | -40C to +125C (automotive AEC-Q100) |
| Programming Interface | JTAG (IEEE 1149.1) / ISP |
| Configuration Method | Non-volatile flash, instant-on |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount |
5M160ZE64A5N Pin Configuration
| Pin 1 | I/O β User I/O pin (bank 1) |
| Pin 2 | I/O β User I/O pin (bank 1) |
| Pin 3 | I/O β User I/O pin (bank 1) |
| Pin 4 | I/O β User I/O pin (bank 1) |
| Pin 5 | I/O β User I/O pin (bank 1) |
| Pin 6 | I/O β User I/O pin (bank 1) |
| Pin 7 | VCCIO1 β I/O bank 1 supply voltage |
| Pin 8 | I/O β User I/O pin (bank 1) |
| Pin 9 | I/O β User I/O pin (bank 1) |
| Pin 10 | I/O β User I/O pin (bank 1) |
| Pin 11 | GND β Ground |
| Pin 12 | I/O β User I/O pin (bank 2) |
| Pin 13 | I/O β User I/O pin (bank 2) |
| Pin 14 | I/O β User I/O pin (bank 2) |
| Pin 15 | I/O β User I/O pin (bank 2) |
| Pin 16 | I/O β User I/O pin (bank 2) |
| Pin 17 | I/O β User I/O pin (bank 2) |
| Pin 18 | I/O β User I/O pin (bank 2) |
| Pin 19 | I/O β User I/O pin (bank 2) |
| Pin 20 | I/O β User I/O pin (bank 2) |
| Pin 21 | GND β Ground |
| Pin 22 | I/O β User I/O pin (bank 2) |
| Pin 23 | I/O β User I/O pin (bank 2) |
| Pin 24 | I/O β User I/O pin (bank 2) |
| Pin 25 | I/O β User I/O pin (bank 2) |
| Pin 26 | I/O β User I/O pin (bank 2) |
| Pin 27 | I/O β User I/O pin (bank 2) |
| Pin 28 | VCCIO2 β I/O bank 2 supply voltage |
| Pin 29 | I/O β User I/O pin (bank 3) |
| Pin 30 | I/O β User I/O pin (bank 3) |
| Pin 31 | I/O β User I/O pin (bank 3) |
| Pin 32 | I/O β User I/O pin (bank 3) |
| Pin 33 | I/O β User I/O pin (bank 3) |
| Pin 34 | I/O β User I/O pin (bank 3) |
| Pin 35 | I/O β User I/O pin (bank 3) |
| Pin 36 | I/O β User I/O pin (bank 3) |
| Pin 37 | GND β Ground |
| Pin 38 | I/O β User I/O pin (bank 3) |
| Pin 39 | I/O β User I/O pin (bank 3) |
| Pin 40 | I/O β User I/O pin (bank 3) |
| Pin 41 | I/O β User I/O pin (bank 3) |
| Pin 42 | I/O β User I/O pin (bank 3) |
| Pin 43 | I/O β User I/O pin (bank 3) |
| Pin 44 | I/O β User I/O pin (bank 3) |
| Pin 45 | GND β Ground |
| Pin 46 | I/O β User I/O pin (bank 4) |
| Pin 47 | I/O β User I/O pin (bank 4) |
| Pin 48 | I/O β User I/O pin (bank 4) |
| Pin 49 | I/O β User I/O pin (bank 4) |
| Pin 50 | I/O β User I/O pin (bank 4) |
| Pin 51 | I/O β User I/O pin (bank 4) |
| Pin 52 | I/O β User I/O pin (bank 4) |
| Pin 53 | I/O β User I/O pin (bank 4) |
| Pin 54 | VCCIO4 β I/O bank 4 supply voltage |
| Pin 55 | TDI β JTAG test data in |
| Pin 56 | TMS β JTAG test mode select |
| Pin 57 | TCK β JTAG test clock |
| Pin 58 | TDO β JTAG test data out |
| Pin 59 | nSTATUS β Configuration status |
| Pin 60 | nCONFIG β Configuration control |
| Pin 61 | VCCINT β Core supply (1.8 V) |
| Pin 62 | GND β Ground |
| Pin 63 | VCCIO3 β I/O bank 3 supply voltage |
| Pin 64 | I/O β User I/O pin (bank 4) |
| Pin EP | GND β Exposed thermal pad - solder to ground plane |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5M160ZE64A5N is suitable for 6 applications: Industrial I/O Expansion and Bus Bridging, Automotive Body-Electronics Modules, Power-Sequencing and Reset Management, Motor-Control Glue Logic, Legacy Interface Translation (PCI/ISA to Serial), Display and LED Matrix Driving.
Industrial I/O Expansion and Bus Bridging
The 5M160ZE64A5N's 128 macro cells and 54 user I/Os make it well-suited for I/O expansion in industrial controllers, where it bridges legacy parallel buses (PCI, ISA, local bus) to modern serial interfaces. Its 7.5 ns pin-to-pin propagation delay supports deterministic 60 MHz bus cycles, and the non-volatile flash fabric ensures instant-on startup without external boot devices. Placed between an MCU and a parallel ADC, it decodes addresses and latches data with sub-15 ns latency, while the AEC-Q100 grade tolerates -40C to +125C factory-floor ambient.
Recommended
Automotive Body-Electronics Modules
The 5M160ZE64A5N's 'A' suffix denotes AEC-Q100 qualification with -40C to +125C operation, which suits body-electronics modules (BCM) for seat control, lighting, and door modules. It performs LIN/CAN glue logic, drives LED matrices via PWM, and sequences power rails for downstream MCUs. The non-volatile flash fabric boots in <1 ms, eliminating the in-rush flicker that plagues SRAM FPGAs in interior lighting, while the 8 Kbit user flash block stores configuration plus small calibration tables.
Recommended
Power-Sequencing and Reset Management
FPGA-based boards require precise rail sequencing to prevent latch-up, and the 5M160ZE64A5N delivers deterministic sequencing at 7.5 ns resolution without external clocks. It monitors PG (power-good) inputs from upstream DC-DC converters and gates downstream enables with user-defined delay chains. The 54 user I/Os comfortably handle 4-rail sequencing plus status LEDs, and the 1.8 V core plus 3.3 V I/O flexibility interfaces directly to most point-of-load regulators.
Recommended
Motor-Control Glue Logic
The 5M160ZE64A5N is widely deployed in BLDC and stepper motor controllers as the glue layer between an MCU and the gate drivers, handling Hall-sensor decoding, commutation tables, and fault aggregation. Its 118.3 MHz max frequency easily decodes 50 kHz PWM edges, while the AEC-Q100 grade supports under-the-hood temperature swings. The 8 Kbits user flash also stores motor-specific calibration constants, allowing the same CPLD image to be deployed across motor variants by re-flashing.
Recommended
Legacy Interface Translation (PCI/ISA to Serial)
Many industrial systems still use 5 V PCI/ISA peripherals that must connect to modern 3.3 V processors, and the 5M160ZE64A5N's multi-voltage I/O banks (1.5/1.8/2.5/3.3 V) allow direct level shifting without external buffers. It implements address-decode logic, byte-swapping, and interrupt steering at sub-15 ns latency. The 64-EQFP with exposed pad simplifies thermal design in legacy chassis where ambient reaches +85C.
Recommended
Display and LED Matrix Driving
The 5M160ZE64A5N's 54 user I/Os and 118.3 MHz bandwidth make it well-suited to drive multiplexed LED matrices, character LCDs, and segment displays with low CPU overhead. Its 1.8 V core reduces power consumption versus 5 V legacy CPLDs, while its 3.3 V-tolerant I/O banks drive modern LED-driver ICs directly. The instant-on flash fabric also eliminates the in-rush flicker that would otherwise reveal uninitialized display columns at power-up.
Recommended
Recommended Products Summary
Engineering reference data for 5M160ZE64A5N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5M160ZE64C5N | 5M160ZE64I5N | 5M160ZE64A5 | 5M160ZE64C4N |
|---|---|---|---|---|---|
| Package | 64-pin EQFP | 64-pin EQFP - same | 64-pin EQFP - same | 64-pin EQFP - same | 64-pin EQFP - same |
| Brand | Altera | Altera | Altera | Altera | Altera |
| Macro Cells | 128 | 128 | 128 | 128 | 128 |
| Pin-to-Pin Delay (tPD) | 7.5 ns | 7.5 ns | 7.5 ns | 7.5 ns | 10 ns |
| Max Frequency (fMAX) | 118.3 MHz | 118.3 MHz | 118.3 MHz | 118.3 MHz | Lower (speed grade 4) |
| Operating Temperature | -40C to +125C (automotive) | 0C to +85C (commercial) | -40C to +100C (industrial) | -40C to +125C (automotive) | 0C to +85C (commercial) |
| AEC-Q100 Qualified | Yes | No | No | Yes | No |
| User Flash Memory | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
Key Differentiators
- AEC-Q100 automotive qualification on this part number only (vs 5M160ZE64C5N)
- Same die across A/C/I suffixes for design portability (vs 5M160ZE64I5N)
- Speed-grade 5 yields fastest timing margin (vs 5M160ZE64C4N)
- Non-volatile flash fabric eliminates boot PROM (vs XC2C64A-7VQG44C)
Design Notes
The 5M160ZE64A5N requires a clean 1.8 V VCCINT rail from 1.71 V to 1.89 V. Place a 0.1 uF ceramic decoupling capacitor within 5 mm of every VCCINT pin, plus a 10 uF bulk ceramic near the EQFP exposed pad. The exposed pad (EP) MUST be soldered to the ground plane to keep junction temperature below +125C at full industrial load. Estimated: at ICCINT ~50 mA typical + 54 I/O switching, plan ~500 mW dissipation.
Route all JTAG signals (TDI, TMS, TCK, TDO) in a single bus with 4.7 kohm pull-ups on TMS and TDI; keep the JTAG chain stub-free and away from switching signals. Provide a 4-pin JTAG header on the production PCB even if programming is via USB-Blaster, to enable field re-flash and FA. Keep nCONFIG and nSTATUS lines routed with 10 kohm pull-up to VCCIO for clean reset behavior.
The EQFP-64 exposed pad provides the primary thermal path. Use thermal vias in a 4x4 grid under the EP to a ground plane - typical design uses 0.3 mm via diameter, 1.0 mm pitch. At +85C ambient, the device can dissipate roughly 1 W; at +125C industrial ambient, derate to ~0.5 W. Without the EP soldered properly, junction temperature can exceed +150C under sustained logic activity.
Do not confuse the MAX V family (non-volatile, instant-on, 1.8 V core) with the older MAX II family (also non-volatile but different JTAG IDs) - mixing programmer files bricks the device. Always verify the Quartus programmer reads back the correct device ID (0x020F for 5M160ZE64) before issuing a Program operation. Also: VCCIO bank supplies must NOT be left floating, or undefined I/O behavior will cause in-rush current at startup.
Separate analog and digital ground returns on a multi-layer PCB; the MAX V does not require a split plane, but sensitive analog references near the device benefit from a quiet ground island tied at one point. Keep high-speed I/O traces matched within 5 mm for parallel interfaces, and use the per-pin programmable slew-rate feature to slow edges on long traces and reduce EMI emissions below CISPR 25 automotive limits.
Compliance Information
AEC-Q100 qualification per Altera automotive-grade datasheet; RoHS and REACH compliant per distributor listings; lead-free and halogen-free per package materials declaration.
