Intel

5M2210ZF256I5N - MAX V CPLD, 1700 LEs, 256-FBGA | Altera

MPN: 5M2210ZF256I5N ✓ Active
In Stock Ships in 1-3 business days
1.8 V nominal Vdss 256-ball FBGA Package [DATA_NEEDED: fMAX] Speed 8 Kbits Memory
From $17.5 USD / Unit
MOQ: 1 |
Price updated: 2026-09-05
Volume Pricing
Qty Unit Price Extended
1 $27.34 $27.34
10 $24.6 $246.00
100 $21.87 $2,187.00
500 $19.14 $9,570.00
1,000 $17.5 $17,500.00
ℹ️ All prices are in USD

Drop-in alternatives for 5M2210ZF256I5N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

5M2210ZF256I5

✅ Drop-In
Intel
📦 256-ball FBGA (ZF256)
MAX V · 5M2210Z · 1700 · 201.1 MHz · 1.8 V · 212 · FBGA-256 (256-ball FineLine BGA) · 1.0 mm

✓ In Stock

$23.9 / Unit

View Datasheet →

5M2210ZF256C5N

✅ Drop-In
Altera
📦 256-ball FBGA (ZF256)
CPLD - Complex Programmable Logic Devices · MAX V · 2210 · 1700 · 203 · 1.8 V · 201.1 MHz · 7 ns

✓ In Stock

$5.49 / Unit

View Datasheet →

5M2210ZF256A5N

✅ Drop-In
Intel
📦 256-ball FBGA (ZF256)
CPLD (Flash PLD), MAX V Family · 1700 · 203 · 203 · 201.1 MHz · 11.2 ns · 1.8 V · CMOS

✓ In Stock

$20.9 / Unit

View Datasheet →

5M2210ZF256C4N

✅ Drop-In
Altera
📦 256-ball FBGA (ZF256)
MAX V · 5M2210Z · 1700 · 221 · 8192 bits · 212 Kbits · 203 · 4

✓ In Stock

$5.2 / Unit

View Datasheet →

5M2210ZF256A5N

✅ Drop-In
Intel
📦 256-ball FBGA (ZF256)
CPLD (Flash PLD), MAX V Family · 1700 · 203 · 203 · 201.1 MHz · 11.2 ns · 1.8 V · CMOS

✓ In Stock

$20.9 / Unit

View Datasheet →

5M2210ZF256I7N

✅ Drop-In
📦 256-ball FBGA (ZF256)
industrial grade, faster speed bin (lower tPD) - 100% pin-compatible footprint in same ZF256 package

📋 Reference alternative (not in catalog)

5M2210ZF256I5N Maximum Ratings & Electrical Characteristics

Device Family MAX V
Device Logic Elements 1700
Maximum User I/O Pins 212
Pin-to-Pin Logic Delay (tPD) 7 ns
User Flash Memory 8 Kbits
Package 256-ball FBGA
Package Designator ZF256
Operating Temperature Grade Industrial (-40C to +100C junction)
Process Technology 0.18 um embedded-flash CMOS
Supply Voltage - Core 1.8 V nominal
I/O Bank Supply (VCCIO) 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank)
Configuration Memory Internal non-volatile flash (instant-on)
Boundary Scan IEEE Std 1149.1 (JTAG)
Programming Interface JTAG / ISP via Quartus II or Quartus Prime
RoHS Status Compliant
MSL Level MSL3 (per JEDEC J-STD-020, reflow at 260C)

5M2210ZF256I5N zf256 Pin Configuration Guide

Complete pinout information for 5M2210ZF256I5N (zf256 package) with 212 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

zf256 package pinout diagram for 5M2210ZF256I5N

No detailed pinout data available for 5M2210ZF256I5N.

Refer to the datasheet for full pin configuration.

Estimated pin count: 212 pins (digital package)

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for 5M2210ZF256I5N Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

5M2210ZF256I5N is suitable for 6 applications: Industrial I/O Expansion & Level Shifting, Bus Bridging Between Legacy MCU and Modern SoC, Multi-Rail Power-Up & Power-Down Sequencing, JTAG Test Infrastructure & Boundary Scan, LED Display & Seven-Segment Driving, Consumer Appliance & White-Goods Control Board.

🏭

Industrial I/O Expansion & Level Shifting

The 5M2210ZF256I5N's 212 user I/O pins across multiple banks, combined with per-bank VCCIO support from 1.5 V to 3.3 V, make it a strong fit for industrial I/O expansion and voltage-translation tasks. Each I/O bank can run independently, so a single 5M2210ZF256I5N can translate a 3.3 V MCU bus to a 1.8 V sensor bus while simultaneously driving 5 V-tolerant outputs on a third bank. The 7 ns pin-to-pin delay is well below typical industrial scan rates (sub-microsecond), and the instant-on flash configuration eliminates the FPGA-style boot delay that would otherwise complicate deterministic safety interlocks. Industrial-grade operating temperature (-40C to +100C junction) matches factory-floor and outdoor enclosure requirements.

🔧

Bus Bridging Between Legacy MCU and Modern SoC

Bridging a parallel 8/16-bit legacy microcontroller bus to a high-speed SPI/I2C peripheral or to a modern Cortex-A SoC is a canonical CPLD use case where the 5M2210ZF256I5N excels. The instant-on non-volatile configuration means the bridge is alive within microseconds of power-up - critical for early board initialization before the main SoC boots. The 7 ns tPD supports clock rates up to 100 MHz, more than adequate for SPI, I2C, UART, and address/data demultiplexing. The integrated user flash (8 Kbits) can store board revision codes, MAC IDs, or strap settings that the SoC reads at boot, eliminating an extra EEPROM and reducing BOM cost.

Multi-Rail Power-Up & Power-Down Sequencing

Modern processor boards require strict rail-on/rail-off ordering (e.g., 1.0 V core before 1.8 V PLL before 3.3 V IO) to prevent latch-up. The 5M2210ZF256I5N is well-suited to this sequencing role because its instant-on flash configuration is live before the slowest rail stabilizes, and its 212 I/Os can drive dozens of enable pins of downstream DC-DC converters and load switches. The 7 ns tPD keeps sequence skew below 50 ns even on large fan-out trees. Because the configuration is non-volatile, sequencing behavior is deterministic and identical from board to board - no JTAG-reprogramming drift after field returns.

🖥️

JTAG Test Infrastructure & Boundary Scan

The 5M2210ZF256I5N's full IEEE 1149.1 JTAG support lets it act as a centralized TAP controller and chain master for boundary-scan test on densely populated boards where the main CPU is not yet running. With up to 212 I/Os, the device can observe and drive test vectors into clusters of memory, transceivers, and even non-JTAG parts via boundary-scan cell emulation. Industrial temperature grade and instant-on flash make it ideal for production ATE fixture electronics, where it must boot reliably in milliseconds when the test program starts. Quartus Prime generates BSDL files automatically for any pin assignment.

💡

LED Display & Seven-Segment Driving

The 5M2210ZF256I5N's high I/O count and per-pin programmable current-strength settings are ideal for directly driving multiplexed seven-segment and dot-matrix LED panels without external driver ICs. The instant-on behavior means the display appears within milliseconds of power-up, and the non-volatile configuration stores brightness tables, blinking patterns, and segment remapping. Industrial temperature grade supports consumer-appliance and medical-instrument front panels. With 1700 logic elements, the part can also implement simple char-ROM lookup, BCD conversion, and key-scan logic on the same chip.

🏭

Consumer Appliance & White-Goods Control Board

White-goods controllers (washing machines, dishwashers, refrigerators, induction cooktops) need flash-based glue logic that boots instantly, survives decades of thermal cycling, and operates from -20C to +85C ambient with peaks near +100C. The 5M2210ZF256I5N fits these requirements: industrial-grade silicon, 7 ns deterministic timing for safety interlock decoding, and 1700 logic elements sufficient for keypad scanning, sensor multiplexing, and triac/relay driver sequencing. The integrated user flash replaces an external EEPROM for storing error codes and end-of-cycle flags.

Recommended Products Summary

5M2210ZF256I5 Intel Used in: Industrial I/O Expansion & Level Shifting 5M2210ZF256A5N Intel Used in: Industrial I/O Expansion & Level Shifting MAX232 Companion RS-232 line driver when bridging to legacy serial ports Used in: Industrial I/O Expansion & Level Shifting 5M1270ZF256I5N Altera Used in: Bus Bridging Between Legacy MCU and Modern SoC 5M160ZE64I5N Intel Used in: Bus Bridging Between Legacy MCU and Modern SoC TPS54331 Companion 3-A buck converter whose EN pin the CPLD sequences Used in: Multi-Rail Power-Up & Power-Down Sequencing TPS22918 Load switch with controlled rise time, sequenced by CPLD Used in: Multi-Rail Power-Up & Power-Down Sequencing 5CSEBA6U23I7N Intel Used in: JTAG Test Infrastructure & Boundary Scan SN74AVC4T245 Level translator used in JTAG chain between CPLD and 1.8 V TAPs Used in: JTAG Test Infrastructure & Boundary Scan TLC5941 Companion 16-channel LED PWM driver when more brightness control is needed Used in: LED Display & Seven-Segment Driving MAX7219 Companion SPI-driven 8-digit seven-segment driver for cascaded displays Used in: LED Display & Seven-Segment Driving MOC3021 Companion optoisolated triac driver for mains-load switching Used in: Consumer Appliance & White-Goods Control Board LM35 Companion analog temperature sensor feeding CPLD-driven safety logic Used in: Consumer Appliance & White-Goods Control Board
What is the 5M2210ZF256I5N logic element count and package?
The 5M2210ZF256I5N is a MAX V family CPLD with 1700 logic elements housed in a 256-ball FineLine BGA (designator ZF256). According to the MAX V device family datasheet, this places the part in the mid-density tier of the MAX V lineup, suited to glue-logic bridging and control-plane sequencing rather than high-volume datapath work.
What is the propagation delay of 5M2210ZF256I5N?
The 5M2210ZF256I5N is specified with a 7 ns commercial pin-to-pin propagation delay (tPD1). For most industrial glue-logic tasks such as address decoding and interrupt aggregation, this delay is more than adequate and is consistent across temperature because MAX V uses non-volatile flash configuration, not SRAM-backed lookup tables.
What is the difference between 5M2210ZF256I5N and 5M2210ZF256I5?
The 5M2210ZF256I5N is supplied on tape and reel for high-volume assembly lines, whereas the 5M2210ZF256I5 ships in a tray. Both parts share the same silicon die, the same 256-FBGA package, and identical electrical specifications; they are drop-in identical apart from the carrier packaging used by the SMT line.
How does 5M2210ZF256I5N differ from 5M2210ZF256C5N?
The trailing letter in the part number denotes the temperature grade. 5M2210ZF256I5N is industrial grade (-40C to +100C junction), while 5M2210ZF256C5N is commercial grade (0C to +85C). Both share the 256-FBGA package and 1700 LE fabric; choose C5N for office-environment products and I5N for industrial, automotive body, or outdoor installations.
Can 5M2210ZF256I5N replace 5M2210ZF324C5N?
No - the 5M2210ZF324C5N is a larger 324-ball FBGA package with a higher I/O count, and 5M2210ZF256I5N uses a 256-ball package, so they are not pin-compatible drop-in substitutes. You would need a PCB redesign and a recompile in Quartus to port a design between these two FBGA footprints.
Where can I buy 5M2210ZF256I5N online?
As of 2026-09-06, 5M2210ZF256I5N is stocked at authorized distributors including DigiKey (544-2973-ND), Mouser, Arrow Electronics, and Xecor. XAIPART also lists the part with current pricing; always request a quote for production quantities above 1000 pieces because large orders move through franchised channels.
What is the unit price of 5M2210ZF256I5N at quantity 1?
As of 2026-09-06, the qty-1 unit price of 5M2210ZF256I5N is approximately USD 27.34 per the Heisener distributor listing. Volume pricing on DigiKey drops to roughly USD 17.50 at 1000 pieces; lead time for stock units is typically immediate, with full-reel factory orders running 8-12 weeks.
What is the lead time for 5M2210ZF256I5N?
Distributor stock of 5M2210ZF256I5N on DigiKey and Mouser usually ships within 1-3 business days for orders of a few hundred pieces as of 2026-09-06. Direct factory orders from Intel (formerly Altera) for full reels are typically 8-12 weeks; samples from authorized distributors are usually fulfilled in 1-2 weeks.
Is 5M2210ZF256I5N in stock at major distributors?
Based on the 2026-09-06 snapshot, 5M2210ZF256I5N is listed as in stock at DigiKey, Mouser, Arrow, and Xecor, with several thousand units of distributor inventory reported by Heisener (5,472 pieces). Industrial-grade CPLDs in this density range have historically had stable supply because the MAX V family is mature and still in active production.
What is the best drop-in replacement for 5M2210ZF256I5N?
The closest drop-in replacements are same-family MAX V devices in the 256-ball FBGA: 5M2210ZF256I5 (tray version, identical die) and 5M2210ZF256A5N (automotive temperature grade). For higher density needs in the same footprint, the 5M240Z/M240ZT MAX V family members in FBGA packages offer more logic elements, but they are not pin-compatible with the 5M2210ZE256 footprint.
Where can I download the MAX V 5M2210ZF256I5N datasheet PDF?
The official Intel MAX V device family datasheet PDF is available at intel.com/literature/hb/max-v/mv51008.pdf and covers the 5M2210ZF256I5N along with all other MAX V densities. A third-party mirror is also hosted at alterasemi.com/datasheet/alterasemi/5M2210ZF256I5N.pdf, but always verify against the latest revision on intel.com before locking a design.
Where can I find the 5M2210ZF256I5N pinout for the 256-ball FBGA?
The pinout is documented in section 2 of the MAX V device family datasheet, with a dedicated ball-map table for the 256-pin FineLine BGA (package code ZF256). The same file covers all MAX V FBGA packages, so cross-reference the ZF256 column to your specific device density. Quartus Prime software also exports a per-pin assignment file (.pin) once the device is selected in the project.
What software is needed to program 5M2210ZF256I5N?
The 5M2210ZF256I5N is programmed using Intel Quartus Prime Lite Edition (free) or the legacy Quartus II Web Edition, in conjunction with a JTAG download cable such as the USB-Blaster or Byte-Blaster. Programming is performed in-system via the JTAG pins (TDI, TDO, TMS, TCK) or with the Altera Programming Unit, and the resulting .pof or .jic file is stored in the device's internal flash.
Is 5M2210ZF256I5N suitable for industrial applications?
Yes - the trailing I in the MPN explicitly marks 5M2210ZF256I5N as industrial temperature grade (-40C to +100C junction), and the MAX V device family datasheet confirms full operation across this range. Combined with the instant-on non-volatile configuration, this part is widely used in factory automation, building controls, and automotive body-electronics applications.
What is the difference between MAX V CPLD and a small FPGA?
A MAX V CPLD such as 5M2210ZF256I5N uses non-volatile flash configuration for instant-on behavior, deterministic 7 ns pin-to-pin delay, and typically no external configuration memory, while a small SRAM-based FPGA must boot from a serial flash and has higher static power plus variable boot time. CPLDs are favored for glue logic and bus-bridging; small FPGAs are favored when you need DSP blocks, transceivers, or high logic density.

Engineering reference data for 5M2210ZF256I5N — comparison, design guidance, and compliance information.

Selection Guide

Choose the 5M2210ZF256I5N when you need 1700 logic elements, 212 user I/Os, and industrial temperature range (-40C to +100C) in a 256-ball FBGA for glue-logic, bus-bridging, or power-sequencing tasks on factory-floor, outdoor, or harsh-environment boards. Pick the 5M2210ZF256I5 tray-packaged variant for low-volume prototype runs that do not need tape-and-reel feeders. Choose the 5M2210ZF256C5N only for office-temperature commercial products where the cost savings outweigh the narrower thermal range. Choose the 5M2210ZF256A5N when you require AEC-Q100 automotive qualification for under-hood or dashboard modules. All four parts share the same silicon die and the same ZF256 footprint, so PCB layout can be reused across SKUs. For lower-cost designs in smaller packages, consider 5M160Z or 5M1270 MAX V devices in 64- to 256-ball FBGA packages. For higher logic capacity (>2200 LEs), step up to the MAX 10 family instead, but plan for a different footprint and a Quartus Prime project migration.

Comparison with Alternatives

Parameter This Product 5M2210ZF256I5 5M2210ZF256C5N 5M2210ZF256A5N 5M2210ZF256C4N 5M2210ZF256I7N
Brand Intel (formerly Altera) Intel (formerly Altera) Intel (formerly Altera) Intel (formerly Altera) Intel (formerly Altera) Intel (formerly Altera)
Package 256-ball FBGA (ZF256) 256-ball FBGA (ZF256) - same 256-ball FBGA (ZF256) - same 256-ball FBGA (ZF256) - same 256-ball FBGA (ZF256) - same 256-ball FBGA (ZF256) - same
Logic Elements 1700 1700 1700 1700 1700 1700
Pin-to-Pin Delay (tPD) 7 ns 7 ns 7 ns 7 ns Slower speed bin (~within 30%) Faster speed bin
Temperature Grade Industrial (-40C to +100C) Industrial (-40C to +100C) Commercial (0C to +85C) Automotive (-40C to +125C) Commercial (0C to +85C) Industrial (-40C to +100C)
Shipping Carrier Tape & Reel Tray Tape & Reel Tape & Reel Tape & Reel Tape & Reel
Maximum User I/O 212 212 212 212 212 212
User Flash Memory 8 Kbits 8 Kbits 8 Kbits 8 Kbits 8 Kbits 8 Kbits
Configuration Memory Internal non-volatile flash Internal non-volatile flash Internal non-volatile flash Internal non-volatile flash Internal non-volatile flash Internal non-volatile flash

Key Differentiators

  • Industrial temperature grade in standard lead-free 256-FBGA (vs 5M2210ZF256C5N)
  • Instant-on non-volatile flash configuration (vs SRAM-based small FPGAs (e.g. Cyclone V))
  • Automotive-grade variant available in same FBGA footprint (vs 5M2210ZF256A5N (AEC-Q100))

Design Notes

Provide a clean, monotonic VCC ramp of 1.8 V nominal to VCCINT, with each VCCIO bank ramped within the same window as VCCINT. The MAX V internal flash configuration is read during the rising edge of VCCINT, and a non-monotonic ramp (droop > 0.2 V during ramp, or slow rise < 1 ms) can cause configuration errors that the device will not flag - the CPLD appears dead until power-cycled. Place a 100 nF decoupling capacitor within 5 mm of each VCC pin and a bulk 10 uF near the package; the FBGA has many VCC/VCCIO balls and parallel decoupling is essential.

The 256-ball FBGA (ZF256) has a 1.0 mm ball pitch and is best routed on a 4-layer or 6-layer PCB with a continuous ground plane under the package. Fan-out escape routing must use micro-via-in-pad or dog-bone patterns; the inner-row balls cannot be reached with through-hole vias on a 4-layer stack-up. Match trace lengths within each bus group if you intend to source-synchronous interfaces - although the MAX V has 7 ns tPD, intra-group skew above 1 ns will degrade your setup/hold margin at higher bus speeds.

Do not mix 3.3 V TTL signaling with 1.5 V or 1.8 V LVCMOS in the same I/O bank - each bank shares a single VCCIO rail and inputs are referenced to that rail, so mixed-voltage inputs in one bank can inject current through internal ESD clamps. Place voltage-translated signals in separate banks, each with its own VCCIO decoupling. Also note that the TMS, TDI, TDO, and TCK pins reside in Bank 1 and do not support PCI or 1.2 V LVCMOS I/O standards; this is documented in the MAX V device family datasheet section on JTAG pin standards.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS and REACH compliance per Intel MAX V product family documentation; 5M2210ZF256I5N itself is not AEC-Q100 qualified (use 5M2210ZF256A5N for automotive applications). Lead-free 256-FBGA package; halogen-free status marked unknown because not explicitly stated in the verified web data. Conflict-minerals compliance per Intel's published CFSI reporting.

Data verified on: 2026-09-06 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Intel Altera 5M2210ZF256I5N 5M2210ZF256I5 5M2210ZF256C5N 5M2210ZF256A5N 5M2210ZF256C4N 5M2210ZF256I7N MAX V family CPLD Complex Programmable Logic Device FPGA Field Programmable Gate Array Logic Element (LE) FBGA FineLine Ball-Grid Array JTAG IEEE 1149.1 Quartus Prime RoHS REACH AEC-Q100 non-volatile flash configuration bus bridging I/O expansion level shifting multi-rail power sequencing boundary-scan test
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