5M2210ZF256I5N - MAX V CPLD, 1700 LEs, 256-FBGA | Altera
MPN: 5M2210ZF256I5N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $27.34 | $27.34 |
| 10 | $24.6 | $246.00 |
| 100 | $21.87 | $2,187.00 |
| 500 | $19.14 | $9,570.00 |
| 1,000 | $17.5 | $17,500.00 |
5M2210ZF256I5N Overview
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines the deterministic timing and instant-on behavior of PAL/GAL architectures with higher density macro-cell fabric. In the broader taxonomy, CPLDs sit alongside FPGAs (Field Programmable Gate Arrays) within the programmable logic category of digital integrated circuits. MAX V devices specifically target glue-logic, bus-bridging, I/O expansion, and power-sequencing roles, offering a non-volatile alternative to small FPGAs and to discrete MSI/SSI logic.
Key features include 1700 logic elements distributed across logic array blocks (LABs), up to 212 user I/O pins routed through multiple I/O banks, 8 Kbits of user flash memory for storing board parameters or revision codes, an internal oscillator, and a JTAG/IEEE 1149.1 boundary-scan interface compliant with IEEE Std 1149.1. The device is built on a 0.18 um embedded-flash CMOS process, which removes the need for an external configuration PROM and reduces board area and BOM cost.
Architecturally, MAX V CPLDs use a multi-level non-volatile switch matrix that holds configuration even when powered down, providing instant-on operation in under 1 ms after a valid VCC ramp. Each I/O pin supports programmable slew rate, bus-hold, weak pull-up resistors, and programmable drive strength, and each pin can be configured for 3.3 V, 2.5 V, 1.8 V, or 1.5 V LVCMOS/LVTTL signaling, with per-bank VCCIO rails enabling mixed-voltage interfacing.
Typical applications include I/O expansion and level shifting in industrial control boards, bus bridging between legacy microcontrollers and modern SoCs, power-up and power-down sequencing for multi-rail processor boards, JTAG-controlled board-test infrastructure, and LED or seven-segment display driving in consumer and medical instruments. The wide industrial temperature range and instant-on behavior also suit automotive body-electronics modules and white-goods appliances.
When designing with this part, carefully review the Quartus II / Quartus Prime pin assignment tool output and respect each I/O bank's VCCIO supply range - mixing voltage standards in a single bank without a common reference is a common source of input-current latch-up. Always provide a clean, monotonic VCC ramp to guarantee correct flash-based configuration at startup.
This page synthesizes distributor pricing, same-family drop-in variants, and practical design notes that are not collected in any single manufacturer datasheet.
Drop-in alternatives for 5M2210ZF256I5N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with 5M2210ZF256I5N (same form factor and footprint) — differing in Package, Programming Interface, RoHS Status, Configuration Memory, User Flash Memory.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
5M2210ZF256I5
✅ Drop-In✓ In Stock
$23.9 / Unit
View Datasheet →5M2210ZF256C5N
✅ Drop-In✓ In Stock
$11.95 / Unit
View Datasheet →5M2210ZF256A5N
✅ Drop-In✓ In Stock
$20.9 / Unit
View Datasheet →5M2210ZF256C4N
✅ Drop-In✓ In Stock
$7.29 / Unit
View Datasheet →5M2210ZF256A5N
✅ Drop-In✓ In Stock
$20.9 / Unit
View Datasheet →5M2210ZF256I7N
✅ Drop-In📋 Reference alternative (not in catalog)
5M2210ZF256I5N Maximum Ratings & Electrical Characteristics
| Device Family | MAX V |
| Device Logic Elements | 1700 |
| Maximum User I/O Pins | 212 |
| Pin-to-Pin Logic Delay (tPD) | 7 ns |
| User Flash Memory | 8 Kbits |
| Package | 256-ball FBGA |
| Package Designator | ZF256 |
| Operating Temperature Grade | Industrial (-40C to +100C junction) |
| Process Technology | 0.18 um embedded-flash CMOS |
| Supply Voltage - Core | 1.8 V nominal |
| I/O Bank Supply (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank) |
| Configuration Memory | Internal non-volatile flash (instant-on) |
| Boundary Scan | IEEE Std 1149.1 (JTAG) |
| Programming Interface | JTAG / ISP via Quartus II or Quartus Prime |
| RoHS Status | Compliant |
| MSL Level | MSL3 (per JEDEC J-STD-020, reflow at 260C) |
5M2210ZF256I5N zf256 Pin Configuration Guide
Pin configuration for 5M2210ZF256I5N (zf256 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5M2210ZF256I5N.
Refer to the datasheet for full pin configuration.
Typical Applications
5M2210ZF256I5N is suitable for 6 applications: Industrial I/O Expansion & Level Shifting, Bus Bridging Between Legacy MCU and Modern SoC, Multi-Rail Power-Up & Power-Down Sequencing, JTAG Test Infrastructure & Boundary Scan, LED Display & Seven-Segment Driving, Consumer Appliance & White-Goods Control Board.
Industrial I/O Expansion & Level Shifting
The 5M2210ZF256I5N's 212 user I/O pins across multiple banks, combined with per-bank VCCIO support from 1.5 V to 3.3 V, make it a strong fit for industrial I/O expansion and voltage-translation tasks. Each I/O bank can run independently, so a single 5M2210ZF256I5N can translate a 3.3 V MCU bus to a 1.8 V sensor bus while simultaneously driving 5 V-tolerant outputs on a third bank. The 7 ns pin-to-pin delay is well below typical industrial scan rates (sub-microsecond), and the instant-on flash configuration eliminates the FPGA-style boot delay that would otherwise complicate deterministic safety interlocks. Industrial-grade operating temperature (-40C to +100C junction) matches factory-floor and outdoor enclosure requirements.
Recommended
Bus Bridging Between Legacy MCU and Modern SoC
Bridging a parallel 8/16-bit legacy microcontroller bus to a high-speed SPI/I2C peripheral or to a modern Cortex-A SoC is a canonical CPLD use case where the 5M2210ZF256I5N excels. The instant-on non-volatile configuration means the bridge is alive within microseconds of power-up - critical for early board initialization before the main SoC boots. The 7 ns tPD supports clock rates up to 100 MHz, more than adequate for SPI, I2C, UART, and address/data demultiplexing. The integrated user flash (8 Kbits) can store board revision codes, MAC IDs, or strap settings that the SoC reads at boot, eliminating an extra EEPROM and reducing BOM cost.
Recommended
Multi-Rail Power-Up & Power-Down Sequencing
Modern processor boards require strict rail-on/rail-off ordering (e.g., 1.0 V core before 1.8 V PLL before 3.3 V IO) to prevent latch-up. The 5M2210ZF256I5N is well-suited to this sequencing role because its instant-on flash configuration is live before the slowest rail stabilizes, and its 212 I/Os can drive dozens of enable pins of downstream DC-DC converters and load switches. The 7 ns tPD keeps sequence skew below 50 ns even on large fan-out trees. Because the configuration is non-volatile, sequencing behavior is deterministic and identical from board to board - no JTAG-reprogramming drift after field returns.
Recommended
JTAG Test Infrastructure & Boundary Scan
The 5M2210ZF256I5N's full IEEE 1149.1 JTAG support lets it act as a centralized TAP controller and chain master for boundary-scan test on densely populated boards where the main CPU is not yet running. With up to 212 I/Os, the device can observe and drive test vectors into clusters of memory, transceivers, and even non-JTAG parts via boundary-scan cell emulation. Industrial temperature grade and instant-on flash make it ideal for production ATE fixture electronics, where it must boot reliably in milliseconds when the test program starts. Quartus Prime generates BSDL files automatically for any pin assignment.
Recommended
LED Display & Seven-Segment Driving
The 5M2210ZF256I5N's high I/O count and per-pin programmable current-strength settings are ideal for directly driving multiplexed seven-segment and dot-matrix LED panels without external driver ICs. The instant-on behavior means the display appears within milliseconds of power-up, and the non-volatile configuration stores brightness tables, blinking patterns, and segment remapping. Industrial temperature grade supports consumer-appliance and medical-instrument front panels. With 1700 logic elements, the part can also implement simple char-ROM lookup, BCD conversion, and key-scan logic on the same chip.
Recommended
Consumer Appliance & White-Goods Control Board
White-goods controllers (washing machines, dishwashers, refrigerators, induction cooktops) need flash-based glue logic that boots instantly, survives decades of thermal cycling, and operates from -20C to +85C ambient with peaks near +100C. The 5M2210ZF256I5N fits these requirements: industrial-grade silicon, 7 ns deterministic timing for safety interlock decoding, and 1700 logic elements sufficient for keypad scanning, sensor multiplexing, and triac/relay driver sequencing. The integrated user flash replaces an external EEPROM for storing error codes and end-of-cycle flags.
Recommended
Recommended Products Summary
Engineering reference data for 5M2210ZF256I5N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5M2210ZF256I5 | 5M2210ZF256C5N | 5M2210ZF256A5N | 5M2210ZF256C4N | 5M2210ZF256I7N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 256-ball FBGA (ZF256) | 256-ball FBGA (ZF256) - same | 256-ball FBGA (ZF256) - same | 256-ball FBGA (ZF256) - same | 256-ball FBGA (ZF256) - same | 256-ball FBGA (ZF256) - same |
| Logic Elements | 1700 | 1700 | 1700 | 1700 | 1700 | 1700 |
| Pin-to-Pin Delay (tPD) | 7 ns | 7 ns | 7 ns | 7 ns | Slower speed bin (~within 30%) | Faster speed bin |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Automotive (-40C to +125C) | Commercial (0C to +85C) | Industrial (-40C to +100C) |
| Shipping Carrier | Tape & Reel | Tray | Tape & Reel | Tape & Reel | Tape & Reel | Tape & Reel |
| Maximum User I/O | 212 | 212 | 212 | 212 | 212 | 212 |
| User Flash Memory | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
| Configuration Memory | Internal non-volatile flash | Internal non-volatile flash | Internal non-volatile flash | Internal non-volatile flash | Internal non-volatile flash | Internal non-volatile flash |
Key Differentiators
- Industrial temperature grade in standard lead-free 256-FBGA (vs 5M2210ZF256C5N)
- Instant-on non-volatile flash configuration (vs SRAM-based small FPGAs (e.g. Cyclone V))
- Automotive-grade variant available in same FBGA footprint (vs 5M2210ZF256A5N (AEC-Q100))
Design Notes
Provide a clean, monotonic VCC ramp of 1.8 V nominal to VCCINT, with each VCCIO bank ramped within the same window as VCCINT. The MAX V internal flash configuration is read during the rising edge of VCCINT, and a non-monotonic ramp (droop > 0.2 V during ramp, or slow rise < 1 ms) can cause configuration errors that the device will not flag - the CPLD appears dead until power-cycled. Place a 100 nF decoupling capacitor within 5 mm of each VCC pin and a bulk 10 uF near the package; the FBGA has many VCC/VCCIO balls and parallel decoupling is essential.
The 256-ball FBGA (ZF256) has a 1.0 mm ball pitch and is best routed on a 4-layer or 6-layer PCB with a continuous ground plane under the package. Fan-out escape routing must use micro-via-in-pad or dog-bone patterns; the inner-row balls cannot be reached with through-hole vias on a 4-layer stack-up. Match trace lengths within each bus group if you intend to source-synchronous interfaces - although the MAX V has 7 ns tPD, intra-group skew above 1 ns will degrade your setup/hold margin at higher bus speeds.
Do not mix 3.3 V TTL signaling with 1.5 V or 1.8 V LVCMOS in the same I/O bank - each bank shares a single VCCIO rail and inputs are referenced to that rail, so mixed-voltage inputs in one bank can inject current through internal ESD clamps. Place voltage-translated signals in separate banks, each with its own VCCIO decoupling. Also note that the TMS, TDI, TDO, and TCK pins reside in Bank 1 and do not support PCI or 1.2 V LVCMOS I/O standards; this is documented in the MAX V device family datasheet section on JTAG pin standards.
Compliance Information
RoHS and REACH compliance per Intel MAX V product family documentation; 5M2210ZF256I5N itself is not AEC-Q100 qualified (use 5M2210ZF256A5N for automotive applications). Lead-free 256-FBGA package; halogen-free status marked unknown because not explicitly stated in the verified web data. Conflict-minerals compliance per Intel's published CFSI reporting.
