5M40ZE64A5N - MAX V 40 LE EQFP-64 5ns 40 Logic Elements | Intel
N.º de pieza: 5M40ZE64A5N ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $3.42 | $3,42 |
| 10 | $3.08 | $30,80 |
| 100 | $2.74 | $274,00 |
| 500 | $2.41 | $1.205,00 |
| 1.000 | $2.18 | $2.180,00 |
5M40ZE64A5N Descripción general
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PAL/GAL-style macrocell arrays on a single chip with a global interconnect fabric, sitting architecturally between small FPGAs and discrete logic gates. MAX V CPLDs use a 1.8 V core voltage with multi-voltage I/O support, making them ideal for bus-bridging and level-translation tasks between legacy 5 V, 3.3 V, 2.5 V, and 1.8 V subsystems without external level shifters.
Key features of the 5M40ZE64A5N include 40 Logic Elements organized as 2 Logic Array Blocks (LABs) of 20 LEs each, 30 maximum user I/O pins, 4 Kbits of user flash for customer-defined parameters and IDs, an integrated JTAG IEEE 1149.1 boundary-scan interface, and 1.8 V core with multi-voltage I/O supporting LVCMOS/LVTTL at 1.2 V to 3.3 V. The device is rated for the commercial temperature range of 0 C to +85 C.
Architecturally, the 5M40ZE64A5N uses a non-volatile flash-based configuration cell (instant-on at <1 ms typical), low-power design with sub-100 uA standby current on core, and four user I/O banks that can be independently powered for mixed-voltage interfacing. The interconnect is a continuous fast-path routing matrix with consistent 5 ns tPD across the device, eliminating the placement-dependent timing variation seen in many older CPLDs.
Typical applications include I/O expansion and bus bridging for microcontrollers, address decoding and chip-select logic in DSP and processor subsystems, power-up sequencing glue logic for FPGA-based designs, JTAG chain construction for board test, and level translation between mixed-voltage peripherals. Designers often pair the 5M40ZE64A5N with a host FPGA such as a Cyclone IV/V or a microcontroller like the NXP Kinetis to off-load deterministic glue logic.
A key design consideration is that the EQFP-64 footprint is the standard MAX V package at the 40-LE density point - engineers designing with the 40-LE MAX V family can substitute higher-density members such as 5M80Z, 5M160Z, or 5M240Z on the same board to add more logic without re-laying out the PCB. Always confirm I/O count and pinout against the MAX V device handbook before scaling density.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternativas directas para 5M40ZE64A5N — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con 5M40ZE64A5N (mismo factor de forma y huella) — difiere en Package, Operating Temperature, Programming Interface, Configuration Memory, Logic Elements (LE).
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
5M40ZE64C5N
✅ Sustitución directa✓ En stock
$4.85 / unidad
Ver hoja de datos →5M80ZE64A5N
✅ Sustitución directa✓ En stock
$3.05 / unidad
Ver hoja de datos →5M160ZE64A5N
✅ Sustitución directa✓ En stock
$6.2 / unidad
Ver hoja de datos →5M160ZE64I5N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$4.13 / unidad
Ver hoja de datos →5M160ZE64C5N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$4.95 / unidad
Ver hoja de datos →5M40ZE64A5N Valores máximos y características eléctricas
| Series | MAX V |
| Device Family | MAX V (5M40Z) |
| Logic Elements (LE) | 40 |
| Logic Array Blocks (LAB) | 2 (20 LEs each) |
| Maximum User I/O | 30 |
| User Flash Memory | 4 Kbit |
| Pin-to-Pin Delay (tPD) | 5 ns (commercial speed grade) |
| Core Voltage (VCCINT) | 1.8 V |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V (4 banks) |
| Rango de temperatura de funcionamiento | 0 C to +85 C (commercial) |
| Encapsulado | EQFP-64 (E64, 10x10 mm, 0.5 mm pitch) |
| Tipo de montaje | Surface Mount |
| JTAG Support | IEEE 1149.1 boundary-scan |
| Configuration Method | On-chip non-volatile flash (instant-on) |
| Estado RoHS | Compliant (Pb-free) |
| Nivel MSL | 3 (168 hours) |
Guía de configuración de pines de 5M40ZE64A5N eqfp-64 (e64, 10x10 mm, 0.5 mm pitch)
Configuración de pines para 5M40ZE64A5N (encapsulado eqfp-64 (e64, 10x10 mm, 0.5 mm pitch)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para 5M40ZE64A5N.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
5M40ZE64A5N es adecuado para 6 aplicacións: I/O Expansion and Bus Bridging for Microcontrollers, Address Decoding and Chip-Select Generation, Power-Up Sequencing and Reset Distribution, JTAG Chain Construction and Board Test, Level Translation Between Mixed-Voltage Peripherals, Glue Logic for Industrial Control Systems.
I/O Expansion and Bus Bridging for Microcontrollers
The 5M40ZE64A5N's 40 Logic Elements and 30 user I/Os in EQFP-64 make it a low-cost glue-logic partner for microcontrollers that lack enough pins or dedicated peripheral channels. The four independently powered I/O banks let the CPLD bridge between a 3.3 V ARM Cortex-M4 host and 1.8 V or 2.5 V peripherals (sensors, FPGAs, displays) without external level shifters, while the on-chip flash enables instant-on configuration at <1 ms typical. The 5 ns pin-to-pin delay is fast enough for address decoding, register mapping, and interrupt steering in real-time embedded systems. Designers typically pair the 5M40Z with a host MCU such as NXP Kinetis or STM32, and reuse the same PCB footprint when scaling to 5M80Z or 5M160Z for higher logic demands.
Recomendado
Address Decoding and Chip-Select Generation
The 5M40ZE64A5N excels at generating deterministic chip-select and address-decode logic for DSPs, memory banks, and peripheral devices in processor subsystems. Its 5 ns tPD across the device guarantees consistent timing that does not depend on placement, removing the variation engineers must budget for in larger FPGAs. With four I/O banks, the CPLD can interface with a 3.3 V processor bus while driving 5 V-tolerant inputs on legacy peripherals or 1.8 V SDRAM. The non-volatile configuration eliminates the need for an external boot PROM, reducing BOM cost and board area. Typical use cases include generating NAND/CE for external flash, decoding GPIO expansion addresses, and producing clock-enable signals.
Recomendado
Power-Up Sequencing and Reset Distribution
The 5M40ZE64A5N is widely used as a power-up sequencer for FPGA-based designs, where multiple voltage rails (3.3 V, 2.5 V, 1.8 V, 1.2 V) must come up in a strict order to prevent latch-up or in-rush damage. Its instant-on flash-based configuration is ready within 1 ms of VCCINT ramp, allowing the CPLD to drive enable signals to downstream DC-DC converters well before the host FPGA begins configuration. The four I/O banks can each source or sink signals at different voltages, so one CPLD can manage sequencing for an entire board. Engineers pair it with sequencing supervisor ICs and dedicated voltage regulators to build a robust power-rail control subsystem with minimal firmware overhead.
Recomendado
JTAG Chain Construction and Board Test
The 5M40ZE64A5N's built-in IEEE 1149.1 boundary-scan interface lets it sit in a JTAG chain as a buffer, multiplexer, or chain-steering element, enabling board-level interconnect testing on densely populated PCBs. With four JTAG-capable I/O banks, the CPLD can route TDI/TDO between a host boundary-scan controller and devices operating at different voltages, isolating chains by voltage domain. Its 40 LEs are sufficient to implement simple TDO steering or chain-fail isolation logic. Designers leverage the CPLD in production test fixtures to reduce ATE programming time and in field-programmable JTAG topology where chain membership changes with board configuration.
Recomendado
Level Translation Between Mixed-Voltage Peripherals
The 5M40ZE64A5N provides flexible bidirectional level translation between subsystems operating at 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V, with each of its four I/O banks configurable to a different VCCIO. This eliminates the need for discrete voltage-level translator ICs and the associated BOM cost. The 5 ns tPD easily meets timing requirements for I2C, SPI, UART, and parallel bus bridging at moderate clock rates. Its 30 user I/Os can be partitioned across voltage domains, allowing a single device to act as a multi-channel translator. This makes the 5M40Z ideal for prototype boards that aggregate sensors, displays, and legacy peripherals operating at multiple voltages.
Recomendado
Glue Logic for Industrial Control Systems
In industrial automation and motor-control subsystems, the 5M40ZE64A5N serves as deterministic glue logic between microcontrollers, gate drivers, sensor interfaces, and communication transceivers. Its commercial 0 C to +85 C temperature range covers most factory-floor enclosures, and the rugged EQFP-64 surface-mount package withstands industrial shock and vibration. The CPLD can debounce switch inputs, generate PWM enable signals, multiplex SPI buses to multiple sensors, and produce precise fault-interrupt pulses to the host MCU. The non-volatile instant-on configuration eliminates the boot-time vulnerability of SRAM-based alternatives, which is critical in safety-sensitive industrial systems.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para 5M40ZE64A5N — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | 5M40ZE64C5N | 5M80ZE64A5N | 5M160ZE64A5N | 5M160ZE64I5N | 5M160ZE64C5N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | EQFP-64 (E64, 10x10 mm) | EQFP-64 (E64, 10x10 mm) - same | EQFP-64 (E64, 10x10 mm) - same | EQFP-64 (E64, 10x10 mm) - same | EQFP-64 (E64, 10x10 mm) - same | EQFP-64 (E64, 10x10 mm) - same |
| Logic Elements (LE) | 40 | 40 (same) | 80 (+100%) | 160 (+300%) | 160 (+300%) | 160 (+300%) |
| Maximum User I/O | 30 | 30 (same) | 34 (+13%) | 52 (+73%) | 52 (+73%) | 52 (+73%) |
| Pin-to-Pin Delay (tPD) | 5 ns (A speed grade) | ~3.5 ns (C speed grade, faster) | 5 ns (A speed grade) | 5 ns (A speed grade) | 5 ns (I speed grade, industrial) | ~3.5 ns (C speed grade) |
| Operating Temperature | 0 C to +85 C (commercial) | 0 C to +85 C (commercial) | 0 C to +85 C (commercial) | 0 C to +85 C (commercial) | -40 C to +100 C (industrial) | 0 C to +85 C (commercial) |
| Core Voltage (VCCINT) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| User Flash Memory | 4 Kbit | 4 Kbit | 8 Kbit | 8 Kbit | 8 Kbit | 8 Kbit |
| Typical Unit Price (qty-100, USD) | 2.74 | 3.10 (faster grade, ~+13%) | 3.85 (+40%) | 5.20 (+90%) | 6.40 (+134%, industrial) | 5.85 (+114%) |
Diferenciadores clave
- Lowest-density MAX V option with full EQFP-64 footprint compatibility (frente a 5M80ZE64A5N)
- Same-package upgrade path to higher densities without PCB rework (frente a 5M160ZE64A5N)
- Instant-on non-volatile flash configuration (frente a SRAM-based small FPGAs)
Notas de diseño
Estimated: power-supply design for the 5M40ZE64A5N requires a stable 1.8 V source for VCCINT and a separate VCCIO rail for each of the four I/O banks (1.2 V to 3.3 V). The MAX V datasheet specifies that core current at 40 MHz is roughly 10-15 mA active and <100 uA standby, so a small LDO such as a 200 mA LM1117-1.8 is sufficient. Place 100 nF X7R decoupling within 5 mm of every VCCINT/VCCIO pin pair. Power-up ramp should be monotonic; allow at least 1 ms after VCCINT stabilizes for internal flash initialization before any I/O toggles (per Altera MAX V handbook).
The EQFP-64 package is 10x10 mm with a 0.5 mm pitch and a 6.4x6.4 mm exposed pad (EPAD) that MUST be soldered to a continuous copper pour on the top layer. The EPAD is the primary heat-dissipation path for the CPLD; without it, junction temperature can rise 30-40 C under typical switching loads. The exposed pad should connect to a clean GND plane and use a 4x4 array of thermal vias (0.3 mm drill, 0.5 mm pitch) to a bottom-layer GND pour. Keep high-speed traces away from the EPAD area to maintain signal integrity on adjacent I/O banks.
Two common pitfalls with the 5M40ZE64A5N: (1) floating unused I/O pins - per Altera's recommendation, configure unused I/Os as outputs driving low or as inputs with internal weak pull-up enabled to prevent shoot-through current; do not leave them floating in the pin planner. (2) Mixing JTAG with multi-voltage I/O - the JTAG pins (TDI, TDO, TMS, TCK) reside in Bank 1 and follow Bank 1's VCCIO. If you operate JTAG at 1.8 V for a 1.8 V host, ensure Bank 1 VCCIO matches the JTAG voltage, otherwise boundary-scan operation will fail. Reference the MAX V Device Handbook pinout tables before finalizing the bank assignments.
Información de cumplimiento
RoHS compliant and Pb-free per Altera/Intel product page. Not AEC-Q100 qualified - select I-temp or A-temp MAX V variants (e.g., 5M40ZE64I5N) for automotive applications.