A3PE3000L-1FG484 - ProASIC3L Flash FPGA 3M Gates 484-BGA | Microchip
N.º de pieza: A3PE3000L-1FG484 ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $344.43 | $344,43 |
| 10 | $327.21 | $3.272,10 |
| 100 | $310.85 | $31.085,00 |
| 500 | $295.31 | $147.655,00 |
| 1.000 | $280.54 | $280.540,00 |
A3PE3000L-1FG484 Descripción general
A field-programmable gate array (FPGA) is a semiconductor device containing a matrix of configurable logic blocks (CLBs) interconnected by programmable fabric, allowing designers to implement custom digital circuits after manufacturing. Within the FPGA hierarchy, the ProASIC3L family sits in Microchip (formerly Actel/Microsemi) flash-based FPGA portfolio, distinguished from SRAM FPGAs by its non-volatile flash configuration cells that eliminate external boot ROMs and provide instant-on operation.
Key features of the A3PE3000L include Flash*Freeze technology for near-zero static power mode, a 1.2 V to 1.5 V core voltage, live reprogrammability, single-chip operation without external configuration devices, and secure flash programming that resists bitstream extraction. Embedded SRAM blocks and multiple PLLs support high-performance designs, while 1 mm pitch ball-out simplifies PCB routing relative to finer-pitch substrates.
Architecturally, the ProASIC3L fabric uses Versatile routing with an advanced 6-layer metal flash CMOS process. Logic resources total 75,264 equivalent cells, and dedicated block RAM totals up to 516 Kbits. The -1 speed grade denotes the slowest commercial timing bin of the family, trading maximum frequency for lower cost and power.
Typical applications include industrial automation controllers, portable battery-powered instruments, communications line cards, and space-constrained embedded systems where instant-on, low static power, and single-chip integration matter.
Design consideration: because this is a BGA package, verify ball-map routing feasibility and consider the -1 speed grade limits when targeting 100+ MHz clock domains.
This page synthesizes distributor pricing, drop-in alternatives, design notes, and FAQ content not found in the manufacturer datasheet alone.
Alternativas directas para A3PE3000L-1FG484 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con A3PE3000L-1FG484 (mismo factor de forma y huella) — difiere en Family, System Gates, Package, RoHS Status, Technology.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
A3PE3000L-1FG484I
✅ Sustitución directa✓ En stock
$89.9 / unidad
Ver hoja de datos →A3PE3000L-1FG484M
✅ Sustitución directa✓ En stock
Consulte el precio
Ver hoja de datos →A3PE3000L-FG484
✅ Sustitución directa✓ En stock
$112 / unidad
Ver hoja de datos →A3PE3000L-1FGG484I
✅ Sustitución directa✓ En stock
$104.5 / unidad
Ver hoja de datos →A3PE3000-1FGG484I
✅ Sustitución directa✓ En stock
$1336.6 / unidad
Ver hoja de datos →A3PE3000L-1FG484 Valores máximos y características eléctricas
| Family | ProASIC3L (Flash FPGA) |
| System Gates | 3000000 |
| Logic Cells / CLBs | 75264 |
| User I/O | 341 |
| Embedded Memory | 516096 bits |
| Core Voltage | 1.2 V to 1.5 V |
| Speed Grade | -1 |
| Encapsulado | 484-BGA (FBGA), 23 x 23 mm, 1.0 mm pitch |
| Tipo de montaje | Surface Mount |
| Configuration Technology | Flash (non-volatile, single-chip) |
| Special Features | Flash*Freeze technology, live reprogrammability |
| Estado RoHS | Non-Compliant (standard grade; see -FGG484 / M / I variants for compliant options) |
| Package Height | 2.23 mm |
Guía de configuración de pines de A3PE3000L-1FG484 2.23 mm
Configuración de pines para A3PE3000L-1FG484 (encapsulado 2.23 mm). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para A3PE3000L-1FG484.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
A3PE3000L-1FG484 es adecuado para 6 aplicacións: Industrial Automation Controllers, Battery-Powered Portable Instruments, Communications Line Cards, Medical Diagnostic Equipment, Aerospace and Defense Embedded Systems, Security and Surveillance Systems.
Industrial Automation Controllers
The A3PE3000L-1FG484 provides 75,264 logic cells and 341 user I/Os, enough density to integrate protocol bridges, sequencers, and I/O expansion glue logic that would otherwise require multiple ASSPs. Its non-volatile flash configuration gives instant-on behavior critical for factory equipment that must be ready within milliseconds of power application, and the 1.2 V to 1.5 V core reduces static power versus SRAM FPGAs. Flash*Freeze technology lets controllers idle at near-zero power between production cycles. Use the industrial-grade A3PE3000L-1FG484I for extended temperature panels; both share the 484-ball footprint for one PCB design.
Recomendado
Battery-Powered Portable Instruments
For handheld and battery-operated test instruments, the ProASIC3L's flash fabric eliminates SRAM-FPGA boot current and external configuration PROM, cutting both board area and standby energy. The 1.2 V to 1.5 V core plus Flash*Freeze mode drops static consumption to a near-zero state while preserving SRAM contents, letting the instrument sleep between measurements and resume without reconfiguration. The -1 speed grade trades maximum clock frequency for lower cost and power, which is usually acceptable for measurement sequencing, display driving, and sensor-frontend logic running below 100 MHz.
Recomendado
Communications Line Cards
With 516,096 bits of embedded SRAM and up to 341 I/O, the A3PE3000L-1FG484 implements FIFOs, line-code converters, and backplane interface glue on telecom and datacom line cards. The single-chip flash configuration removes the boot ROM from the power-on path, simplifying hot-swap and brown-out behavior on carrier boards. Live reprogrammability permits field updates of framing logic through the JTAG port without desoldering. The 1.0 mm ball pitch FBGA-484 simplifies escape routing on the dense 23 x 23 mm footprint compared with finer-pitch alternatives.
Recomendado
Medical Diagnostic Equipment
Medical imaging front ends and diagnostic analyzers benefit from the A3PE3000L's deterministic instant-on flash configuration and low-noise single-chip operation, avoiding configuration glitches during patient-connected measurement cycles. The 75,264-cell fabric accommodates ADC framing, filter accelerators, and sensor-interface state machines, while 341 I/Os interface multi-channel sensor arrays. Flash*Freeze supports aggressive duty-cycling between acquisition windows, extending battery life in portable monitors. Choose the RoHS-compliant A3PE3000L-1FG484M variant for medical builds requiring lead-free BOM compliance.
Recomendado
Aerospace and Defense Embedded Systems
Microchip flash FPGAs (Actel/Microsemi heritage) are widely used in aerospace payloads where configuration flip immunity and single-chip integration are valued. The A3PE3000L's non-volatile flash cells are inherently more robust against configuration upset than SRAM fabric, and the absence of a boot ROM removes a radiation- and reliability-sensitive component. The 484-ball FBGA supports dense, thermally efficient mounting. Note that space-grade screening is not offered on this commercial order code; qualify accordingly or consult Microchip's radiation-tolerant portfolio for mission-critical programs.
Recomendado
Security and Surveillance Systems
Video surveillance nodes use the A3PE3000L-1FG484 for camera-interface bridging, image-pipeline preprocessing, and secure key storage logic. Flash-based configuration keeps the design resident through power interruptions common in outdoor installations, and 516 Kbits of block RAM supports line buffers between the sensor and compression engine. The -1 speed grade suits pipeline stages below 100 MHz, while Flash*Freeze cuts idle power during no-motion intervals. The 341 available I/Os comfortably connect multiple sensor banks, alarms, and network PHY interfaces on one chip.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para A3PE3000L-1FG484 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | A3PE3000L-1FG484I | A3PE3000L-1FG484M | A3PE3000L-FG484 | A3PE3000L-1FGG484I | A3PE3000-1FGG484I |
|---|---|---|---|---|---|---|
| Package | 484-BGA (FG484), 23 x 23 mm | 484-BGA (FG484) - same | 484-BGA (FG484) - same | 484-BGA (FG484) - same | 484-BGA (FGG484) - same 484-ball class | 484-BGA (FGG484) - same 484-ball class |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Family | ProASIC3L (low power) | ProASIC3L | ProASIC3L | ProASIC3L | ProASIC3L | ProASIC3E |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| Logic Cells | 75,264 | 75,264 | 75,264 | 75,264 | 75,264 | 75,264 |
| User I/O | 341 | 341 | 341 | 341 | 341 | 341 |
| Speed Grade | -1 | -1 | -1 | standard (slower than -1) | -1 | -1 |
Diferenciadores clave
- Low-power ProASIC3L fabric with Flash*Freeze technology (frente a A3PE3000-1FGG484I)
- RoHS-compliant packaging option on the same die (frente a A3PE3000L-1FG484M)
- Faster -1 timing bin availability (frente a A3PE3000L-FG484)
Notas de diseño
The FG484 package is a 23 x 23 mm FBGA with 1.0 mm ball pitch and 2.23 mm height. Plan fan-out for 341 used balls: a 1.0 mm pitch BGA typically escapes cleanly with via-in-pad or dog-bone fan-out on a 6+ layer board. Reserve keep-out zones under the die area if back-side components are planned, and follow the datasheet's recommended land pattern for ball collapse during reflow. Confirm ball-map assignment in the ProASIC3L datasheet package chapter before final routing.
ProASIC3L requires a 1.2 V to 1.5 V core rail plus I/O bank rails per the family datasheet. Unlike SRAM FPGAs, no configuration supply or external PROM power budget is needed, simplifying the power tree. To exploit Flash*Freeze, route the dedicated Flash*Freeze pin to a controllable GPIO or supervisor and ensure clock domains are quiesced before asserting it, per Microchip's Flash*Freeze application guidance. Estimate core current from Libero power analysis rather than worst-case tables to size the regulator.
Ordering-code traps: the base A3PE3000L-1FG484 is RoHS non-compliant per cross-reference data - use -1FG484M or FGG variants for lead-free builds. The -1 suffix is a speed grade, not a temperature range; industrial temperature requires the I suffix (A3PE3000L-1FG484I). Mixing order codes on one BOM line risks receiving commercial-grade parts for an industrial build. Also verify Libero SoC licensing supports the ProASIC3L device family before committing to the platform.
Información de cumplimiento
Cross-reference comparison data (FindIC) lists A3PE3000L-1FG484 as RoHS non-compliant and leaded; RoHS-compliant variants (A3PE3000L-1FG484M, FGG packages) are available with the same footprint. Verify current certificates with Microchip for your exact order code.
