A3PE3000L-1FG484 - ProASIC3L Flash FPGA 3M Gates 484-BGA | Microchip
부품 번호: A3PE3000L-1FG484 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $344.43 | $344.43 |
| 10 | $327.21 | $3,272.10 |
| 100 | $310.85 | $31,085.00 |
| 500 | $295.31 | $147,655.00 |
| 1,000 | $280.54 | $280,540.00 |
A3PE3000L-1FG484 개요
A field-programmable gate array (FPGA) is a semiconductor device containing a matrix of configurable logic blocks (CLBs) interconnected by programmable fabric, allowing designers to implement custom digital circuits after manufacturing. Within the FPGA hierarchy, the ProASIC3L family sits in Microchip (formerly Actel/Microsemi) flash-based FPGA portfolio, distinguished from SRAM FPGAs by its non-volatile flash configuration cells that eliminate external boot ROMs and provide instant-on operation.
Key features of the A3PE3000L include Flash*Freeze technology for near-zero static power mode, a 1.2 V to 1.5 V core voltage, live reprogrammability, single-chip operation without external configuration devices, and secure flash programming that resists bitstream extraction. Embedded SRAM blocks and multiple PLLs support high-performance designs, while 1 mm pitch ball-out simplifies PCB routing relative to finer-pitch substrates.
Architecturally, the ProASIC3L fabric uses Versatile routing with an advanced 6-layer metal flash CMOS process. Logic resources total 75,264 equivalent cells, and dedicated block RAM totals up to 516 Kbits. The -1 speed grade denotes the slowest commercial timing bin of the family, trading maximum frequency for lower cost and power.
Typical applications include industrial automation controllers, portable battery-powered instruments, communications line cards, and space-constrained embedded systems where instant-on, low static power, and single-chip integration matter.
Design consideration: because this is a BGA package, verify ball-map routing feasibility and consider the -1 speed grade limits when targeting 100+ MHz clock domains.
This page synthesizes distributor pricing, drop-in alternatives, design notes, and FAQ content not found in the manufacturer datasheet alone.
드롭인 대체품: A3PE3000L-1FG484 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3PE3000L-1FG484 (동일 폼 팩터 및 풋프린트) — 차이점: Family, System Gates, Package, RoHS Status, Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3PE3000L-1FG484I
✅ 드롭인✓ 재고 있음
$89.9 / 개
데이터시트 보기 →A3PE3000L-1FG484M
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →A3PE3000L-FG484
✅ 드롭인✓ 재고 있음
$112 / 개
데이터시트 보기 →A3PE3000L-1FGG484I
✅ 드롭인✓ 재고 있음
$104.5 / 개
데이터시트 보기 →A3PE3000-1FGG484I
✅ 드롭인✓ 재고 있음
$1336.6 / 개
데이터시트 보기 →A3PE3000L-1FG484 최대 정격 & 전기적 특성
| Family | ProASIC3L (Flash FPGA) |
| System Gates | 3000000 |
| Logic Cells / CLBs | 75264 |
| User I/O | 341 |
| Embedded Memory | 516096 bits |
| Core Voltage | 1.2 V to 1.5 V |
| Speed Grade | -1 |
| 패키지 | 484-BGA (FBGA), 23 x 23 mm, 1.0 mm pitch |
| 실장 유형 | Surface Mount |
| Configuration Technology | Flash (non-volatile, single-chip) |
| Special Features | Flash*Freeze technology, live reprogrammability |
| RoHS 상태 | Non-Compliant (standard grade; see -FGG484 / M / I variants for compliant options) |
| Package Height | 2.23 mm |
A3PE3000L-1FG484 2.23 mm 핀 구성 가이드
A3PE3000L-1FG484(2.23 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A3PE3000L-1FG484.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A3PE3000L-1FG484 적합 용도: 6 애플리케이션s: Industrial Automation Controllers, Battery-Powered Portable Instruments, Communications Line Cards, Medical Diagnostic Equipment, Aerospace and Defense Embedded Systems, Security and Surveillance Systems.
Industrial Automation Controllers
The A3PE3000L-1FG484 provides 75,264 logic cells and 341 user I/Os, enough density to integrate protocol bridges, sequencers, and I/O expansion glue logic that would otherwise require multiple ASSPs. Its non-volatile flash configuration gives instant-on behavior critical for factory equipment that must be ready within milliseconds of power application, and the 1.2 V to 1.5 V core reduces static power versus SRAM FPGAs. Flash*Freeze technology lets controllers idle at near-zero power between production cycles. Use the industrial-grade A3PE3000L-1FG484I for extended temperature panels; both share the 484-ball footprint for one PCB design.
추천
Battery-Powered Portable Instruments
For handheld and battery-operated test instruments, the ProASIC3L's flash fabric eliminates SRAM-FPGA boot current and external configuration PROM, cutting both board area and standby energy. The 1.2 V to 1.5 V core plus Flash*Freeze mode drops static consumption to a near-zero state while preserving SRAM contents, letting the instrument sleep between measurements and resume without reconfiguration. The -1 speed grade trades maximum clock frequency for lower cost and power, which is usually acceptable for measurement sequencing, display driving, and sensor-frontend logic running below 100 MHz.
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Communications Line Cards
With 516,096 bits of embedded SRAM and up to 341 I/O, the A3PE3000L-1FG484 implements FIFOs, line-code converters, and backplane interface glue on telecom and datacom line cards. The single-chip flash configuration removes the boot ROM from the power-on path, simplifying hot-swap and brown-out behavior on carrier boards. Live reprogrammability permits field updates of framing logic through the JTAG port without desoldering. The 1.0 mm ball pitch FBGA-484 simplifies escape routing on the dense 23 x 23 mm footprint compared with finer-pitch alternatives.
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Medical Diagnostic Equipment
Medical imaging front ends and diagnostic analyzers benefit from the A3PE3000L's deterministic instant-on flash configuration and low-noise single-chip operation, avoiding configuration glitches during patient-connected measurement cycles. The 75,264-cell fabric accommodates ADC framing, filter accelerators, and sensor-interface state machines, while 341 I/Os interface multi-channel sensor arrays. Flash*Freeze supports aggressive duty-cycling between acquisition windows, extending battery life in portable monitors. Choose the RoHS-compliant A3PE3000L-1FG484M variant for medical builds requiring lead-free BOM compliance.
추천
Aerospace and Defense Embedded Systems
Microchip flash FPGAs (Actel/Microsemi heritage) are widely used in aerospace payloads where configuration flip immunity and single-chip integration are valued. The A3PE3000L's non-volatile flash cells are inherently more robust against configuration upset than SRAM fabric, and the absence of a boot ROM removes a radiation- and reliability-sensitive component. The 484-ball FBGA supports dense, thermally efficient mounting. Note that space-grade screening is not offered on this commercial order code; qualify accordingly or consult Microchip's radiation-tolerant portfolio for mission-critical programs.
추천
Security and Surveillance Systems
Video surveillance nodes use the A3PE3000L-1FG484 for camera-interface bridging, image-pipeline preprocessing, and secure key storage logic. Flash-based configuration keeps the design resident through power interruptions common in outdoor installations, and 516 Kbits of block RAM supports line buffers between the sensor and compression engine. The -1 speed grade suits pipeline stages below 100 MHz, while Flash*Freeze cuts idle power during no-motion intervals. The 341 available I/Os comfortably connect multiple sensor banks, alarms, and network PHY interfaces on one chip.
추천
추천 제품 요약
엔지니어링 참조 데이터: A3PE3000L-1FG484 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3PE3000L-1FG484I | A3PE3000L-1FG484M | A3PE3000L-FG484 | A3PE3000L-1FGG484I | A3PE3000-1FGG484I |
|---|---|---|---|---|---|---|
| Package | 484-BGA (FG484), 23 x 23 mm | 484-BGA (FG484) - same | 484-BGA (FG484) - same | 484-BGA (FG484) - same | 484-BGA (FGG484) - same 484-ball class | 484-BGA (FGG484) - same 484-ball class |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Family | ProASIC3L (low power) | ProASIC3L | ProASIC3L | ProASIC3L | ProASIC3L | ProASIC3E |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| Logic Cells | 75,264 | 75,264 | 75,264 | 75,264 | 75,264 | 75,264 |
| User I/O | 341 | 341 | 341 | 341 | 341 | 341 |
| Speed Grade | -1 | -1 | -1 | standard (slower than -1) | -1 | -1 |
주요 차별점
- Low-power ProASIC3L fabric with Flash*Freeze technology (vs A3PE3000-1FGG484I)
- RoHS-compliant packaging option on the same die (vs A3PE3000L-1FG484M)
- Faster -1 timing bin availability (vs A3PE3000L-FG484)
설계 노트
The FG484 package is a 23 x 23 mm FBGA with 1.0 mm ball pitch and 2.23 mm height. Plan fan-out for 341 used balls: a 1.0 mm pitch BGA typically escapes cleanly with via-in-pad or dog-bone fan-out on a 6+ layer board. Reserve keep-out zones under the die area if back-side components are planned, and follow the datasheet's recommended land pattern for ball collapse during reflow. Confirm ball-map assignment in the ProASIC3L datasheet package chapter before final routing.
ProASIC3L requires a 1.2 V to 1.5 V core rail plus I/O bank rails per the family datasheet. Unlike SRAM FPGAs, no configuration supply or external PROM power budget is needed, simplifying the power tree. To exploit Flash*Freeze, route the dedicated Flash*Freeze pin to a controllable GPIO or supervisor and ensure clock domains are quiesced before asserting it, per Microchip's Flash*Freeze application guidance. Estimate core current from Libero power analysis rather than worst-case tables to size the regulator.
Ordering-code traps: the base A3PE3000L-1FG484 is RoHS non-compliant per cross-reference data - use -1FG484M or FGG variants for lead-free builds. The -1 suffix is a speed grade, not a temperature range; industrial temperature requires the I suffix (A3PE3000L-1FG484I). Mixing order codes on one BOM line risks receiving commercial-grade parts for an industrial build. Also verify Libero SoC licensing supports the ProASIC3L device family before committing to the platform.
규정 준수 정보
Cross-reference comparison data (FindIC) lists A3PE3000L-1FG484 as RoHS non-compliant and leaded; RoHS-compliant variants (A3PE3000L-1FG484M, FGG packages) are available with the same footprint. Verify current certificates with Microchip for your exact order code.
